Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
05/2014
05/07/2014CN203579395U 一种新型研磨盘 A new grinding disc
05/07/2014CN203579394U 用于加工瓷绝缘子的凸台卡装面的研磨轮 Grinding wheels for machining of porcelain insulators boss card installed surface
05/07/2014CN203579393U 晶片的抛磨装置 Wafer polishing apparatus
05/07/2014CN203579392U 一种弹簧研磨机 One kind of spring grinding machine
05/07/2014CN203579391U 一种精密平面研磨装置 A precision flat grinding apparatus
05/07/2014CN203579390U 一种研磨设备的自动加压机构 Automatic compression mechanism for a milling device
05/07/2014CN103782372A 研磨垫 Abrasive pad
05/07/2014CN103782371A 研磨垫 Abrasive pad
05/07/2014CN103782370A 研磨剂及研磨方法 Abrasive and polishing method
05/07/2014CN103778841A 真实岩心微观模型制作方法及所用研磨夹持器和粘合剂 Real core microscopic model making methods and the grinding holder and adhesives
05/07/2014CN103769996A 吸附垫片、研磨装置及吸附垫片的制造方法 Adsorbing pads, a polishing apparatus and a method of adsorbing the spacer
05/07/2014CN103769995A 一种新型研磨下盘结构 A new grinding disc structure under
05/07/2014CN103769994A 冷拔不锈钢复合管焊道在线研磨装置 Cold drawn stainless steel composite pipe weld line grinding apparatus
05/07/2014CN102744673B 发动机气缸气门研磨器 Engine cylinder valve grinder
05/07/2014CN102744672B 一种冠型磁芯研磨装置 One kind of crown-core grinding apparatus
05/07/2014CN102653073B 自动检测外径装置及带该装置的陶瓷芯柱外径研磨装置 Automatic detection device and the outer diameter of the outer diameter of the ceramic grinding unit with the stem of the device
05/07/2014CN102476349B 一种化学机械研磨装置 A chemical mechanical polishing apparatus
05/07/2014CN102371534B 晶圆表面的化学机械研磨方法 The chemical mechanical polishing method of the wafer surface
05/06/2014US8715524 Polishing liquid
05/01/2014WO2014065029A1 Polishing solution for chemical mechanical polishing (cmp), stock solution, and polishing method
05/01/2014US20140120809 Soft And Conditionable Chemical Mechanical Polishing Pad
05/01/2014US20140120806 Spider arm driven flexible chamber abrading workholder
05/01/2014US20140120805 Bellows driven floatation-type abrading workholder
05/01/2014US20140120804 Bellows driven air floatation abrading workholder
05/01/2014US20140120803 Retaining ring with selected stiffness and thickness
04/2014
04/30/2014DE112012002411T5 Polierkopf, Poliervorrichtung und Verfahren zum Polieren eines Werkstücks Polishing head, the polishing apparatus and method of polishing a workpiece
04/30/2014CN203566489U Cleaning device used for grinding disk grooves of silicon wafer grinder
04/30/2014CN203566488U Multifunctional grinding machine
04/30/2014CN203566487U Grinding device for valve base of steam-driven pump
04/30/2014CN203566486U Optical fiber end former
04/30/2014CN203566485U Optical fiber end former
04/30/2014CN203566484U Surface lapping machine
04/30/2014CN203566483U Moving axis grinding machine
04/30/2014CN203566482U Valve grinding device
04/30/2014CN203566481U Positioning valve grinding device
04/30/2014CN203566480U Mechanical end-judgment feeding system for coarse centerless grinding of ceramic ferrule
04/30/2014CN203566479U Optical fiber grinding machine
04/30/2014CN103764346A Polishing pad
04/30/2014CN103753383A Angle grinding base
04/30/2014CN103753382A Polishing pad and production method thereof
04/30/2014CN103753381A Surface polishing method for A-surface sapphire wafer
04/30/2014CN103753380A Chemical mechanical polishing interface temperature detection and control system based on wireless transmission
04/30/2014CN103753379A Grinding speed detection apparatus, grinding device and method for detecting grinding speed in real time
04/30/2014CN103753378A Hydraulic semi-automatic constant-pressure grinding and polishing equipment
04/30/2014CN102554762B Method for machining precision spherical parts
04/30/2014CN102311718B Aqueous grinding fluid applied to super precision grinding of hard and brittle materials and application method thereof
04/30/2014CN102205521B Method for polishing a semiconductor wafer
04/29/2014US8712575 Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
04/29/2014US8709278 Polishing composition
04/24/2014WO2014061423A1 Grindstone and grinding/polishing device using same
04/24/2014WO2014061417A1 Polishing solution for cmp, stock solution, and polishing method
04/24/2014US20140113531 Polishing head and polishing apparatus
04/24/2014US20140113526 Wafer process control
04/24/2014US20140113524 Endpointing with selective spectral monitoring
04/24/2014US20140110058 Polishing pad, polishing apparatus, and method for making the polishing pad
04/24/2014DE112012001943T5 Verfahren zum Einstellen der Höhenposition eines Polierkopfs und Verfahren zum Polieren eines Werkstücks A method for adjusting the height position of a polishing head and method for polishing a workpiece
04/23/2014EP2722872A1 Polishing composition
04/23/2014CN203557257U Optical fiber grinding fixture
04/23/2014CN203557256U Double-side grinding machine
04/23/2014CN203557255U Grinding device for turbine generator carbon brush
04/23/2014CN103747918A 抛光垫 Polishing pad
04/23/2014CN103747917A Process for producing glass product
04/23/2014CN103737481A Grinding device
04/23/2014CN103737480A Method and apparatus for trimming working layers of double-side grinding apparatus
04/23/2014CN103737479A Polishing device and method for improving uniformity of chemical mechanical polishing by means of same
04/23/2014CN103737478A Valve grinding machine
04/23/2014CN103737454A Valve grinding device capable of performing positioning
04/23/2014CN102554760B Multifunctional substrate polishing and burnishing device and polishing and burnishing method thereof
04/23/2014CN102430975B Grinding speed-limit alarm of grinding machine
04/22/2014US8703007 Polishing composition and polishing method using the same
04/22/2014US8702477 Polishing pad sub plate
04/22/2014US8702474 Method of regenerating a polishing pad using a polishing pad sub plate
04/22/2014US8702472 Polishing composition and polishing method using the same
04/17/2014WO2014057932A1 Process for manufacturing polishing composition, and polishing composition
04/17/2014US20140106652 Polishing pad and manufacturing method therefor
04/17/2014US20140102010 Polishing Pad for Eddy Current End-Point Detection
04/17/2014DE102012218745A1 Method for simultaneous two-sided material-removing machining of surfaces of disc of e.g. semiconductor wafer, involves conducting disc of semiconductor material during co-material-machining of surfaces of recess in rotor disc
04/16/2014CN203542344U Multipurpose switching device
04/16/2014CN203542343U Grinding head seat of circular arc polishing machine
04/16/2014CN203542342U Vacuum suction cup of wafer back face grinding device
04/16/2014CN203542341U Locating device of grinding center hole
04/16/2014CN203542340U Chemical mechanical polishing pad
04/16/2014CN203542339U Adjustable combination grinder for outside micrometer
04/16/2014CN203542338U Chemical mechanical polishing device
04/16/2014CN203542337U Grinding tool for conical valve sealing surface
04/16/2014CN203542336U Fully automatic precise grinding polishing equipment
04/16/2014CN103733314A Silicon wafer polishing method and abrasive
04/16/2014CN103732354A Method for producing ceramic composite for photoconversion
04/16/2014CN103722486A Chemical mechanical polishing method and device
04/16/2014CN103722485A Automatic grinding and turnover device for sector plate of recoiling machine
04/16/2014CN103722484A Automatic grinding device of cylinder head valve
04/16/2014CN103721967A Self-cleaning grinding upper disc structure
04/16/2014CN103011835B Production process of high-compactness compound ceramic ball bearing rolling element
04/16/2014CN102059646B Method for rubbing flat-panel display
04/16/2014CN101654269B Method for producing boehmite particles and method for producing alumina particles
04/16/2014CN101607381B Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
04/15/2014US8696929 Polishing slurry and polishing method
04/15/2014US8696924 Polishing apparatus and polishing method
04/10/2014WO2014054611A1 Polishing method and method for producing alloy material
04/10/2014DE112012003180T5 Verfahren zum Polieren von Silizium-Wafern und Poliermittel A method for polishing of silicon wafers and polishing agent
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