Patents for B23K 101 - Articles made by soldering, welding or cutting (5,065)
09/2003
09/24/2003CN1444273A 电子装置 Electronic devices
09/23/2003US6623693 Aluminum alloy composition, article and method of use
09/23/2003US6622904 Friction stir bonding method
09/18/2003WO2003077295A1 Method for dicing substrate
09/18/2003US20030173065 Method for producing a structural member from plates stacked on top of each other and soldered together
09/17/2003CN1443112A Stainless sheet honeycomb panel and method for mfg. thereof
09/17/2003CN1442892A Manufacturing method of semiconductor device and electron device, calculating method of welding condition
09/16/2003US6621639 Device for converting the intensity distribution of a laser beam and a device and method for generating a laser beam with an intensity which falls constantly along an axis from one side of the beam to the other
09/16/2003US6619531 Temperature control method of solder bumps in reflow furnace, and reflow furnace
09/12/2003WO2003074224A1 Laser machining method
09/12/2003WO2003074222A1 Operating method and trolley for a laser machining system
09/11/2003US20030168975 Patterning thin film layers for electroluminescent displays
09/11/2003US20030168499 Soldering method and solder joint member
09/11/2003US20030168435 Method and apparatus for laser processing
09/10/2003EP1342259A1 Semiconductor wafer processing to increase the usable planar surface area
09/10/2003EP1226031B1 Method for producing multi-phase composite materials
09/10/2003EP1097011B1 A method of joining at least four heat transfer plates to a plate package, and a plate package
09/10/2003CN1441963A UV laser system and method for single pulse servering of IC fuses
09/04/2003WO2003073810A1 Method for boring holes in a substrate, especially an electrical circuit substrate, by means of a laser beam
09/04/2003WO2003073478A2 Plasma-resistant, welded aluminum structures for use in semiconductor processing apparatus
09/04/2003WO2003072289A2 Method of producing metallic packaging
09/04/2003WO2003052890B1 Processing a memory link with a set of at least two laser pulses
09/04/2003CA2476847A1 Method of producing metallic packaging
09/02/2003US6613599 Electro-optical device, method of manufacturing electro-optical device, liquid crystal device, method of manufacturing liquid crystal device and electronic apparatus
09/02/2003US6613397 Method and apparatus for manufacturing an aluminum clad product
09/02/2003US6612477 Strip joining apparatus
09/02/2003US6612012 Method of manufacturing small profile medical devices
08/2003
08/28/2003WO2003070994A2 Lead-free tin-silver-copper alloy solder composition
08/28/2003US20030160085 Plasma-resistant, welded aluminum structures for use in semiconductor apparatus
08/26/2003US6610962 Method for producing a crack resistant weld
08/26/2003US6610960 Method for drilling micro-holes with a laser beam
08/26/2003US6610463 Method of manufacturing structure having pores
08/26/2003US6609648 Ultrasonic bonding method of electric wires
08/21/2003US20030156969 Coupling electroconductive pads
08/21/2003US20030155407 Process for the monolithic molding of superplastic material
08/21/2003US20030155333 Method and apparatus for cutting a substrate using laser irradiation
08/20/2003EP1175288A4 Self-sharpening, laminated cutting tool and method for making the tool
08/14/2003US20030152795 Metal substrate for carrying catalyst and method for manufacturing the same
08/14/2003US20030151479 Latching micro magnetic relay packages and methods of packaging
08/14/2003DE10224198C1 Light structural element has encompassing circle with diameter of at least 300 mm and wall thickness of maximum of 5 per cent of this
08/13/2003EP1334810A1 Circuit board production method and circuit board production data
08/13/2003CN1435535A Welding apparatus
08/13/2003CN1117649C Cutting mold mfg. method
08/13/2003CN1117640C Device and method for mfg. expanded material
08/12/2003US6604499 Oil-through type push rod
08/12/2003US6604282 Circuit board manufacturing method
08/07/2003WO2003065420A2 Method for producing a semiconductor element
08/07/2003DE10209617C1 Laser processing method, for rapidly boring holes in dielectric substrates, comprises deviating a laser beam produced by a carbon dioxide laser onto the substrate to be processed using a deviating unit
08/05/2003US6602104 Simplified miniature xenon arc lamp
07/2003
07/31/2003WO2003062485A1 Procedure and arrangement for coating a metal surface with a thin layer containing metal
07/31/2003WO2003061892A1 Flux collection method and system
07/31/2003WO2003061891A2 Laser marking
07/31/2003US20030141287 For unidirectionally homogenizing an energy density of laser light emitted from the laser
07/31/2003US20030141283 Rail welding device
07/30/2003EP1331463A2 Method for producing an integrated heat exchanger and an integrated heat exchanged produced thereby
07/30/2003EP1331309A2 Method for welding rails for railway carriages
07/30/2003EP1331283A1 Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor
07/29/2003US6600152 Device for treating a substrate having a rotating polygonal mirror with inclined faces and a system of adjacent focusing lenses
07/29/2003US6599641 Structural body formed by friction stir welding of hollow extruded frame members
07/29/2003US6599372 Water insoluble resin dispersed in water, activating agent is organic acid or halogen compound; resin is pentaerythritol ester of hydrogenated rosin; printed circuit board
07/29/2003US6598782 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection
07/28/2003CA2418677A1 A welding unit
07/24/2003WO2003059568A1 Method for laser machining a workpiece with laser spot enlargement
07/24/2003US20030139068 Method of Illumination with linearly polarized laser radiation
07/24/2003US20030138999 Laser irradiation apparatus
07/24/2003US20030136771 Method and apparatus for forming a nozzle in an element for an ink jet print head
07/24/2003US20030136020 Flux collection method and system
07/24/2003CA2469520A1 Method for laser machining a workpiece with laser spot enlargement
07/23/2003EP1329603A1 Metal substrate for carrying catalyst and method for manufacturing the same
07/23/2003EP1328372A1 Control of laser machining
07/23/2003EP1328371A1 Process for laser machining continuous metal strip
07/22/2003US6596965 Method and apparatus for marking an identification mark on a wafer
07/17/2003US20030134144 Method for producing a laminated tool steel material and the tool steel material thus produced
07/17/2003US20030134143 Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor
07/17/2003US20030132273 Reflowing of solder joints
07/16/2003EP1131595B1 Heat exchanger member
07/16/2003CN1430542A Improved apparatus and method for dispensing solder
07/15/2003US6594149 Liquid cooled circuit device
07/15/2003US6593542 UV laser system and method for single pulse severing of IC fuses
07/10/2003WO2003056592A1 Solder ring for production of vacuum tube and method for the production of such a solder ring and of a vacuum tube
07/10/2003WO2003055636A1 Method of laser ablation for patterning thin film layers for electroluminescent displays
07/10/2003US20030127498 Gas injection type soldering method and apparatus
07/10/2003CA2469500A1 Method of laser ablation for patterning thin film layers for electroluminescent displays
07/08/2003US6589670 Soldering material of this type is suitable in particular for honeycomb bodies, preferably for the catalytic conversion of gas, in particular of exhaust gases
07/08/2003US6588648 Method and device for transferring a hollow-profile blank
07/08/2003US6588647 Liquid cooled circuit device and a manufacturing method thereof
07/03/2003WO2003053627A1 Method of laser machining a fluid slot
07/03/2003US20030124376 Friction stir welding method, and hollow shape member for friction stir welding
07/03/2003US20030124375 Friction stir welding method, and hollow shape member for friction stir welding
07/02/2003CN1427666A Local welding method for printed substrate and apparatus thereof
07/01/2003US6586707 Control of laser machining
07/01/2003US6585149 Packaging method using lead-free solder
06/2003
06/26/2003WO2003052890A1 Processing a memory link with a set of at least two laser pulses
06/26/2003US20030117449 Method of laser machining a fluid slot
06/26/2003US20030116726 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
06/26/2003US20030116610 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection
06/26/2003US20030116544 Method for processing ceramic green sheet and laser beam machine used therefor
06/26/2003US20030116543 Process for laser machining continuous metal strip
06/26/2003US20030116352 Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly
06/26/2003CA2436227A1 Processing a memory link with a set of at least two laser pulses
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