Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
12/2014
12/10/2014CN203993506U 游标卡尺外测量爪研磨机 Vernier caliper measurements outside claw grinder
12/10/2014CN203993505U 高精度球体循环研磨加工设备 High-precision grinding equipment ball circulation
12/10/2014CN203993504U 高精度球体加工设备的球体输送机构 Precision sphere sphere transport mechanism of the processing equipment
12/10/2014CN203993503U 用于球阀研磨机的球体研磨工装安装架 Ball for ball mill grinding tooling mount
12/10/2014CN203993502U 研磨机构和铁芯中柱磨床 Grinding bodies and core pillar grinder
12/10/2014CN203993501U 气控系统 Air control system
12/10/2014CN203993500U 新型钢帘线拉丝模定径研磨机 The new steel cord wire drawing dies sizing mill
12/10/2014CN203993499U 游标卡尺研磨机 Vernier caliper grinding machine
12/10/2014CN203993498U 一种半自动无心研磨机 A semi-automatic centerless grinding machine
12/10/2014CN203993497U 用于研磨毂闸的设备 Equipment for grinding wheel brake
12/10/2014CN203993496U 一种活塞销外角成型研磨装置 One kind of piston pin outer corner molding grinding device
12/10/2014CN104201141A 研磨垫及晶片清洗方法 Polishing pad and wafer cleaning method
12/10/2014CN104191352A 一种提高抛光垫使用寿命的单晶硅晶圆片抛光方法 A single crystal silicon wafer polishing method of improving the life of the polishing pad
12/10/2014CN104191351A 螺旋分离式v形槽的高精度球体加工设备 High-precision machining equipment spiral sphere separate v-shaped grooves
12/10/2014CN104191350A 球体自动研磨机 Ball automatic grinding machine
12/10/2014CN104191349A 密炼机转子密封装置中动、静环的研磨方法及研磨辅助装置 Mixer rotor seal in dynamic and static ring grinding and polishing methods assist device
12/10/2014CN104191348A 用于液压阀件连接管的密封面研磨工具 Sealing surface grinding tools hydraulic valves for connecting pipe
12/10/2014CN104191347A 新型钢帘线拉丝模定径研磨机 The new steel cord wire drawing dies sizing mill
12/10/2014CN102922409B 玻璃基板表面研磨方法 The surface of the glass substrate polishing method
12/10/2014CN102825541B 晶圆减薄方法 Wafer thinning method
12/10/2014CN102448669B 抛光垫、其聚氨酯层及抛光硅晶片的方法 A polishing pad, which polyurethane layer and method of polishing a silicon wafer
12/10/2014CN102441843B 一种cmp机台内置清洗结构及方法 One kind of built-in washing machine cmp structure and method
12/10/2014CN102310360B 精研工件 Lapping workpiece
12/10/2014CN102069448B 半导体晶片的制造方法 The method of manufacturing a semiconductor wafer
12/10/2014CN101175603B 一种生产半导体晶片抛光垫的方法 A method of manufacturing a semiconductor wafer polishing pad
12/09/2014US8906777 Methods for evaluating and manufacturing semiconductor wafer
12/09/2014US8906252 CMP compositions selective for oxide and nitride with high removal rate and low defectivity
12/04/2014US20140357170 Soft and Conditionable Chemical Mechanical Window Polishing Pad
12/04/2014US20140357169 Soft And Conditionable Chemical Mechanical Polishing Pad Stack
12/04/2014US20140357164 Polishing apparatus
12/04/2014US20140357163 Multilayer Chemical Mechanical Polishing Pad Stack With Soft And Conditionable Polishing Layer
12/04/2014US20140357162 Abrasive Agent For Substrates And Substrate Manufacturing Method
12/04/2014US20140357161 Center flex single side polishing head
12/02/2014US8900477 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
12/02/2014US8900473 Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP
12/02/2014US8900335 CMP polishing slurry and method of polishing substrate
12/02/2014US8900037 Grinding device for machine based grinding of rotor blades for wind energy systems
12/02/2014US8900036 Polishing pad having micro-grooves on the pad surface
12/02/2014US8900033 Wafer polishing method
11/2014
11/27/2014US20140349554 Polish pad, polish method, and method manufacturing polish pad
11/27/2014US20140349552 Dressing apparatus, polishing apparatus having the dressing apparatus, and polishing method
11/27/2014US20140346140 Cmp compositions selective for oxide and nitride with high removal rate and low defectivity
11/25/2014US8895458 Abrasive cloth and method for producing nanofiber structure
11/25/2014US8894799 Method of forming layered-open-network polishing pads
11/20/2014US20140342646 Polishing pad
11/20/2014US20140342643 Chemical mechanical polishing fixture having lateral perforation structures
11/20/2014US20140342641 Polishing pad
11/20/2014US20140342640 Polishing apparatus and polishing method
11/18/2014US8892568 Building a library of spectra for optical monitoring
11/18/2014US8889555 Polishing agent for copper polishing and polishing method using same
11/18/2014US8889553 Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method
11/18/2014US8888563 Polishing head capable of continuously varying pressure distribution between pressure regions for uniform polishing
11/18/2014US8888562 Double-side polishing apparatus
11/18/2014US8888560 Method for uniformly polishing large scale plate
11/13/2014US20140335767 Apparatus and method for deterministic control of surface figure during full aperture pad polishing
11/13/2014US20140335763 Polishing liquid composition for magnetic disk substrate
11/11/2014US8882565 Method for polishing a semiconductor wafer
11/11/2014US8882563 Chemical mechanical polishing system
11/11/2014US8882562 Scratch removal and device and method
11/06/2014US20140329446 Polishing apparatus
11/06/2014US20140329439 Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing
11/04/2014US8877643 Method of polishing a silicon wafer
11/04/2014US8877082 Method of processing surface of high-performance materials which are difficult to process
10/2014
10/30/2014US20140323018 Polishing device for removing polishing byproducts
10/30/2014US20140323016 Polishing method and polishing apparatus
10/28/2014US8874250 Spectrographic monitoring of a substrate during processing using index values
10/28/2014US8871331 Anti-loading abrasive article
10/28/2014US8870627 Polishing method and polishing apparatus
10/28/2014US8870626 Polishing pad, polishing method and polishing system
10/28/2014US8870625 Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
10/23/2014US20140311043 Multi-layered chemical-mechanical planarization pad
10/21/2014US8865785 Polishing pad
10/21/2014US8864860 Polishing composition
10/21/2014US8864859 Customized polishing pads for CMP and methods of fabrication and use thereof
10/16/2014US20140308880 Supplying system of adding gas into polishing slurry and method thereof
10/16/2014US20140308879 Additive for polishing agent, and polishing method
10/16/2014US20140308878 Method for polishing semiconductor wafers by means of simultaneous double-side polishing
10/16/2014US20140305857 Recycling method and device for recycling waste water containing slurry from a semi-conductor treatment process, in particular from a chemico-mechanical polishing process
10/14/2014US8860932 Detection of layer clearing using spectral monitoring
10/14/2014US8859429 Polishing agent for copper polishing and polishing method using same
10/14/2014US8859070 Elastic membrane
10/14/2014US8858819 Method for chemical mechanical planarization of a tungsten-containing substrate
10/14/2014US8858817 Polishing apparatus and exception handling method thereof
10/14/2014US8858302 Retainer rings of chemical mechanical polishing apparatus and methods of manufacturing the same
10/14/2014US8858300 Applying different pressures through sub-pad to fixed abrasive CMP pad
10/14/2014US8858298 Polishing pad with two-section window having recess
10/14/2014US8858296 Method and system for endpoint detection
10/09/2014WO2014165447A1 Bonded abrasive article and method of grinding
10/09/2014WO2014165394A1 Pad for supporting abrasive disc
10/09/2014WO2014163026A1 Manufacturing method for magnetic disk glass substrates, manufacturing method for magnetic disck, and polishing pad
10/09/2014US20140302754 Polishing apparatus
10/09/2014US20140302753 Polishing composition
10/09/2014US20140302752 Composition for polishing purposes, polishing method using same, and method for producing substrate
10/09/2014US20140298862 Pressure-sensitive adhesive tape
10/09/2014DE112013000641T5 Polierkopf und Polierapparatur Polishing head and polishing apparatus
10/07/2014US8853082 Polishing liquid for CMP and polishing method using the same
10/07/2014US8851959 Chemical mechanical polishing device and polishing element
10/07/2014US8851958 Method for the simultaneous double-side material-removing processing of at least three workpieces
10/02/2014WO2014158892A1 Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
10/02/2014WO2014158872A1 System and method for polishing and lubricating aluminum welding wire
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