| Patents for C09J 177 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers (1,629) |
|---|
| 12/04/2007 | CA2393742C Mixture of grafted polyamide-block and flexible polyolefin copolymers |
| 11/28/2007 | EP1859000A1 Cross-linkable hot-melt adhesive blend |
| 11/20/2007 | US7297756 Sealing cavities in soil, rock formations, building construction and walls by injecting a polyamide reaction product of dimeric or polymeric fatty acid, C4-C12 dicarboxylic acid, and diamine(s) and a long chain arylalkylamine or pentaerythrityl tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate) |
| 11/08/2007 | US20070260014 Cross-linkable base layer for interlinings applied in a double-dot method |
| 10/30/2007 | CA2283335C Adhesive systems for a one- or multi step perfect binding process and process for the perfect binding of printed articles |
| 10/24/2007 | CN101058706A Mixed serum used for lining cloth and plus material hot melt bonding |
| 10/17/2007 | CN101054774A Method of producing composite robe lining |
| 10/10/2007 | CN100341967C Smoke suppressant hot melt adhesive composition |
| 10/03/2007 | EP1840180A2 Adhesive composition for alginate impression material |
| 09/26/2007 | CN101041766A Antistatic hot-melting glue and coating method thereof |
| 09/05/2007 | CN101031590A Method and device for controlling polymerization |
| 08/22/2007 | EP1819790A1 Teak deck caulking |
| 08/22/2007 | EP1286833B1 Method for producing document cards comprising several layers and document cards produced therewith |
| 08/22/2007 | CN101020807A Epoxy resin adhesive for use in water |
| 08/01/2007 | EP1297054B1 Use of melt-adhesives for sealing off rocks or building materials |
| 07/26/2007 | US20070173588 Mineral fibre sizing composition containing a carboxylic polyacid and a polyamine, preparation method thereof and resulting products |
| 07/19/2007 | DE102006002125A1 Reaktive Schmelzklebstoffe enthaltende Hybridbauteile Reactive hot melt adhesives containing hybrid components |
| 07/17/2007 | US7244485 endless flexible seamed belt having a puzzle cut seam, wherein the seam comprises an adhesive comprising a polyamide and optionally, an electrically conductive filler |
| 07/11/2007 | CN1325595C Adhesive film, lead frame with adhesive film, and semiconductor device using same |
| 07/04/2007 | CN1990810A High-melting point polyamide thermosol composition and method of making the same |
| 06/19/2007 | CA2093586C Biphasic fusible interfacing and process for manufacturing thereof |
| 06/06/2007 | EP1537185B1 Smoke suppressant hot melt adhesive composition |
| 06/06/2007 | CN1976976A Low-melting-point copolyamides and their use as hot-melt adhesives |
| 06/06/2007 | CN1974020A Mechanically shearing process of preparing one-dimensional nanometer material |
| 05/31/2007 | US20070123653 Polymerizable compositions in non-flowable forms |
| 05/31/2007 | DE102005055297A1 Metall-Kunststoff-Verbundkörper Metal-plastic composite body |
| 05/30/2007 | CN1318528C Varnish containing polyamide resin and use thereof |
| 05/16/2007 | CN1962784A Hot-melt adhesive and process for preparing same |
| 05/09/2007 | CN1958708A Finger pressure type softness sealant |
| 05/09/2007 | CN1314772C Polyamide hot melt sol preparation method |
| 05/03/2007 | DE102005050632A1 Adhesive composition, useful for splicing tape, comprises a matrix from a reaction resin and/or fusion adhesive polymer; a mobile polymer electrolytic component and a stable salt with halogenated anion |
| 05/02/2007 | EP1778742A1 Bonding compositions |
| 04/18/2007 | CN1311043C Thermal smelting adhesive based on polyamide block graft copolymer |
| 04/18/2007 | CN1311042C Thermosetting adhesive composition and adhesive band used said composition for electronic member |
| 04/17/2007 | US7205047 Smoke suppressant hot melt adhesive composition |
| 04/11/2007 | CN1309796C Production process of waterproof leakage-repairing adhesive |
| 04/11/2007 | CN1309771C Solid adhesive and liquid material composition for producing the solid adhesive |
| 04/05/2007 | US20070077422 Single-coated adhesive tape |
| 03/15/2007 | WO2007030791A1 Polyester-amide based hot melt adhesives |
| 03/14/2007 | CN1927983A Waste polyester modified polyamide hot melt adhesive and preparation method thereof |
| 03/08/2007 | US20070055044 Cross-linkable base layer for interlinings applied in a double-dot method |
| 03/07/2007 | EP1311584B1 Moulded parts made of polyamides which are free of dimeric acids |
| 02/07/2007 | CN1908107A Adhesive and sealing layers for electrophoretic displays |
| 02/07/2007 | CN1298784C Thermoplastic resin composition for IC card |
| 02/01/2007 | US20070026227 Adhesive aid composition |
| 01/31/2007 | CN1906263A Method of bonding two materials with a crosslinkable adhesive |
| 01/24/2007 | CN1296979C Adhesive tape for semiconductor device |
| 01/16/2007 | US7163996 Polyamides |
| 12/27/2006 | CN1884419A Use of decamethylene diamine in preparing copolyamide hot sol |
| 12/20/2006 | CN1882668A Single-coated adhesive tape |
| 12/13/2006 | CN1878671A Multi-layer composite comprising an evoh layer and a protective layer |
| 12/13/2006 | CN1876747A Formaldehyde-free aqueous adhesive and preparing method thereof |
| 12/12/2006 | US7147920 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity |
| 12/05/2006 | US7144956 adhesives and seals comprising blends of acrylic ester homopolymers and polymeric matrix selected from polyamides, polyacrylamides, polyimides, polyureaurethanes or polyamideester copolymers |
| 11/30/2006 | US20060269701 Metal-polyamide/polyethylene-metal laminate |
| 11/15/2006 | CN1863887A Cross-linkable base layer for interlinings applied in a double-dot method |
| 11/15/2006 | CN1863836A Cross-linkable base layer for interlinings applied in a double-dot method |
| 11/01/2006 | CN1856558A Adhesive aid composition |
| 10/10/2006 | US7119144 Curing an acetoacetate terminated polyester or polyesteramide with an alpha, beta -unsaturated multi-carboxylic acid ester; one step process to produce adhesive; nontoxic, nonabsorbed through the skin, nonvolatile low molecular weight materials |
| 10/05/2006 | WO2006102975A1 Low-melting-point copolyamides and their use as hot-melt adhesives |
| 10/05/2006 | US20060222805 Imageable seamed belts having polyamide adhesive between interlocking seaming members |
| 09/13/2006 | EP1699891A1 Thermoplastic adhesive |
| 08/30/2006 | CN1272400C 钢桥面粘接剂 Steel deck adhesive |
| 08/29/2006 | US7098293 Polyesteramide copolymer |
| 08/24/2006 | DE102005006335A1 Vernetzbare Schmelzklebermischung und Verfahren zur Beschichtung und/oder Laminierung von Substraten Crosslinkable hot-melt adhesive mixture and method for coating and / or lamination of substrates |
| 08/23/2006 | CN1822252A Temperature pressure binding permanent magnet material and its preparing method |
| 08/17/2006 | WO2006084887A1 Cross-linkable hot-melt adhesive blend |
| 08/10/2006 | DE102005005493A1 Verfahren zur Herstellung einer wässrigen Polymerdispersion A process for preparing an aqueous polymer dispersion |
| 08/02/2006 | EP1685205A2 Single-coated adhesive tape |
| 08/02/2006 | EP1685204A1 Method for gluing two materials using a cross-linking adhesive |
| 08/02/2006 | CN1812881A A metal-polyamide/polyethylene-metal laminate |
| 08/02/2006 | CN1267467C MIxture of grafted polyamide-block and flexible polyolefin copolymers |
| 08/01/2006 | CA2209495C Biologically degradable polymers, processes for manufacturing the same and the use thereof for producing biodegradable moulded articles |
| 07/26/2006 | CN1808648A Preparation method of rare-earth bonding magnet |
| 07/19/2006 | CN1264894C Low molecular polyamide modified hot melt adhesive and method for preparation |
| 07/12/2006 | EP1678271A1 Cross-linkable base layer for interlinings applied in a double-dot method |
| 07/12/2006 | EP1678233A1 Cross-linkable base layer for interlinings applied in a double-dot method |
| 07/05/2006 | CN1798820A Activatable material for sealing,Baffling or reinforcing and method of forming same |
| 06/15/2006 | WO2005118679A3 Novel adhesive composition |
| 06/14/2006 | EP1669186A1 Material for laser welding and method for laser welding |
| 06/14/2006 | EP1195410B1 Aqueous polyamide resin dispersion and process for producing the same |
| 06/07/2006 | EP1666556A1 Adhesive aid composition |
| 05/24/2006 | EP0969068B1 Adhesive resin composition and heat-shrinkable articles made by using the same |
| 05/11/2006 | US20060100323 Comprises at least one semicrystalline polymer having no ionic groups and an ionic liquid plasticizer; use in injection molding processes as a semiconductive or antistatic binder or adhesive |
| 05/10/2006 | CN1255275C Multilayer structure based on polyamide and copolyamide mixed binder |
| 05/09/2006 | US7041747 An adhesive composition includes a room-temperature polymerizable component including a phenyl-containing (meth)acrylates and a polymeric matrix present in an amount to render the composition non-flowable at temperatures of 120 degrees F.; seals; threadlocking; nuts and bolts; storage stability |
| 05/09/2006 | US7041194 Moisture activated reinforcement string and tear opening tapes for corrugated and cartonstock containers |
| 05/03/2006 | EP1651432A1 A metal-polyamide/polyethylene-metal laminate |
| 05/02/2006 | CA2342117C Ethoxylated amine-based polyether-polyamide block copolymers |
| 04/27/2006 | WO2006044970A1 Teak deck caulking |
| 04/26/2006 | CN1763146A Polyamide hot melt sol preparation method |
| 04/26/2006 | CN1253310C Thermoplastic multi-layer composites |
| 04/20/2006 | WO2006040206A1 Multi-layer composite comprising an evoh layer and a protective layer |
| 04/19/2006 | CN1252144C Adhesive of fixing matrix for microelectronic device |
| 04/13/2006 | DE102004048776A1 Mehrschichtverbund mit EVOH-Schicht und Schutzschicht Multilayer EVOH layer and protective layer |
| 04/12/2006 | CN1250665C Impact-resistant epoxy resin compositions |
| 03/23/2006 | DE10022701B4 Niedrigschmelzende Copolyamide sowie deren Verwendung als Schmelzklebemittel Low-melting copolyamides and their use as melt adhesives |
| 03/22/2006 | CN1246410C Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 03/21/2006 | CA2391752C Process for forming a mixed solvent adhesive solution |
| 03/08/2006 | CN1244608C Composition and its preparing method, method for using adhesive composition |