| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 07/31/2008 | US20080179379 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
| 07/31/2008 | US20080179298 Method of detecting an object to be detected in a joining device, joining device, and joining method |
| 07/31/2008 | US20080178458 Coating active metal or compounds suitable to be affixed with a soldering metal material on first and second components of high and low melting points; heating first componeent with a gas flame, laser or infrared gun or inert gas injection; heating second component in vacuum furnace; vapor deposition |
| 07/31/2008 | DE102007004185A1 Production of a solder connection between an optical element and a support element comprises arranging a solder in a joining region between the optical element and the support element and further processing |
| 07/31/2008 | DE102006042097B4 Abschirmung von Bauelementen beim Laserbearbeiten Shielding of components in laser machining |
| 07/31/2008 | CA2676218A1 High temperature solder materials |
| 07/31/2008 | CA2619144A1 Electronic board incorporating a heater wire |
| 07/30/2008 | EP1949996A2 Diffusion braze repair of metal components |
| 07/30/2008 | EP1948386A1 Method for producing a contact arrangement between a microelectronic component and a supporting substrate as well as component unit produced by said method |
| 07/30/2008 | CN201093050Y Stannum wave generator belt roller |
| 07/30/2008 | CN201091950Y Tin wave producer |
| 07/30/2008 | CN201091949Y Tin wave generating apparatus |
| 07/30/2008 | CN101232967A Lead free solder paste and application thereof |
| 07/30/2008 | CN101230934A Method for producing copper pipe water tap |
| 07/30/2008 | CN101229602A Method of welding thermistance chip and down lead |
| 07/30/2008 | CN101229601A Device, method and program for soldering |
| 07/29/2008 | US7405379 System for applying an isolation layer to a brazed end of a generator armature winding bar |
| 07/29/2008 | US7404513 Wire bonds having pressure-absorbing balls |
| 07/24/2008 | WO2008087831A1 Laser soldering device |
| 07/24/2008 | WO2008086842A1 Device and method for selective soldering |
| 07/24/2008 | US20080177412 Device, method and program for soldering |
| 07/24/2008 | US20080176055 Method and Apparatus Providing a Structure Relative To A Support |
| 07/24/2008 | US20080173699 Method for Attachment of Solder Powder to Electronic Circuit Board and Solder-Attached Electronic Circuit Board |
| 07/24/2008 | US20080173694 Ultrasonic welding system |
| 07/24/2008 | DE102007002436A1 Verfahren zum Fügen justierter diskreter optischer Elemente A method for assembling-aligned discrete optical elements |
| 07/23/2008 | EP1946875A1 Method and device for selective soldering |
| 07/23/2008 | EP1945924A1 Honeycomb for an exhaust treatment unit |
| 07/23/2008 | EP1945398A1 Amplitude adjustment of an ultrasonic horn |
| 07/23/2008 | EP1945397A2 Brazing material with continuous length layer of elastomer containing a flux |
| 07/23/2008 | CN201089051Y Leadless wave peak soldering machine |
| 07/23/2008 | CN201089050Y Wave peak soldering machine |
| 07/23/2008 | CN101227997A Method for brazing a heat exchanger folded tube while applying a flux near a contact zone of the walls, resulting tube |
| 07/23/2008 | CN101224869A Nano tin soldering method by using atomic force microscopy probe as welding gun |
| 07/23/2008 | CN100405532C Method of soldering semiconductor part and mounting structure of semiconductor part |
| 07/23/2008 | CN100404184C High frequency welder |
| 07/22/2008 | US7401726 Brazing method |
| 07/22/2008 | US7401724 Brazing flux for dry application |
| 07/22/2008 | US7401393 Method for removing solder bumps from LSI |
| 07/17/2008 | WO2008084673A1 Semiconductor device and method for manufacturing the semiconductor device |
| 07/17/2008 | WO2008083676A1 Method for joining aligned discrete optical elements |
| 07/17/2008 | US20080169337 De-Soldering Tool |
| 07/16/2008 | EP1944122A1 Holding apparatus, assembly system, sputtering apparatus, machining method and machining apparatus |
| 07/16/2008 | CN201086166Y Discontinuous mode gas protecting brazier |
| 07/16/2008 | CN201086165Y Wave crest tin soldering machine |
| 07/16/2008 | CN101223002A Solder free from lead for additional supply and method of regulating Cu concentration and Ni concentration in solder bath |
| 07/16/2008 | CN101223001A Method for arc or beam brazing/welding of workspieces of identical or different metals or metal alloys with additional materials of SN base alloys; SN base alloy wire |
| 07/16/2008 | CN101222999A Method for connection at least two pieces of sheet material, particularly at least two metal sheets for a lightweight structure as well a joining and lightweight structure |
| 07/16/2008 | CN101219495A Method of manufacturing flat tube aluminum fin recuperator tube |
| 07/16/2008 | CN101219494A Method of welding foamed aluminium sandwich composite board |
| 07/16/2008 | CN100402217C Ultrasonic tinning of current-carrying armout-clamp, and bivariate composite adhering for copper-aluminium transition current-carrying armour clamp |
| 07/15/2008 | US7400460 Method for connection of an optical element to a mount structure |
| 07/15/2008 | US7398912 Different materials bonded member and production method thereof |
| 07/10/2008 | WO2008082825A2 A method of applying braze filler metal powders to substrates for surface cleaning and protection |
| 07/10/2008 | WO2008081939A1 Laser reflow device |
| 07/10/2008 | WO2008055910A3 A plate, couplable to an edge of an opening afforded in a tubular element, and a method for constraining the plate to the edge |
| 07/10/2008 | US20080166585 Sprayed weld strip for improved weldability |
| 07/10/2008 | US20080165518 Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles |
| 07/10/2008 | US20080164300 Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly |
| 07/10/2008 | US20080164298 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece |
| 07/10/2008 | US20080164248 Method and Device for Brazing Connections by Induction Heating |
| 07/10/2008 | CA2673822A1 A method of applying braze filler metal powders to substrates for surface cleaning and protection |
| 07/09/2008 | EP1941077A1 Technology for cleaning thermal fatigue cracks in nickel-based superalloys with a high chromium content |
| 07/09/2008 | EP1488972B1 Metal fixture-joined glass article, and joint structure using this |
| 07/09/2008 | CN101214570A Method of preparing diamond bead |
| 07/09/2008 | CN101214569A Method for brazing foamed aluminium |
| 07/09/2008 | CN101214497A Method for simultaneously rolling three metal composite boards by composite blanks |
| 07/08/2008 | US7396596 Article with a coating of electrically conductive polymer |
| 07/03/2008 | WO2008079461A2 Reactive multilayer joining with improved metallization techniques |
| 07/03/2008 | WO2008049574A3 Method and apparatus for connecting an optical element to a mount |
| 07/03/2008 | WO2008041121A3 Methods for manufacturing hot runners for injection moulding systems of plastic materials |
| 07/03/2008 | US20080160332 Method of applying braze filler metal powders to substrates for surface cleaning and protection |
| 07/03/2008 | US20080157359 Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component |
| 07/03/2008 | US20080156110 Method for fixing an attachment part on the measurement tube of a coriolis mass flowmeter and coriolis mass flowmeter |
| 07/02/2008 | EP1939312A1 Clad plate and process for production thereof |
| 07/02/2008 | CN101209499A Diamond bite special for ultra-precise turn |
| 07/02/2008 | CN100398973C Flat tube for aluminium heat exchanger |
| 07/01/2008 | US7393497 System and filter for filtering hard alpha inclusions from reactive metal alloys |
| 06/26/2008 | US20080150201 System and filter for filtering hard alpha inclusions from reactive metal alloys |
| 06/26/2008 | US20080149690 Removal of Surface Oxides by Electron Attachment for Wafer Bumping Applications |
| 06/26/2008 | DE102007058147A1 Unit for production of soldered components, especially Al workpieces under shielding gas in muffle furnace useful in production of light metal, especially Al components simplifies and lowers cost of producing soldered Al components |
| 06/26/2008 | DE102006059885A1 Component for motor vehicle, has processed surface with varying structures in certain areas, where varying structures are arranged into three dimensional structure by laser |
| 06/26/2008 | DE102006023325B4 Verfahren zum Bestimmen der Benetzungsfähigkeit eines Lotmaterials und Träger mit einem benetzbaren Oberflächenabschnitt zur Durchführung dieses Verfahrens Method for determining the wettability of a solder material and carrier with a wettable surface portion for carrying out this method |
| 06/25/2008 | EP1936745A2 Method for connecting cable cores by magnetostriction and magnetostriction generating device |
| 06/25/2008 | EP1935552A2 Multi-beam laser processing head |
| 06/25/2008 | EP1935546A1 Laser brazing heating assembly with optic fibre having at least at a distal end a non-circular cross section ; Laser brazing tool and robot with such a laser brazing heating assembly ; Useof such optical fibre with at least at a distal end a non-circular cross section for laser brazing |
| 06/25/2008 | EP1935540A2 Rotary percussion drill bit with a hard material insert |
| 06/25/2008 | EP1934011A1 Method and device for applying hard solder |
| 06/25/2008 | CN201076959Y Double-station high-frequency wicking machine |
| 06/24/2008 | US7389903 Device and method for soldering contacts on semiconductor chips |
| 06/24/2008 | US7389805 Bonding arm swinging type bonding apparatus |
| 06/19/2008 | WO2008073432A2 No flow underfill process, composition, and reflow carrier |
| 06/19/2008 | WO2008073419A2 Low and non-silver filler metals and alloys and corresponding joinder systems and methods |
| 06/19/2008 | WO2008072654A1 Flux for lead-free solder and method of soldering |
| 06/19/2008 | WO2007130599A9 Adaptive continuous acoustic welding system for incompatible materials |
| 06/19/2008 | US20080145542 Method for preparing a brazed surface for receiving a coating |
| 06/19/2008 | US20080142576 Method for the production of a soldered joint |
| 06/19/2008 | US20080142571 Electronic device |
| 06/19/2008 | US20080142070 Photovoltaic module |
| 06/19/2008 | US20080141616 Method for Joining Dispersion-Strengthened Alloy |
| 06/18/2008 | CN201073709Y Combined wave peak tin solder |