Patents for C09J 177 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers (1,629) |
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03/01/2006 | CN1740255A Production process of waterproof leakage-repairing adhesive |
03/01/2006 | CN1243493C Handcovering |
02/23/2006 | WO2006019650A1 Bonding compositions |
02/23/2006 | CA2575076A1 Bonding compositions |
02/16/2006 | US20060036008 Novel adhesive composition |
02/09/2006 | DE102004035542A1 Zwei-Komponenten-Bindemittel Two-component binder |
01/25/2006 | EP1618238A2 Mineral fibre sizing composition containing a carboxylic polyacid and a polyamine, preparation method thereof and resulting products |
01/25/2006 | CN1724579A Branched polyamides with unsaturated ends |
01/04/2006 | CN1715356A Novel adhesive composition |
12/28/2005 | EP1123348B1 Impact-resistant epoxide resin compositions |
12/28/2005 | CN1233769C Adhesive compound and its use |
12/15/2005 | WO2005118679A2 Novel adhesive composition |
11/23/2005 | EP1598404A1 Retort container, and hot melt adhesive therefor |
11/17/2005 | US20050255266 Retort container, and hot melt adhesive therefor |
11/16/2005 | CN1696233A Adhesive film, lead frame with adhesive film, and semiconductor device using same |
11/16/2005 | CN1227320C Weather resistant epoxy conductive adhesives |
11/09/2005 | EP1196512B1 Adhesive composition comprising a particulate thermoplastic component |
11/08/2005 | US6962754 Structure comprising a fluoropolymer layer and a piperazine-based tie resin |
11/03/2005 | US20050245680 Branched polyamides comprising unsaturated ends |
11/02/2005 | EP1591468A1 Hot melt compounds made from copolyamides and crosslinkable copolyamide-block-polyethers |
11/02/2005 | CN1690153A Thermosetting adhesive composition and adhesive band used said composition for electronic member |
10/26/2005 | CN1688667A Smoke suppressant hot melt adhesive composition |
10/26/2005 | CA2503662A1 Branched polyamides with unsaturated ends |
10/18/2005 | US6956100 A curable blends comprising a cycloalkanone solvent, is easily desolventized during film formation, also epoxy resins; good workability, used in spin coating, screen printing, adhesive layer on printed circuits |
10/13/2005 | US20050228165 Polyamides |
10/12/2005 | CN1681878A Polymeric compositions containing polymers and ionic liquids |
10/05/2005 | CN1221624C Adhesive composition comprising particle thermoplastic component |
09/28/2005 | CN1220746C Hot melt binding composition and viscous lining cloth using composition |
09/13/2005 | US6943207 Smoke suppressant hot melt adhesive composition |
09/07/2005 | CN1664964A Process for clinkering anisotropic permanent ferrite through polymer bonding and modeling |
08/04/2005 | WO2005052081A3 Single-coated adhesive tape |
08/03/2005 | CN1648188A 钢桥面粘接剂 Steel deck adhesive |
07/28/2005 | US20050165149 Smoke suppressant hot melt adhesive composition |
07/28/2005 | DE10361537A1 Thermoplastische Blends zur Implantierung von elektrischen Modulen in einen Kartenkörper Thermoplastic blends for implanting electrical modules in a card body |
07/14/2005 | WO2005063908A1 Thermoplastic adhesive |
07/14/2005 | US20050154141 Polymerizable compositions in non-flowable forms |
07/13/2005 | CN1639282A Varnish containing polyamide resin and use thereof |
07/13/2005 | CN1637106A Two-component water-borne adhesive |
07/07/2005 | WO2005061640A1 Method for gluing two materials using a cross-linking adhesive |
07/06/2005 | CN1635014A Low molecular polyamide modified hot melt adhesive and method for preparation |
06/30/2005 | WO2004094714A3 Mineral fibre sizing composition containing a carboxylic polyacid and a polyamine, preparation method thereof and resulting products |
06/28/2005 | CA2129253C A process for the production of plastics containing amide groups |
06/23/2005 | US20050137374 Two-component water-borne adhesive |
06/22/2005 | EP1544226A2 Two-component water-borne adhesive |
06/09/2005 | WO2005052081A2 Single-coated adhesive tape |
06/09/2005 | CA2545562A1 Single-coated adhesive tape |
06/08/2005 | EP1537185A1 Smoke suppressant hot melt adhesive composition |
05/25/2005 | EP1533330A1 Polyamides |
05/19/2005 | DE10347665A1 Vernetzbare Basisschicht für Fixiereinlagen nach dem Doppelpunktverfahren Crosslinkable base layer for fusible after the colon procedures |
05/19/2005 | DE10347628A1 Vernetzbare Basisschicht für Fixiereinlagen nach dem Doppelpunktverfahren Crosslinkable base layer for fusible after the colon procedures |
05/18/2005 | CN1202195C Long carbon chain nylon hot melt glue and its synthesis method |
04/28/2005 | WO2004067668A8 Polyolefin and copolyamide based thermofusible adhesive composition with improved thermal behavior |
04/27/2005 | EP1240252B1 Thermoplastic compositions comprising crystalline and amorphous polymers |
04/26/2005 | US6884854 A thermally curable formulation containing an epoxy resin, a copolymer having glass transition temp. of -30 degree C. or lower and epoxy reactive group or reaction product with epoxy resin, a hardner, and a polyamide or polyimde or mixture |
04/26/2005 | US6884833 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
04/21/2005 | WO2005035685A1 Cross-linkable base layer for interlinings applied in a double-dot method |
04/21/2005 | WO2005035614A1 Cross-linkable base layer for interlinings applied in a double-dot method |
04/20/2005 | EP1399519B8 Devices, compositions and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
04/07/2005 | WO2005030896A1 Adhesive aid composition |
04/06/2005 | EP1520868A1 Degradable polydioxaneone-based materials |
04/06/2005 | EP1519988A1 Polymeric compositions containing polymers and ionic liquids |
04/05/2005 | US6875520 Mixture of grafted polyamide-block and flexible polyolefin copolymers |
03/24/2005 | US20050065296 Adhesive composition and adhesive film |
03/23/2005 | CN1597826A Thermosol of polyamide and preparation process thereof |
03/09/2005 | CN1592767A Thermoplastic resin composition for ic card |
03/02/2005 | EP1399519B1 Devices, compositions and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents |
03/02/2005 | CN1191316C Multi-purpose polyamide hot melt adhesive and its prepn |
02/17/2005 | WO2005014278A1 A metal-polyamide/polyethylene-metal laminate |
02/17/2005 | CA2532198A1 A metal-polyamide/polyethylene-metal laminate |
02/09/2005 | EP1504892A1 A metal-polyamide/polyethylene-metal laminate |
02/02/2005 | EP0722445B1 Degradable polydioxaneone-based materials |
02/02/2005 | CN1572854A Solid adhesive and liquid material composition for producing the solid adhesive |
02/02/2005 | CN1187424C Adhesive resin compsn. and heat-shrinkable articles made by using same |
01/25/2005 | US6846874 Hot-melt adhesives based on polyamide-block graft copolymers |
01/19/2005 | CN1185319C Crosslinked base layer for sandwich fixed by two-point method and sticking method |
01/05/2005 | CN1560169A Epoxy conductive adhesives with climate adaptive |
12/08/2004 | EP1484376A2 Solvent adhesive |
12/01/2004 | EP1285028B1 Polyolefin/copolyamide rf active adhesive film |
11/25/2004 | CA2524783A1 Activatable material for sealing, baffling or reinforcing and method of forming same |
11/24/2004 | CN1176974C Copolymer with polyamide block using ethoxyamine as main composition and polyether block |
11/17/2004 | EP0757824B1 Chip card |
11/09/2004 | US6814890 Process for forming a mixed solvent adhesive solution |
11/04/2004 | WO2004094714A2 Mineral fibre sizing composition containing a carboxylic polyacid and a polyamine, preparation method thereof and resulting products |
11/04/2004 | CA2522642A1 Mineral fibre sizing composition containing a carboxylic polyacid and a polyamine, preparation method thereof and resulting products |
11/03/2004 | CN1542077A Adhesive compound |
10/27/2004 | EP0828801B1 Bonding process |
10/27/2004 | CN1173002C Long carbon chain nylon thermosol and its preparation method |
10/20/2004 | CN1171964C Cross-linking bottom liner for adhesive lining cloth by double layer point coating technique |
09/15/2004 | EP1251756B1 Handcovering and method of manufacture |
09/08/2004 | EP1454957A1 Thermoplastic resin composition for ic cards |
09/07/2004 | US6787244 Poly-o-hydroxy amides that cure to form polybenoxazoles |
09/02/2004 | US20040171764 Blend of nylin, nucleation agent and lubricant |
09/02/2004 | US20040171763 Hot-melt adhesive composition and process for the preparation of a textile product |
08/31/2004 | US6784227 Crosslinking base layer for fixing interlinings according to double dot and paste process |
08/25/2004 | CN1523651A Adhesive tape for semiconductor device |
08/18/2004 | EP1064318B1 Thermofusible and crosslinkable polyamide and one of the methods for obtaining same and adhesive comprising same |
08/18/2004 | CN1522287A Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents |
08/18/2004 | CN1162496C Modified polyamide thermosol |
08/18/2004 | CN1162495C Polyamide thermosol |
08/17/2004 | US6777488 Aqueous polyamide resin dispersion and process for producing the same |