Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
03/2009
03/05/2009US20090057378 In-situ chip attachment using self-organizing solder
03/05/2009US20090056977 Production method of solder circuit board
03/04/2009EP2029307A1 Soldering arrangement comprising soldering modules and at least one mobile and interchangeable soldering station which can be inserted into a soldering module
03/04/2009CN201201089Y Cast aluminum heating plate
03/04/2009CN201201085Y Heavy industry welding fixture
03/04/2009CN201201075Y Superhard material soldering appliance
03/04/2009CN101376187A Method for increasing solder fluidity in furnace welding
03/04/2009CN100464930C A lead free solder alloy used for supplying solder bath
03/04/2009CN100464916C A precisive internal concentric clamp of centering vertical high-frequency brazing die
03/03/2009US7497846 Hermetically sealed microchip reservoir devices
02/2009
02/26/2009WO2008148986A3 Improved atmospheric-pressure aluminium brazing method
02/26/2009US20090053547 Component Made From Aluminium Material With a Partial or Complete Coating of the Surfaces for Brazing and Method for Production of the Coating
02/26/2009US20090050680 Method for connecting tubular solid oxide fuel cells and interconnects for same
02/26/2009US20090050674 Wave Soldering Bath
02/26/2009US20090050470 Method And Device For Enhancing Solderability
02/26/2009DE202007018660U1 Hochtemperaturlöten High temperature brazing
02/26/2009DE102007040214A1 Device for soldering electronic modules equipped with components useful in microelectronics circuit boards or printed circuit boards, comprises a preheating zone, in which the components and the modules are preheated, and a soldering zone
02/26/2009DE102007040037A1 Anlage zum Löten und Verfahren System for soldering and procedures
02/25/2009EP2027759A1 Device for soldering in the vapour phase
02/25/2009EP2026927A1 Method and device for heat treatment, especially connection by soldering
02/25/2009CN201199662Y Brazing structure for conducting ring of electric machine rotor
02/25/2009CN101374623A Method for producing a metal part
02/25/2009CN100464414C Soft soldering method for semiconductor components and semiconductor device
02/25/2009CN100463764C Not corrosive soldering flux in use for high frequency induced pressure braze welding
02/25/2009CN100463754C special apparatus for induction heating brazing for in-situ connecting carbon steel gas pipeline or stainless steel water supply pipeline
02/25/2009CN100463753C Method of welding foamed aluminium sandwich composite board
02/25/2009CN100463752C Stainless steel dual-polar plate welding method
02/19/2009WO2009022590A1 Heating furnace and heating method employed by heating furnace
02/19/2009US20090047534 Components joining method and components joining structure
02/19/2009DE102007038217A1 Verfahren zum Beloten eines Werkstückes, Vorrichtung zur Durchführung des Verfahrens und Werkstück, belotet nach dem Verfahren A method for brazing a workpiece, apparatus for carrying out the process and workpiece brazing material according to the method
02/18/2009EP2025442A1 Method for soldering a workpiece through the use of a solder curtain ; Device for carrying out the method with a molding part ; Workpiece soldered according to this method
02/18/2009EP2025441A1 Method of brazing one metal component with a second metal component using in combination a mechanical jointing; corresponding metal component
02/18/2009EP2024124A2 Soldering apparatus
02/18/2009CN101367146A Metal solder pad welding method
02/17/2009US7491916 Induction coil design for portable induction heating tool and method for its use
02/17/2009US7491893 Mounting substrate and mounting method of electronic part
02/17/2009US7490403 Soldering method
02/12/2009WO2009020199A1 Cleanser composition for removal of lead-free soldering flux, and method for removal of lead-free soldering flux
02/12/2009WO2009020171A1 Process for producing member for heat exchanger and member for heat exchanger
02/12/2009WO2009019773A1 Reflow furnace
02/12/2009WO2008145513A3 Method for soldering
02/12/2009US20090040415 Flexible Printed Circuit Board and Liquid Crystal Display Device Using the Same
02/12/2009US20090039142 Method for Forming a Solder Mold with Venting Channels and Method for Using the Same
02/12/2009US20090039141 Bonding wire cleaning unit and method of wire bonding using the same
02/12/2009US20090039062 Torch brazing process and apparatus therefor
02/12/2009DE112007000143T5 Gelötetes Rohr und Verfahren zur Herstellung desselben Soldered tube and method for manufacturing the same
02/11/2009EP2022591A1 Method for creating a solderable metal surface and solder method
02/11/2009EP2022590A1 Wave soldering tank
02/11/2009EP2022589A1 Connecting method for metal components and device for soldering a metal component
02/11/2009EP2022588A1 Method of welding two elements together by means of a brazing material
02/11/2009EP1545826A4 Solder hierarchy for lead free solder joint
02/11/2009CN201192751Y Brazing furnace
02/11/2009CN101365555A Method of manufacturing a brazed assembly
02/11/2009CN101364115A Nitrogen closed-loop control method and system
02/11/2009CN101363696A Flat hot pipe for cooling electron device and processing technology thereof
02/11/2009CN101363090A Braze alloy composition with enhanced oxidation resistance and methods of using the same
02/11/2009CN101362240A Precise ultrasonic assistant brazing device of magnesium alloy and composite material thereof and device thereof
02/11/2009CN101362239A Automatic disassembling device of circuit board device
02/11/2009CN101362238A Low temperature use method of high temperature solder
02/11/2009CN101362143A Technique and device for effectively recovering waste printed circuit boards solder
02/11/2009CN100460119C Temperature control method for heating soldering area of intermittent type gas protecting soldering furnace
02/11/2009CN100460118C Method for the production of aluminum-containing honeycomb bodies with the aid of radiant heaters
02/11/2009CN100459911C Stainless steel pot with welded bottom, and making method thereof
02/05/2009US20090035542 Low temperature reactive composite joining
02/05/2009US20090035412 Hybrid lay-up tool
02/05/2009US20090033585 Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit
02/05/2009DE102007035849A1 Verfahren zum Lötverbinden eines ersten Metallteils mit einem zweiten Metallteil und so hergestelltes gelötetes Metallbauteil A process for solder bonding a first metal piece with a second metal part and soldered thus produced metal member
02/04/2009CN101359589A Composite material and wafer supporting member and manufacturing method thereof
02/04/2009CN100459827C Reflow soldering device
02/04/2009CN100457977C Electroplating additive and its preparation method
02/04/2009CN100457370C Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering
02/04/2009CN100457351C Water-cooling room of the interval type air protecting and heating braze welding furnace
02/04/2009CN100457350C Heating device of the heating braze welding region of the interval type braze welding furnace
02/04/2009CN100457349C Air protecting and heating type braze welding furnace
02/04/2009CN100457348C Reflow furnace and hot-air blowing-type heater
02/04/2009CN100457347C Brazing method for aluminium alloy material containing Mg
01/2009
01/29/2009WO2009014660A1 Method for joining ceramic components
01/29/2009US20090026250 Method and apparatus for loading solder balls
01/29/2009US20090026249 Method for soldering two components together by using a solder material
01/29/2009DE102007035394A1 Method for laser welding of workpiece, comprises guiding a laser radiation and a process gas on the processing place, where volume flow and/or composition of the process gas is changed during the welding process
01/28/2009CN101355220A Cable and pin tube cavity contact pair as well as apparatus and method for brazing cable connector
01/28/2009CN101352772A Diffusion welding method of TiAl/Nb based alloy and Ni based high-temperature alloy
01/28/2009CN101352771A Method and apparatus for manufacturing a head gimbal assembly
01/28/2009CN100455394C Soldering method
01/28/2009CN100455393C Removing useless solder and device for removing the same
01/27/2009US7481352 Method for ablating points of contact (debumping)
01/22/2009WO2009010029A1 Method and device for removing solder material deposits from a substrate
01/22/2009WO2009009877A1 Metal matrix composite solders
01/22/2009US20090020593 Method and Apparatus for Manufacturing Solder Mounting Structure
01/22/2009US20090020589 Ultrasonic brazing of aluminum alloy and aluminum matrix composite
01/22/2009US20090020586 Semiconductor device bonding apparatus and method for bonding semiconductor device using the same
01/22/2009DE102008033348A1 Surface treatment composition for copper (alloy) substrate, e.g. for improving solderability of circuit board, comprises solution of imidazole compound, sugar alcohol and zinc ions
01/22/2009DE102007033865A1 Plant for flood-soldering components onto circuit boards, has gas blowing nozzle arrangement based on rotating shaft with helical groove in housing, to remove excess solder
01/22/2009DE102007033813A1 Firmly bonded joint of two aluminum components, which are connected together in joining regions and have joining means corresponding in the joining regions and formed as groove and/or spring, useful in heat exchanger for vehicles e.g. cars
01/21/2009EP1472037B1 Welding apparatus
01/21/2009CN201183151Y Welding warm-blast apparatus
01/21/2009CN201183150Y Wave soldering tray
01/21/2009CN101352110A Soldering method, semiconductor module manufacturing method and soldering apparatus
01/21/2009CN101351874A Soldering method and semiconductor module manufacturing method
01/21/2009CN101351292A Soldering container and production method of semiconductor device
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