Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
12/2008
12/11/2008US20080302861 Method and apparatus for wave soldering an electronic substrate
12/11/2008US20080302859 Method of reflow soldering a printed circuit board wherein an electroconductive coating material is used
12/11/2008CA2688385A1 Method and apparatus for removing contaminants from a reflow apparatus
12/10/2008EP1999088A1 Apparatus and methods for bonding carbon-carbon composites through a reactant layer
12/10/2008CN101322232A Solder deposition and thermal processing of thin-die thermal interface material
12/10/2008CN101318245A Tube fin brazing process and internal tube heating soldering machine for
12/10/2008CN100441993C Convection furnace thermal profile enhancement
12/10/2008CN100441352C Brazing method of products containing stainless steel parts
12/09/2008US7462255 Method for producing by laser gastight and high-temperature resistant connections of shaped parts made of a non-oxidic ceramic
12/09/2008US7461770 Excellent resistance to surface oxidation in air and/or atmospheric humidity; to produce excellent brazed joints; joins without any defects
12/09/2008US7461768 Camera-assisted adjustment of bonding head elements
12/04/2008WO2008148119A1 Improved soldering apparatus and soldering tip
12/04/2008WO2008146815A1 Heating furnace
12/04/2008WO2008145513A2 Method for soldering
12/04/2008WO2008103714A3 Transfer mask in micro-ball mounter
12/04/2008US20080296355 Direct ball dispenser
12/04/2008US20080296349 Method for treating metal member
12/04/2008US20080296348 Heater for select solder machine
12/04/2008US20080296266 Processing apparatus
12/04/2008US20080295966 Electrode Assembly For The Removal Of Surface Oxides By Electron Attachment
12/04/2008US20080295686 Method and apparatus for removing contaminants from a reflow apparatus
12/04/2008DE102007025529A1 Verfahren zum Löten The method of soldering
12/03/2008EP1996362A2 Thermal chuck and processes for manufacturing the thermal chuck
12/03/2008EP1996361A2 Method for soldering components
12/03/2008CN101314192A Connecting method for metallic material and non-metallic composite
12/03/2008CN100441070C Jetting device and method at a jetting device
12/03/2008CN100440471C Method for manufacturing electronic device
12/03/2008CN100439029C Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering
12/02/2008US7459653 Device for compacting and/or welding electric conductors
12/02/2008US7458499 Apparatus and method for filling a ball grid array template
12/02/2008US7458495 Flip chip bonding tool
11/2008
11/27/2008WO2008142043A1 Method for controlling process gas concentration
11/27/2008US20080292898 Formed core sandwich structure and method and system for making same
11/27/2008US20080290141 Manufacture of Shape Memory Alloy Cellular Materials and Structures by Transient-Liquid Reactive Joining
11/27/2008US20080290137 Microwave brazing process
11/27/2008US20080290136 Solder supplying method
11/27/2008DE102007026323B3 Device for securing electrical, prefabricated connecting parts e.g. solder points, solder contacts or plug connectors on uniform/curved panes, comprises position recognition mechanism, pane reception table, reception means, and closure
11/27/2008DE102007024266A1 Verfahren zur Steuerung der Prozessgaskonzentration Method for controlling the process gas concentration
11/27/2008DE102007022596A1 Procedure for heating workpieces in reflow and steam phases of soldering system, comprises regulating heat quantity and heating power through determination of the mass of the workpiece and/or soldering goods over load cells/force receiver
11/27/2008DE102007004131B4 Verfahren zur Herstellung eines Wärmeaustauschers und danach hergestellter Wärmetauscher A method of manufacturing a heat exchanger and then produced heat exchanger
11/26/2008EP1993771A2 Method of welding together at least two stacked members
11/26/2008CN101311868A Tip-off thermostatic control device and its control method
11/26/2008CN101310907A New technique of tin sealing the real cap of branch dispenser
11/26/2008CN100436019C Method for preparing carbon-base material-copper connector used as thermonuclear reactor component under high heat flux
11/25/2008US7455811 brazing material with mainly the same composition as the base material used for producing the product, at which the brazing material contains additive elements which lower its liquidus temperature
11/20/2008WO2008064257A3 Method for brazing and hot forming a multichannel heat exchanger, the hot forming using the heating energy of the brazing step
11/20/2008DE102007024221A1 Verfahren zum Herstellen einer Sprühdüse und Sprühdüse A method for producing a spray nozzle and spray nozzle
11/19/2008EP1992413A1 Method for manufacturing a spray nozzle and spray nozzle
11/19/2008CN101310572A Soldering apparatus and soldering method
11/19/2008CN101309771A Reflow apparatus
11/19/2008CN101308981A Welding process and device using infrared heating
11/19/2008CN100435432C Solder dispenser
11/19/2008CN100435306C Method of spot welding for minitype sensor
11/19/2008CN100435303C Method for aligning the bondhead of a die bonder
11/19/2008CN100434218C Application method of surface alloying ceramic
11/18/2008US7452798 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
11/18/2008US7451908 Furnace brazing process
11/18/2008US7451906 Products for use in low temperature fluxless brazing
11/18/2008US7451905 Wire bonding wedge
11/13/2008WO2008135345A1 Repair soldering head for a surface-mounted component and method for the operation thereof
11/13/2008US20080277457 Device and method for wave soldering
11/13/2008DE202006020509U1 Vorrichtung zum Löten von Metallbauteilen in einer Schutzgasatmosphäre The apparatus for soldering metal components in a protective gas atmosphere
11/13/2008DE102007022632A1 Verfahren zum Verbinden von Bauteilen aus hochfestem Aluminium-Material und nach diesem Verfahren montierter Wärmeübertrager Method for joining components made of high-strength aluminum material and by this process mounted heat exchanger
11/13/2008CA2680788A1 Self-contained keyhole weld fitting and method of use
11/12/2008EP1332014B1 Method for making a heat exchanger with soldered plates and resulting heat exchanger
11/12/2008CN101305170A Honeycomb for an exhaust treatment unit
11/12/2008CN101304833A Amplitude adjustment of an ultrasonic horn
11/12/2008CN101304064A LED heating heat sink rear using laser and heat sink bonding method
11/12/2008CN101303989A Solder bump forming method and apparatus
11/12/2008CN101301695A Connecting method of heat exchange aluminium tube
11/12/2008CN100431772C Solder using for impregnated barium-tungsten cathode and method for using same
11/12/2008CN100431770C Impregnated barium-tungsten cathode solder and method for using same
11/12/2008CN100431769C method for inert gas welding or inert gas soldering workpieces comprising identical or different metals or metal alloys by means of an additional Zn/Al metal
11/06/2008US20080274349 Multipath Soldered Thermal Interface Between a Chip and its Heat Sink
11/06/2008US20080272181 Method for making nanostructured soldered or brazed joints with reactive multilayer foils
11/06/2008US20080272180 Method of manufacturing heat spreader module
11/06/2008US20080272112 Hard-Soldering Method and Device
11/06/2008US20080272098 Method for electric arc joining
11/06/2008US20080271997 Sputter target and backing plate assembly
11/06/2008DE202008011595U1 Vorrichtung zur thermischen Behandlung von Werkstücken Device for thermal treatment of workpieces
11/06/2008DE102007020389A1 Jointing process for joints between components involves placing nano- or microstructured material between components and initiating exothermal reaction
11/05/2008EP1987903A2 Layered structures with integral brazing materials
11/05/2008EP1987902A1 Brazing process incorporating graphitic preforms
11/05/2008EP1987901A1 Method of light arc joining under a protective gas comprising Argon, Helium and Oxygen and/or Carbon dioxide
11/05/2008CN201143594Y Inversion type plasma cutting power supply controller based on DSP digitalization
11/05/2008CN201143586Y Ceramic soldering tin stove
11/05/2008CN201143585Y Vacuum/controllable atmosphere eutectic furnace
11/05/2008CN101298108A Technique for vacuum brazing titanium alloy and steel
11/05/2008CN100431065C Ceramic electronic element with leads
11/05/2008CN100430611C Valve having junction type housing
11/05/2008CN100430172C Method for soldering miniaturised components to a base plate
11/04/2008US7445140 Production method of ultrasonic weld assembly
10/2008
10/30/2008WO2008128949A2 Method for producing a composite including at least one non-flat component
10/30/2008WO2008128848A1 Polymer-based ceramic coatings for protecting surfaces against fluoride ions during a cleaning process
10/30/2008US20080265006 Method for bonding electronic components finished with electroless NiXP for preventing brittle fracture
10/30/2008US20080265005 Brazing process incorporating graphitic preforms
10/30/2008US20080263865 Applying nickel base solder then cubic boron nitride hard particles coated with titanium containing material; vacuum fusing for matrix formation and fixing through cooling; rotating high pressure compressor blade of gas turbine
10/30/2008DE102008001228A1 Verfahren zum Herstellen eines Verbundes mit zumindest einem nicht plattenförmigen Bauteil A method of manufacturing a composite having at least one non-plate-shaped component
10/30/2008DE102007019055A1 Method for adjusting temperature of electronic components heated using hot air uses signals from temperature sensor to suddenly reduce flow of air to heater when temperature of component reaches threshold value
10/29/2008EP1687114A4 Vertical removal of excess solder from a circuit substrate
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