Patents for B23K 101 - Articles made by soldering, welding or cutting (5,065)
01/2005
01/26/2005EP1500316A1 Method for creating a trench structure in a polymer substrate
01/20/2005US20050011933 Method and device for joining of metal components, particularly light metal components
01/20/2005US20050011636 Aluminum heat exchanger excellent in corrosion resistance
01/20/2005DE102004004459A1 Verfahren zur Herstellung einer aktiven Kühltafel aus Thermostruktur-Kompositwerkstoff A method for producing an active cooling panel of thermostructural composite material
01/19/2005EP1497851A2 Program-controlled dicing of a substrate using a pulsed laser
01/19/2005EP1113901B1 Method and apparatus for marking containers using laser light
01/19/2005CN1185076C Laser cutting of semiconductor materials
01/19/2005CN1185063C 结构体 Structure
01/13/2005US20050009307 Laser beam processing method and laser beam processing machine
01/13/2005US20050006443 Brazing method
01/13/2005US20050006361 Machining apparatus utilizing laser beam
01/13/2005US20050006358 Laser beam processing method and laser beam processing machine
01/13/2005US20050006351 Method and device for changing the rolls of a tube welding stand
01/13/2005US20050006079 Heat exchanger and manufacturing method for the same
01/12/2005EP1495825A2 Brazing method
01/12/2005CN1564725A Three components linked to each other by means of a welded connection
01/11/2005US6841482 Laser machining of semiconductor materials
01/11/2005US6840426 Friction stir welding method and structure body formed by friction stir welding
01/06/2005US20050000091 Method for manufacturing a stator or rotor component
01/05/2005EP1494271A1 Method for dicing substrate
01/05/2005EP1493527A1 Method and device for manufacturing a helicoidal welded tube made of hot rolled steel
01/05/2005EP1492660A1 A method in the manufacture of a packaging laminate, a plant in the manufacture of the packaging laminate, and the thus manufactured packaging laminate
01/05/2005CN1561277A A laser machining system and method
01/05/2005CN1183811C Method and device for laser drilling laminates
01/05/2005CN1183623C Irreversible circuit apparatus, communication apparatus and method for producing irreversible circuit apparatus
01/05/2005CN1183273C Method and device for producing wear-resistant tribological cylinder running surfaces
01/05/2005CN1182936C Beam shaping and projection imaging with solid state UV gaussien beam to form vias
01/04/2005US6838038 Laser ablation method for patterning a thin film layer
12/2004
12/30/2004US20040263275 Nonreciprocal circuit device, communication device, and method of manufacturing nonreciprocal circuit device
12/30/2004US20040262269 Hybrid laser-arc welding method with gas flow rate adjustment
12/30/2004DE102004020270A1 Laserstrahl-Bearbeitungsmaschine Laser beam processing machine
12/29/2004EP1133376B1 Laser system
12/23/2004WO2004110666A1 Method for connecting thin tube to heat transfer tube
12/23/2004US20040259329 Machining substrates, particulary semiconductor wafers
12/23/2004US20040257750 Heat pipe circuit board
12/23/2004US20040256439 Device and method for joining the faces of parts
12/23/2004US20040256368 Chip scale marker and method of calibrating marking position
12/23/2004DE10392167T5 Schweißverfahren und Struktur, die unter Anwendung des Verfahrens hergestellt ist Welding method and structure that is prepared using the method
12/23/2004DE10350349B3 Laser machining method for electrical circuit board has size and shape of individual machining fields matched to surface area of circle provided by imaging unit for laser beam
12/22/2004EP1488880A2 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method
12/22/2004EP1487606A1 Automatic welding device using radiation heat source for manufacturing cutting tool and automatic welding method thereof
12/22/2004EP1101260A4 Controlling laser polarization
12/21/2004US6833528 Method and apparatus for laser processing
12/21/2004US6833198 Copper clad laminate
12/16/2004WO2004109783A1 Process for fabricating semiconductor device
12/16/2004WO2004108337A1 Method for brazing aluminum material
12/16/2004US20040253474 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method
12/15/2004EP1486104A2 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
12/15/2004CN1555666A Laser drilling,particular laser drilling method with a perforated mask
12/15/2004CN1180401C Load/unload lift tab for disk drive and its leveling method
12/15/2004CN1179818C Laser processor
12/14/2004US6829824 Method for producing a structural member from plates stacked on top of each other and soldered together
12/14/2004CA2315650C Electric welding apparatus and method
12/09/2004US20040247477 Production of the metallic parts with the alloyed layer containing dispersed compound particles, and the wear-proof parts
12/09/2004US20040244360 Rocket engine tubular chamber with single piece jacket
12/08/2004EP1484571A2 Aluminium heat exchanger excellent in corrosion resistance
12/08/2004EP1484496A1 Rocket engine tubular combustion chamber with single piece jacket
12/08/2004EP1483419A2 Lead−free tin−silver−copper alloy solder composition
12/08/2004EP1483076A2 Method of producing metallic packaging
12/07/2004US6828523 Method and device for the formation of pipes
12/04/2004CA2469373A1 The production of the metallic parts with the alloyed layer containing dispersed compound particles, and the wear-proof parts
12/02/2004US20040241962 Method of dividing a non-metal substrate
12/02/2004US20040238604 Method for brazing magnesium-containing aluminum alloy material
12/02/2004US20040238496 Welding device and method
12/02/2004DE10392185T5 Verfahren zur Laserbearbeitung eines Werkstücks mit Laserpunktvergrösserung A method of laser processing a workpiece with laser spot enlargement
12/01/2004EP1480780A1 Laser machining method
12/01/2004EP1480778A1 Operating method and trolley for a laser machining system
12/01/2004EP1480777A2 Plasma-resistant, welded aluminum structures for use in semiconductor processing apparatus
12/01/2004EP1195217B1 Method of soldering using lead-free solder
12/01/2004EP1116422B1 Electrical device
12/01/2004CN1178100C Method for producing reflector and liquid crystal display
12/01/2004CN1178055C Anaytical system of closing indoor atmosphere with alloy soldering or during tinplating
12/01/2004CN1177670C Laser processing method
12/01/2004CN1177664C Method for welding pipeline
11/2004
11/25/2004US20040232208 Ultrasonic bonding method of coated electric wires and ultrasonic bonding apparatus using same
11/25/2004US20040232124 Workpiece dividing method utilizing laser beam
11/25/2004US20040231156 Flat metal product, especially for use as wall for a heat exchanger, and heat exchanger having a double wall from copper and titanium
11/23/2004US6822725 Liquid crystal display substrates integrated by sealant formed inside cutting lines
11/23/2004US6822309 Apparatus for selectively cutting fuse electrodes
11/23/2004US6822191 Method for producing a trench structure in a polymer substrate
11/23/2004US6821639 Metal substrate for carrying catalyst and method for manufacturing the same
11/18/2004WO2004100629A1 Flux transferring device and method of transferring flux
11/18/2004WO2004099697A1 Flat tube for aluminium heat exchanger
11/18/2004DE102004014703A1 Wärmeverteilermodul und Verfahren zur Herstellung desselben Heat spreader module and method of manufacturing the same
11/17/2004EP1331283B1 Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor
11/17/2004EP1222049B1 Method and device for joining a support matrix of a honeycomb on the end face using bonding technology
11/11/2004US20040222200 Brazed copper heat exchangers and process for manufacturing them by welding
11/10/2004EP1474540A1 Procedure and arrangement for coating a metal surface with a thin layer containing metal
11/10/2004EP1474261A1 Flux collection method and system
11/10/2004CN1545826A Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil
11/04/2004US20040217093 Method and apparatus for laser drilling
11/04/2004DE102004018640A1 Lotaufschmelzofen Solder reflow oven
11/03/2004EP1181126B1 Automatic method and installation of multiple plasma jet welding
11/03/2004CN1174446C Laminated ceramic electronic parts and its mfg. method
10/2004
10/28/2004WO2004093174A1 Laser processing apparatus and laser processing method
10/28/2004US20040214388 Laser irradiation apparatus, laser irradiation method, and manufacturing method for a semiconductor device
10/28/2004US20040211762 Laser beam processing machine
10/27/2004EP1470573A2 Method for producing a semiconductor element
10/27/2004EP1469969A2 Laser marking
10/27/2004CN1539590A Laser working machine
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