Patents for C09J 177 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers (1,629)
03/2006
03/01/2006CN1740255A Production process of waterproof leakage-repairing adhesive
03/01/2006CN1243493C Handcovering
02/2006
02/23/2006WO2006019650A1 Bonding compositions
02/23/2006CA2575076A1 Bonding compositions
02/16/2006US20060036008 Novel adhesive composition
02/09/2006DE102004035542A1 Zwei-Komponenten-Bindemittel Two-component binder
01/2006
01/25/2006EP1618238A2 Mineral fibre sizing composition containing a carboxylic polyacid and a polyamine, preparation method thereof and resulting products
01/25/2006CN1724579A Branched polyamides with unsaturated ends
01/04/2006CN1715356A Novel adhesive composition
12/2005
12/28/2005EP1123348B1 Impact-resistant epoxide resin compositions
12/28/2005CN1233769C Adhesive compound and its use
12/15/2005WO2005118679A2 Novel adhesive composition
11/2005
11/23/2005EP1598404A1 Retort container, and hot melt adhesive therefor
11/17/2005US20050255266 Retort container, and hot melt adhesive therefor
11/16/2005CN1696233A Adhesive film, lead frame with adhesive film, and semiconductor device using same
11/16/2005CN1227320C Weather resistant epoxy conductive adhesives
11/09/2005EP1196512B1 Adhesive composition comprising a particulate thermoplastic component
11/08/2005US6962754 Structure comprising a fluoropolymer layer and a piperazine-based tie resin
11/03/2005US20050245680 Branched polyamides comprising unsaturated ends
11/02/2005EP1591468A1 Hot melt compounds made from copolyamides and crosslinkable copolyamide-block-polyethers
11/02/2005CN1690153A Thermosetting adhesive composition and adhesive band used said composition for electronic member
10/2005
10/26/2005CN1688667A Smoke suppressant hot melt adhesive composition
10/26/2005CA2503662A1 Branched polyamides with unsaturated ends
10/18/2005US6956100 A curable blends comprising a cycloalkanone solvent, is easily desolventized during film formation, also epoxy resins; good workability, used in spin coating, screen printing, adhesive layer on printed circuits
10/13/2005US20050228165 Polyamides
10/12/2005CN1681878A Polymeric compositions containing polymers and ionic liquids
10/05/2005CN1221624C Adhesive composition comprising particle thermoplastic component
09/2005
09/28/2005CN1220746C Hot melt binding composition and viscous lining cloth using composition
09/13/2005US6943207 Smoke suppressant hot melt adhesive composition
09/07/2005CN1664964A Process for clinkering anisotropic permanent ferrite through polymer bonding and modeling
08/2005
08/04/2005WO2005052081A3 Single-coated adhesive tape
08/03/2005CN1648188A 钢桥面粘接剂 Steel deck adhesive
07/2005
07/28/2005US20050165149 Smoke suppressant hot melt adhesive composition
07/28/2005DE10361537A1 Thermoplastische Blends zur Implantierung von elektrischen Modulen in einen Kartenkörper Thermoplastic blends for implanting electrical modules in a card body
07/14/2005WO2005063908A1 Thermoplastic adhesive
07/14/2005US20050154141 Polymerizable compositions in non-flowable forms
07/13/2005CN1639282A Varnish containing polyamide resin and use thereof
07/13/2005CN1637106A Two-component water-borne adhesive
07/07/2005WO2005061640A1 Method for gluing two materials using a cross-linking adhesive
07/06/2005CN1635014A Low molecular polyamide modified hot melt adhesive and method for preparation
06/2005
06/30/2005WO2004094714A3 Mineral fibre sizing composition containing a carboxylic polyacid and a polyamine, preparation method thereof and resulting products
06/28/2005CA2129253C A process for the production of plastics containing amide groups
06/23/2005US20050137374 Two-component water-borne adhesive
06/22/2005EP1544226A2 Two-component water-borne adhesive
06/09/2005WO2005052081A2 Single-coated adhesive tape
06/09/2005CA2545562A1 Single-coated adhesive tape
06/08/2005EP1537185A1 Smoke suppressant hot melt adhesive composition
05/2005
05/25/2005EP1533330A1 Polyamides
05/19/2005DE10347665A1 Vernetzbare Basisschicht für Fixiereinlagen nach dem Doppelpunktverfahren Crosslinkable base layer for fusible after the colon procedures
05/19/2005DE10347628A1 Vernetzbare Basisschicht für Fixiereinlagen nach dem Doppelpunktverfahren Crosslinkable base layer for fusible after the colon procedures
05/18/2005CN1202195C Long carbon chain nylon hot melt glue and its synthesis method
04/2005
04/28/2005WO2004067668A8 Polyolefin and copolyamide based thermofusible adhesive composition with improved thermal behavior
04/27/2005EP1240252B1 Thermoplastic compositions comprising crystalline and amorphous polymers
04/26/2005US6884854 A thermally curable formulation containing an epoxy resin, a copolymer having glass transition temp. of -30 degree C. or lower and epoxy reactive group or reaction product with epoxy resin, a hardner, and a polyamide or polyimde or mixture
04/26/2005US6884833 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
04/21/2005WO2005035685A1 Cross-linkable base layer for interlinings applied in a double-dot method
04/21/2005WO2005035614A1 Cross-linkable base layer for interlinings applied in a double-dot method
04/20/2005EP1399519B8 Devices, compositions and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
04/07/2005WO2005030896A1 Adhesive aid composition
04/06/2005EP1520868A1 Degradable polydioxaneone-based materials
04/06/2005EP1519988A1 Polymeric compositions containing polymers and ionic liquids
04/05/2005US6875520 Mixture of grafted polyamide-block and flexible polyolefin copolymers
03/2005
03/24/2005US20050065296 Adhesive composition and adhesive film
03/23/2005CN1597826A Thermosol of polyamide and preparation process thereof
03/09/2005CN1592767A Thermoplastic resin composition for ic card
03/02/2005EP1399519B1 Devices, compositions and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents
03/02/2005CN1191316C Multi-purpose polyamide hot melt adhesive and its prepn
02/2005
02/17/2005WO2005014278A1 A metal-polyamide/polyethylene-metal laminate
02/17/2005CA2532198A1 A metal-polyamide/polyethylene-metal laminate
02/09/2005EP1504892A1 A metal-polyamide/polyethylene-metal laminate
02/02/2005EP0722445B1 Degradable polydioxaneone-based materials
02/02/2005CN1572854A Solid adhesive and liquid material composition for producing the solid adhesive
02/02/2005CN1187424C Adhesive resin compsn. and heat-shrinkable articles made by using same
01/2005
01/25/2005US6846874 Hot-melt adhesives based on polyamide-block graft copolymers
01/19/2005CN1185319C Crosslinked base layer for sandwich fixed by two-point method and sticking method
01/05/2005CN1560169A Epoxy conductive adhesives with climate adaptive
12/2004
12/08/2004EP1484376A2 Solvent adhesive
12/01/2004EP1285028B1 Polyolefin/copolyamide rf active adhesive film
11/2004
11/25/2004CA2524783A1 Activatable material for sealing, baffling or reinforcing and method of forming same
11/24/2004CN1176974C Copolymer with polyamide block using ethoxyamine as main composition and polyether block
11/17/2004EP0757824B1 Chip card
11/09/2004US6814890 Process for forming a mixed solvent adhesive solution
11/04/2004WO2004094714A2 Mineral fibre sizing composition containing a carboxylic polyacid and a polyamine, preparation method thereof and resulting products
11/04/2004CA2522642A1 Mineral fibre sizing composition containing a carboxylic polyacid and a polyamine, preparation method thereof and resulting products
11/03/2004CN1542077A Adhesive compound
10/2004
10/27/2004EP0828801B1 Bonding process
10/27/2004CN1173002C Long carbon chain nylon thermosol and its preparation method
10/20/2004CN1171964C Cross-linking bottom liner for adhesive lining cloth by double layer point coating technique
09/2004
09/15/2004EP1251756B1 Handcovering and method of manufacture
09/08/2004EP1454957A1 Thermoplastic resin composition for ic cards
09/07/2004US6787244 Poly-o-hydroxy amides that cure to form polybenoxazoles
09/02/2004US20040171764 Blend of nylin, nucleation agent and lubricant
09/02/2004US20040171763 Hot-melt adhesive composition and process for the preparation of a textile product
08/2004
08/31/2004US6784227 Crosslinking base layer for fixing interlinings according to double dot and paste process
08/25/2004CN1523651A Adhesive tape for semiconductor device
08/18/2004EP1064318B1 Thermofusible and crosslinkable polyamide and one of the methods for obtaining same and adhesive comprising same
08/18/2004CN1522287A Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents
08/18/2004CN1162496C Modified polyamide thermosol
08/18/2004CN1162495C Polyamide thermosol
08/17/2004US6777488 Aqueous polyamide resin dispersion and process for producing the same
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