Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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12/11/2008 | US20080302861 Method and apparatus for wave soldering an electronic substrate |
12/11/2008 | US20080302859 Method of reflow soldering a printed circuit board wherein an electroconductive coating material is used |
12/11/2008 | CA2688385A1 Method and apparatus for removing contaminants from a reflow apparatus |
12/10/2008 | EP1999088A1 Apparatus and methods for bonding carbon-carbon composites through a reactant layer |
12/10/2008 | CN101322232A Solder deposition and thermal processing of thin-die thermal interface material |
12/10/2008 | CN101318245A Tube fin brazing process and internal tube heating soldering machine for |
12/10/2008 | CN100441993C Convection furnace thermal profile enhancement |
12/10/2008 | CN100441352C Brazing method of products containing stainless steel parts |
12/09/2008 | US7462255 Method for producing by laser gastight and high-temperature resistant connections of shaped parts made of a non-oxidic ceramic |
12/09/2008 | US7461770 Excellent resistance to surface oxidation in air and/or atmospheric humidity; to produce excellent brazed joints; joins without any defects |
12/09/2008 | US7461768 Camera-assisted adjustment of bonding head elements |
12/04/2008 | WO2008148119A1 Improved soldering apparatus and soldering tip |
12/04/2008 | WO2008146815A1 Heating furnace |
12/04/2008 | WO2008145513A2 Method for soldering |
12/04/2008 | WO2008103714A3 Transfer mask in micro-ball mounter |
12/04/2008 | US20080296355 Direct ball dispenser |
12/04/2008 | US20080296349 Method for treating metal member |
12/04/2008 | US20080296348 Heater for select solder machine |
12/04/2008 | US20080296266 Processing apparatus |
12/04/2008 | US20080295966 Electrode Assembly For The Removal Of Surface Oxides By Electron Attachment |
12/04/2008 | US20080295686 Method and apparatus for removing contaminants from a reflow apparatus |
12/04/2008 | DE102007025529A1 Verfahren zum Löten The method of soldering |
12/03/2008 | EP1996362A2 Thermal chuck and processes for manufacturing the thermal chuck |
12/03/2008 | EP1996361A2 Method for soldering components |
12/03/2008 | CN101314192A Connecting method for metallic material and non-metallic composite |
12/03/2008 | CN100441070C Jetting device and method at a jetting device |
12/03/2008 | CN100440471C Method for manufacturing electronic device |
12/03/2008 | CN100439029C Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering |
12/02/2008 | US7459653 Device for compacting and/or welding electric conductors |
12/02/2008 | US7458499 Apparatus and method for filling a ball grid array template |
12/02/2008 | US7458495 Flip chip bonding tool |
11/27/2008 | WO2008142043A1 Method for controlling process gas concentration |
11/27/2008 | US20080292898 Formed core sandwich structure and method and system for making same |
11/27/2008 | US20080290141 Manufacture of Shape Memory Alloy Cellular Materials and Structures by Transient-Liquid Reactive Joining |
11/27/2008 | US20080290137 Microwave brazing process |
11/27/2008 | US20080290136 Solder supplying method |
11/27/2008 | DE102007026323B3 Device for securing electrical, prefabricated connecting parts e.g. solder points, solder contacts or plug connectors on uniform/curved panes, comprises position recognition mechanism, pane reception table, reception means, and closure |
11/27/2008 | DE102007024266A1 Verfahren zur Steuerung der Prozessgaskonzentration Method for controlling the process gas concentration |
11/27/2008 | DE102007022596A1 Procedure for heating workpieces in reflow and steam phases of soldering system, comprises regulating heat quantity and heating power through determination of the mass of the workpiece and/or soldering goods over load cells/force receiver |
11/27/2008 | DE102007004131B4 Verfahren zur Herstellung eines Wärmeaustauschers und danach hergestellter Wärmetauscher A method of manufacturing a heat exchanger and then produced heat exchanger |
11/26/2008 | EP1993771A2 Method of welding together at least two stacked members |
11/26/2008 | CN101311868A Tip-off thermostatic control device and its control method |
11/26/2008 | CN101310907A New technique of tin sealing the real cap of branch dispenser |
11/26/2008 | CN100436019C Method for preparing carbon-base material-copper connector used as thermonuclear reactor component under high heat flux |
11/25/2008 | US7455811 brazing material with mainly the same composition as the base material used for producing the product, at which the brazing material contains additive elements which lower its liquidus temperature |
11/20/2008 | WO2008064257A3 Method for brazing and hot forming a multichannel heat exchanger, the hot forming using the heating energy of the brazing step |
11/20/2008 | DE102007024221A1 Verfahren zum Herstellen einer Sprühdüse und Sprühdüse A method for producing a spray nozzle and spray nozzle |
11/19/2008 | EP1992413A1 Method for manufacturing a spray nozzle and spray nozzle |
11/19/2008 | CN101310572A Soldering apparatus and soldering method |
11/19/2008 | CN101309771A Reflow apparatus |
11/19/2008 | CN101308981A Welding process and device using infrared heating |
11/19/2008 | CN100435432C Solder dispenser |
11/19/2008 | CN100435306C Method of spot welding for minitype sensor |
11/19/2008 | CN100435303C Method for aligning the bondhead of a die bonder |
11/19/2008 | CN100434218C Application method of surface alloying ceramic |
11/18/2008 | US7452798 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
11/18/2008 | US7451908 Furnace brazing process |
11/18/2008 | US7451906 Products for use in low temperature fluxless brazing |
11/18/2008 | US7451905 Wire bonding wedge |
11/13/2008 | WO2008135345A1 Repair soldering head for a surface-mounted component and method for the operation thereof |
11/13/2008 | US20080277457 Device and method for wave soldering |
11/13/2008 | DE202006020509U1 Vorrichtung zum Löten von Metallbauteilen in einer Schutzgasatmosphäre The apparatus for soldering metal components in a protective gas atmosphere |
11/13/2008 | DE102007022632A1 Verfahren zum Verbinden von Bauteilen aus hochfestem Aluminium-Material und nach diesem Verfahren montierter Wärmeübertrager Method for joining components made of high-strength aluminum material and by this process mounted heat exchanger |
11/13/2008 | CA2680788A1 Self-contained keyhole weld fitting and method of use |
11/12/2008 | EP1332014B1 Method for making a heat exchanger with soldered plates and resulting heat exchanger |
11/12/2008 | CN101305170A Honeycomb for an exhaust treatment unit |
11/12/2008 | CN101304833A Amplitude adjustment of an ultrasonic horn |
11/12/2008 | CN101304064A LED heating heat sink rear using laser and heat sink bonding method |
11/12/2008 | CN101303989A Solder bump forming method and apparatus |
11/12/2008 | CN101301695A Connecting method of heat exchange aluminium tube |
11/12/2008 | CN100431772C Solder using for impregnated barium-tungsten cathode and method for using same |
11/12/2008 | CN100431770C Impregnated barium-tungsten cathode solder and method for using same |
11/12/2008 | CN100431769C method for inert gas welding or inert gas soldering workpieces comprising identical or different metals or metal alloys by means of an additional Zn/Al metal |
11/06/2008 | US20080274349 Multipath Soldered Thermal Interface Between a Chip and its Heat Sink |
11/06/2008 | US20080272181 Method for making nanostructured soldered or brazed joints with reactive multilayer foils |
11/06/2008 | US20080272180 Method of manufacturing heat spreader module |
11/06/2008 | US20080272112 Hard-Soldering Method and Device |
11/06/2008 | US20080272098 Method for electric arc joining |
11/06/2008 | US20080271997 Sputter target and backing plate assembly |
11/06/2008 | DE202008011595U1 Vorrichtung zur thermischen Behandlung von Werkstücken Device for thermal treatment of workpieces |
11/06/2008 | DE102007020389A1 Jointing process for joints between components involves placing nano- or microstructured material between components and initiating exothermal reaction |
11/05/2008 | EP1987903A2 Layered structures with integral brazing materials |
11/05/2008 | EP1987902A1 Brazing process incorporating graphitic preforms |
11/05/2008 | EP1987901A1 Method of light arc joining under a protective gas comprising Argon, Helium and Oxygen and/or Carbon dioxide |
11/05/2008 | CN201143594Y Inversion type plasma cutting power supply controller based on DSP digitalization |
11/05/2008 | CN201143586Y Ceramic soldering tin stove |
11/05/2008 | CN201143585Y Vacuum/controllable atmosphere eutectic furnace |
11/05/2008 | CN101298108A Technique for vacuum brazing titanium alloy and steel |
11/05/2008 | CN100431065C Ceramic electronic element with leads |
11/05/2008 | CN100430611C Valve having junction type housing |
11/05/2008 | CN100430172C Method for soldering miniaturised components to a base plate |
11/04/2008 | US7445140 Production method of ultrasonic weld assembly |
10/30/2008 | WO2008128949A2 Method for producing a composite including at least one non-flat component |
10/30/2008 | WO2008128848A1 Polymer-based ceramic coatings for protecting surfaces against fluoride ions during a cleaning process |
10/30/2008 | US20080265006 Method for bonding electronic components finished with electroless NiXP for preventing brittle fracture |
10/30/2008 | US20080265005 Brazing process incorporating graphitic preforms |
10/30/2008 | US20080263865 Applying nickel base solder then cubic boron nitride hard particles coated with titanium containing material; vacuum fusing for matrix formation and fixing through cooling; rotating high pressure compressor blade of gas turbine |
10/30/2008 | DE102008001228A1 Verfahren zum Herstellen eines Verbundes mit zumindest einem nicht plattenförmigen Bauteil A method of manufacturing a composite having at least one non-plate-shaped component |
10/30/2008 | DE102007019055A1 Method for adjusting temperature of electronic components heated using hot air uses signals from temperature sensor to suddenly reduce flow of air to heater when temperature of component reaches threshold value |
10/29/2008 | EP1687114A4 Vertical removal of excess solder from a circuit substrate |