Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
06/2009
06/09/2009US7543733 Method of protecting against corrosion at high temperature
06/04/2009WO2009069019A1 Nickel-based hard solder foil and method for hard soldering
06/04/2009US20090140073 Method of fuel nozzle construction
06/04/2009US20090140028 Soldering tip, soldering iron, and soldering system
06/03/2009EP2065657A1 Hot air machine with replaceable nozzle
06/03/2009EP2065114A1 Soldering tip with a non-wetting solder contact layer ; Soldering iron comprising such soldering tip ; Soldering system comprising such soldering iron
06/03/2009EP2064017A2 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other
06/03/2009CN201249314Y Tool for disassembling chip stacking module
06/03/2009CN101444863A Brazing method for repairing fuel line fault
06/03/2009CN100494713C Bearing unit with brazed or soldered connection
06/03/2009CN100493795C Process of obtaining composite brazed seam with ultrasonic brazed aluminium-base composite material
06/03/2009CN100493794C Parts equipped with bracket
06/02/2009US7541561 Process of microwave heating of powder materials
05/2009
05/28/2009WO2009066692A1 Process for producing substrate for power module, substrate for power module, and power module
05/28/2009WO2009065753A1 Method for soldering wider gaps
05/28/2009US20090137082 Manufacturing method for electronic devices
05/28/2009US20090134204 Soldering Method and Semiconductor Module Manufacturing Method
05/27/2009EP2062672A1 Wide gap brazing method
05/27/2009EP2061619A1 Method for connecting components using a soldering technique
05/27/2009CN201244721Y Anti-deforming combined clamp for wave soldering of printed board with heat radiation board
05/27/2009CN201244706Y Apparatus for separating soldering tin and pin of circuit board element
05/27/2009CN101439432A General-purpose tool for extracting DIP packed chip
05/27/2009CN101439431A Machine and method for jointing multi-beam laser
05/27/2009CN101439430A Brazing method
05/27/2009CN101439343A Removing equipment and removing method employing the removing equipment
05/27/2009CN100493299C Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
05/27/2009CN100492632C 电路装置及其制造方法 Circuit device and manufacturing method thereof
05/27/2009CN100491728C Valve coupling structure of reciprocating compressor and coupling method thereof
05/27/2009CN100491058C Air cold plate sealing forming technology of aluminum alloy
05/27/2009CN100491040C Welding shaping method for foamed aluminium board
05/27/2009CN100491039C Soldering process
05/27/2009CN100491038C Welding technology of carbon commutator
05/26/2009US7537958 High performance multi-chip flip chip package
05/26/2009US7537151 Method of making high performance heat sinks
05/26/2009US7537149 Deep access large ribbon bond head
05/26/2009US7537148 Bonding apparatus comprising improved oscillation amplification device
05/26/2009CA2645532A1 Metallic bipolar plate for fuel cells and method for manufacturing the same
05/21/2009US20090130478 Method of Producing and Joining Superalloy Balls By Means of Brazing and Objects Produced With Such Joints
05/21/2009US20090127321 Electronic assembly remanufacturing system and method
05/21/2009US20090127319 Method for soldering magnesium alloy workpiece
05/21/2009US20090126814 Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same
05/20/2009EP2060357A1 Method for producing a honeycomb body
05/20/2009EP2059364A1 Brazing method with application of brazing flux on one side of a section of a flat tube for a heat exchanger
05/20/2009DE102007054989A1 Process to fit and solder teeth made of e.g. hard metal, stellite, diamond or polycrystalline diamond in sawblade
05/20/2009DE102007048789A1 Füge- und Materialauftragsverfahren für ein Werkstück mit einem Werkstückbereich aus einer Titanaluminid-Legierung Joining and material application process for a workpiece with a workpiece area consisting of a titanium alloy
05/20/2009DE102007041960B3 Replacing a component e.g. optical component fastened on support e.g. electrical printed circuit board by replacement module using thermally meltable composite material, comprises heating the composite material in the area of the component
05/20/2009CN201239839Y Soldering flux pressure equalizer
05/20/2009CN201239837Y Hot blast reflow soldering furnace
05/20/2009CN101438635A Method for supplying leadless stick-shaped solder to solder groove and solder groove
05/20/2009CN101437641A Thermoconductimetric analyzer for soldering process improvement
05/20/2009CN100490608C Tin solder jointing method
05/20/2009CN100488689C Method for producing metal-ceramic composite lining and solder material used for same
05/19/2009US7534978 Process chamber of an installation for the thermal treatment of printed circuit boards
05/19/2009US7534654 Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
05/19/2009US7534309 binder and a zinc-based flux which prevents the precipitation of the zinc-based flux having a large specific gravity while securing an excellent brazeability
05/19/2009US7534079 Rivets having high strength and formability
05/19/2009US7533791 Arrangement for welding workpieces by means of an ultrasonic device
05/14/2009WO2009060068A1 Method for operation of a wave soldering system which uses perfluoric polyether for reaction with impurities containing lead
05/14/2009US20090123730 Surface to be soldered
05/14/2009US20090120997 Saturable absorber component and method for manufacturing a saturable absorber component
05/13/2009EP2058619A1 Heat accumulator, method for manufacturing the heat accumulator, and vehicle-mounted thermal system using the heat accumulator
05/13/2009EP2058077A1 Method for connecting the aluminium rib of a steel pipe and heat exchanger with such a manufactured unit
05/13/2009EP2056985A2 Joined concentric tubes
05/13/2009EP1904264A4 Wire bonding capillary apparatus and method
05/13/2009CN201235436Y Circuit board disassembly machine apparatus
05/13/2009CN101429602A Brazing solder alloy based on copper and method for brazing
05/13/2009CN101428367A Pretreatment method for hard solder on partial surface of magnesite product
05/13/2009CN100487882C Integrated circuit and heat radiation member connecting method
05/12/2009US7532749 Light processing apparatus
05/07/2009WO2009057239A1 Soldering material, lamp bulb, magnetron and soldering method
05/07/2009WO2009055945A1 Displacement unit for displacing one or more profile rails, flow line system and method for displacing one or more profile rails in a flow line system
05/07/2009WO2009055939A1 Displacement unit for displacing one or more profile rails, flow line system and method for displacing one or more profile rails in a flow line system
05/07/2009US20090114431 Circuit board and manufacturing method thereof
05/07/2009DE10159057B4 Verfahren und Vorrichtung zur automatischen Einstellung von Temperaturgradienten insbesondere bei Dampfphasen-Lötanlagen Method and apparatus for automatic adjustment of temperature gradients in particular in vapor phase soldering
05/06/2009EP2056660A1 Heatable plate for heating a strip-shaped carrier for the purpose of fixing components to the strip-shaped carrier, as well as an oven
05/06/2009EP2055419A1 Method of soldering a magnesium alloy workpiece with electroless plating with Nickel-Phosphrous, fluxing and use of a leadfree tin alloy solder
05/06/2009EP2054187A2 Air soldering unit
05/06/2009CN101427613A Substrate joining member and three-dimensional structure using the same
05/06/2009CN101423938A Metallic material for brazing, brazing method, and heat exchanger
05/06/2009CN100485784C Magnetic head assembly
05/06/2009CN100484677C Heat radiator production method
04/2009
04/30/2009WO2009055758A2 Electric induction brazing in an inert atmosphere
04/30/2009WO2009027656A3 Fluxer for soldering apparatus
04/30/2009WO2008061135A3 Optical member
04/30/2009US20090111299 Surface Mount Array Connector Leads Planarization Using Solder Reflow Method
04/30/2009US20090110955 Nickel-based brazing foil and process for brazing
04/30/2009US20090108052 Selective soldering using fiber optic device
04/30/2009CA2703755A1 Electric induction brazing in an inert atmosphere
04/29/2009EP2051829A1 Method of producing or repairing turbine or engine components, and a component, namely a turbine or engine component
04/29/2009CN201227707Y Transverse refluxing mixed gas heating apparatus
04/29/2009CN101417358A Circuit board element dismounting device
04/29/2009CN100483763C Method for preparing copper film thicken copper-coating ceramic substrate
04/28/2009US7525064 Method of forming a flux layer on an aluminum plate member
04/28/2009US7523849 Ultrasonic welding method, ultrasonic welding device and pipe joined by the same
04/28/2009CA2377689C Method of plugging a hole and a cooling element manufactured by said method
04/23/2009WO2009051031A1 Method of repair
04/23/2009WO2009050956A1 Solder melting method, method for manufacturing mounting substrate, and solder melting apparatus
04/23/2009WO2008016345A3 Joined concentric tubes
04/22/2009EP2002915A9 Method for fabricating dissimilar material jointed body
04/22/2009CN201224008Y Chain fixture for welding magnetron high voltage capacitor
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