| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 09/17/2008 | EP1970152A2 Multiple sheet metal connection |
| 09/17/2008 | EP1970151A1 Soldering structure and method using zinc |
| 09/17/2008 | CN201115892Y Improved integrated circuit component detinning apparatus |
| 09/17/2008 | CN201115891Y Improved integrated circuit component tin ball reflow oven |
| 09/17/2008 | CN101267907A Method and device for brazing material application |
| 09/17/2008 | CN101266889A A method for making electric contact |
| 09/17/2008 | CN101264538A Welding shaping method for foamed aluminium board |
| 09/17/2008 | CN100419153C Metal strand comprising interrupted filament |
| 09/16/2008 | US7424966 Method of ultrasonic mounting and ultrasonic mounting apparatus using the same |
| 09/12/2008 | WO2008107337A1 Method for the production of a honeycomb element, and corresponding honeycomb element |
| 09/12/2008 | WO2008107282A1 Method for the soldering repair of a component in a vacuum and an adjusted partial oxygen pressure |
| 09/12/2008 | WO2008106935A1 Method and device for coating components of a gas turbine |
| 09/11/2008 | US20080220313 Seal arrangement comprising a metallic braze for a high-temperature fuel cell stack and a method of manufacturing a fuel cell stack |
| 09/11/2008 | US20080217382 Metal-ceramic composite air braze with ceramic particulate |
| 09/11/2008 | DE102007010759A1 Verfahren zur Herstellung eines Wabenkörpers und entsprechender Wabenkörper A process for producing a honeycomb body and a corresponding honeycomb body |
| 09/10/2008 | EP1968366A1 Soldering method, semiconductor module manufacturing method and soldering apparatus |
| 09/10/2008 | EP1968108A1 Soldering method, soldering apparatus and method for manufacturing semiconductor device |
| 09/10/2008 | EP1968107A1 Soldering method and semiconductor module manufacturing method |
| 09/10/2008 | EP1967314A1 Soldering container and production method of semiconductor device |
| 09/10/2008 | EP1967313A1 Component and a solder |
| 09/10/2008 | EP1967312A1 Method for repair soldering of a component under vacuum and a selected oxygen partial pressure |
| 09/10/2008 | EP1727640B1 Process and device for soldering with a vacuum in the vapour phase |
| 09/10/2008 | CN101261870A Reworking method for magnetic head components |
| 09/10/2008 | CN101259555A Equipment for dissembling waste and old circuit board |
| 09/10/2008 | CN100417564C Support for a vehicle body |
| 09/09/2008 | US7423232 Method for resistance welding/brazing a tube to a member |
| 09/04/2008 | WO2008105026A1 Hybrid light collection heater, and method of connecting solar cell element by use thereof |
| 09/04/2008 | US20080213614 Honeycomb Body with an End-Side Brazing Zone, Exhaust-gas Treatment Component and Motor Vehicle Having a Honeycomb Body and Method for Producing a Honeycomb Body |
| 09/04/2008 | US20080213141 Processing apparatus fabrication |
| 09/04/2008 | US20080210743 Process of fabricating stack component |
| 09/04/2008 | US20080210740 Low-profile capillary for wire bonding |
| 09/04/2008 | US20080210413 Heat Exchanger |
| 09/04/2008 | US20080210340 brazing paste containing a first nickel, boron and chromium alloy with a second nickel based alloy containing chromium and cobalt for applying to a crack; second alloy sufficient to cause adequate flow during the braze cycle |
| 09/04/2008 | US20080209726 Braze repair of shroud block seal teeth in a gas turbine engine |
| 09/04/2008 | DE102007010256A1 Method for coating gas turbine components to form a protective layer comprises forming a join between the components and a solder foil by locally heating the components in the region of the solder foil and heating the solder foil |
| 09/03/2008 | EP1663561A4 Hydrogen gas brazing method for manufacturing a diamond tool and arch-shaped hydrogen gas brazing apparatus for performing the same |
| 09/03/2008 | CN101254580A Method for continuously producing non-corrodible steel and non-corrodible steel composite reel |
| 09/03/2008 | CN101254562A Method for laser brazing with twinspot |
| 09/03/2008 | CN101254561A Soldering method and method of manufacturing semiconductor device including soldering method |
| 09/02/2008 | US7419085 Optical processing apparatus |
| 08/28/2008 | US20080206587 Method of manufacturing an electronic component and an electronic device |
| 08/28/2008 | US20080206514 Non-Cylindrical Catalytic-Converter Carrier Element and Tool, and Method for Manufacturing it |
| 08/28/2008 | US20080203138 Method of mounting an electronic component and mounting apparatus |
| 08/28/2008 | US20080202804 Printed circuit board and method of producing the same |
| 08/28/2008 | US20080202614 Passage block and manufacturing method thereof |
| 08/27/2008 | CN101249599A Manufacturing technology of pipe fittings for refrigerating device |
| 08/27/2008 | CN100413636C High strength connecting method for TiAl base alloy charging turbine and steel shaft |
| 08/26/2008 | US7416969 Void free solder arrangement for screen printing semiconductor wafers |
| 08/26/2008 | US7416103 Flow soldering apparatus |
| 08/26/2008 | CA2185890C Solder recovery |
| 08/21/2008 | WO2008098680A1 Method for joining coated components or wires using laser pulses |
| 08/21/2008 | WO2008098614A1 Welded repair of defects located on the inside |
| 08/21/2008 | WO2008041121A8 Methods for manufacturing hot runners for injection moulding systems of plastic materials |
| 08/21/2008 | US20080199718 Method of Brazing Articles of Stainless Steel |
| 08/21/2008 | US20080197173 Method for Forming Solder Bump and Method for Mounting Semiconductor Device |
| 08/21/2008 | US20080197169 Method and device for providing an electric connection |
| 08/21/2008 | DE102007008341A1 Method for soldering components of a heat exchanger in a layer formation comprises stacking sheet metal layers and covering plates to form a stack with front sides, applying a solder to one of the front sides and further processing |
| 08/21/2008 | DE102007007504A1 Hot press bonding apparatus has lower plate containing one component to be bonded which is mounted on bimetallic strips, so that as temperature increases it is pressed towards upper mounting containing other component to be bonded |
| 08/20/2008 | CN101246008A Method of detecting an object to be detected in a joining device, joining device, and joining method |
| 08/20/2008 | CN101244476A Inverse-burning vacuum sintering technique for vehicle rectifier tube |
| 08/19/2008 | US7413106 Method for fixing a miniaturized component to a carrier plate |
| 08/19/2008 | US7412757 Dove-tail sizing stock with solder pockets |
| 08/14/2008 | WO2008095755A1 Connection, method and device for the uniform coupling-in of laser beams during laser welding and laser soldering, in particular on highly reflective materials |
| 08/14/2008 | US20080191367 Semiconductor package wire bonding |
| 08/14/2008 | US20080190552 Method For Soldering Composite Material Parts |
| 08/14/2008 | CA2578964A1 Domite assembly point |
| 08/13/2008 | EP1756330B1 Method for reducing metal oxide powder and attaching it to a heat transfer surface and the heat transfer surface |
| 08/13/2008 | EP1511593B1 Reflow oven gas management system and method |
| 08/13/2008 | CN201098768Y Jet-flow tin soldering furnace |
| 08/13/2008 | CN100409996C Oxidation resistance tin-based no-lead solder capable of proceeding welding without welding flux in air |
| 08/13/2008 | CN100409989C Multi angle enchor fishing book welding method |
| 08/12/2008 | US7410826 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device |
| 08/12/2008 | US7410088 Solder preform for low heat stress laser solder attachment |
| 08/07/2008 | US20080187772 Electronic board incorporating a heating resistor |
| 08/07/2008 | US20080185737 Integrated circuit system with pre-configured bond wire ball |
| 08/07/2008 | US20080185713 Heat dissipating device with preselected designed interface for thermal interface materials |
| 08/07/2008 | US20080185422 Stainless steel for fume extracters |
| 08/07/2008 | US20080185421 Process for reflow soldering |
| 08/07/2008 | DE10252577B4 Verfahren zum Erzeugen einer Lotverbindung durch kapillaren Lotfluß A method for producing a solder joint by capillary flow of solder |
| 08/07/2008 | DE102007005389A1 Wärmeübertrager Heat exchanger |
| 08/07/2008 | DE102007005345A1 Verfahren zum Reflow-Löten A method for reflow soldering |
| 08/06/2008 | EP1954110A1 Soldering apparatus and soldering method |
| 08/06/2008 | EP1952929A1 Method for reflow soldering |
| 08/06/2008 | EP1951468A1 Soldering method for joining different basic metallic materials by means of an exothermal reaction, and heat exchanger produced according to said method |
| 08/06/2008 | EP1951467A1 Fluxless brazing |
| 08/06/2008 | CN201095020Y Automatic tapping device for printed board reflow soldering |
| 08/06/2008 | CN101234446A Aluminum alloy low temperature brazing method based on ultrasonic coating |
| 08/06/2008 | CN101234445A Soldering nozzle and apparatus using the same |
| 08/06/2008 | CN101234444A Welding method and equipment |
| 08/06/2008 | CN101234443A Method for joining golf club head |
| 08/06/2008 | CN100408301C Molded parts and manufacturing method therefor |
| 08/06/2008 | CN100408243C Aluminum alloy and its composite material non-vacuum semi-solid state vibration-rheological connection method |
| 08/05/2008 | US7407715 Method of brazing and article made therefrom |
| 08/05/2008 | US7407081 Methods and apparatus for transferring conductive pieces during semiconductor device fabrication |
| 07/31/2008 | WO2008091825A2 High temperature solder materials |
| 07/31/2008 | WO2008089752A1 Soldering method for epitaxially closing cracks in monocrystalline or directionally solidified parts made of nickel or cobalt base alloys |
| 07/31/2008 | WO2008089743A1 Method and device for contacting, positioning and impinging a solder ball formation with laser energy |
| 07/31/2008 | WO2008055616A9 Method for bonding metal surfaces by applying a first oxidised metal layer and a second oxidised metal layer object having cavities or structure of a light emitting diode produced through the last method |
| 07/31/2008 | US20080182124 lead-containing or lead-free solder such as solders comprising tin and copper, or solder comprising tin, sliver and copper, where said solder has specified amount of zinc, so that formation of voids at an interface between said solder and the solder capture pad is suppressed |
| 07/31/2008 | US20080180121 Probe card assembly and kit |