| Patents for B23K 101 - Articles made by soldering, welding or cutting (5,065) |
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| 10/12/2005 | CN1680063A Two tier brazing process for joining copper tubes to manifolds |
| 10/11/2005 | US6953144 Friction stir wilding method and structure body |
| 10/06/2005 | US20050218525 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device |
| 10/06/2005 | US20050218197 Solder heating system |
| 10/06/2005 | US20050218196 Two tier brazing for joining copper tubes to manifolds |
| 10/06/2005 | DE102005010377A1 Separation of chip components on a wafer uses a weakened wafer layer along the grid of cutting lines, between the chips, to be penetrated by a pulsed laser beam and broken apart along the weakened separation lines |
| 10/05/2005 | EP1582898A1 Optical cable unit with steel tube with inner copper coating |
| 10/05/2005 | EP1582287A1 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device |
| 10/05/2005 | EP1582281A1 Solder handling system |
| 10/05/2005 | EP1436116A4 Composite billet and method of manufacturing same for production of clad piping and tubing |
| 10/05/2005 | CN1676266A Device for sealed-cutting metal section using ultrasonic welding device |
| 10/05/2005 | CN1676260A Solder handling system |
| 10/05/2005 | CN1222202C Local welding method for printed substrate and apparatus thereof |
| 10/04/2005 | US6951800 Method of making semiconductor device that has improved structural strength |
| 09/29/2005 | WO2005090862A1 Alloy-coated boiler part and method of welding self-fluxing alloy-coated boiler part |
| 09/29/2005 | US20050215078 Scribing sapphire substrates with a solid state UV laser |
| 09/29/2005 | US20050213022 Method and apparatus for correcting a defective pixel of a liquid crystal display |
| 09/29/2005 | US20050212906 Methods and systems for processing a device, methods and systems for modeling same and the device |
| 09/29/2005 | US20050210670 Wire loader |
| 09/28/2005 | EP1580800A1 Method for cutting semiconductor substrate |
| 09/28/2005 | EP1579989A1 Drilling apparatus of printing press |
| 09/28/2005 | CN1675020A Laser processing device, processing method, and method of producing circuit substrate using the method |
| 09/28/2005 | CN1674991A Process and apparatus for producing honeycomb bodies and honeycomb body produced by the process |
| 09/28/2005 | CN1673835A Method and apparatus for correcting a defective pixel of a liquid crystal display |
| 09/28/2005 | CN1672927A Drilling apparatus of printing press |
| 09/28/2005 | CN1220966C Thin membrane marking system and controlling method thereof |
| 09/22/2005 | US20050205527 Method and a device for depositing a welding material in an annular facing machined in a spherical wall |
| 09/22/2005 | US20050205524 Method of manufacturing tape wiring substrate |
| 09/22/2005 | US20050205516 Wiring board and process for producing the same |
| 09/22/2005 | US20050204595 Wire marker |
| 09/21/2005 | CN1671270A Method of manufacturing tape wiring substrate |
| 09/21/2005 | CN1669715A Soldering tin forming device, method and continuous plating device |
| 09/20/2005 | US6946686 Method of fabricating semiconductor device and semiconductor device |
| 09/20/2005 | US6946206 Friction stir welding method and structure body |
| 09/20/2005 | US6946091 Laser drilling |
| 09/15/2005 | US20050202650 Method of dividing a wafer which has a low-k film formed on dicing lines |
| 09/15/2005 | US20050199598 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
| 09/15/2005 | US20050199592 Laser based splitting method, object to be split, and semiconductor element chip |
| 09/14/2005 | EP1575087A2 Semiconductor wafer processing to increase the usable planar surface area |
| 09/14/2005 | CN1668418A Method and apparatus for supporting a substrate |
| 09/14/2005 | CN1667797A Method for manufacturing semiconductor device |
| 09/14/2005 | CN1219319C Single pulse broken UV laser system and method for IC fuses |
| 09/13/2005 | US6943048 Method for manufacturing optoelectronic material |
| 09/08/2005 | US20050195527 Mounting method of magnetic head component, magnetic head device and manufacturing method of magnetic head device |
| 09/08/2005 | DE102005004845A1 Wafer-Unterteilungsverfahren Wafer dividing method |
| 09/08/2005 | DE10034096B4 Verfahren zum Verschweißen von Stahlschienen A method of welding steel rails |
| 09/07/2005 | EP1570941A2 Laser based splitting method, object to be split, and semiconductor element chip |
| 09/07/2005 | EP1381819B1 A lining device for a plate heat exchanger |
| 09/07/2005 | EP1151339B1 Method for constructing an optoelectronic assembly |
| 09/07/2005 | CN1663726A Method and a device for depositing a welding material in an annular facing machined in a spherical wall |
| 09/07/2005 | CN1218368C Method for mfg. semiconductor with improved structure intensity |
| 09/06/2005 | US6938341 Method for manufacturing an ink discharge port of an ink jet recording head |
| 09/01/2005 | US20050191220 Process and apparatus for producing honeycomb bodies and honeycomb body produced by the process |
| 08/31/2005 | CN1663038A Laser processing |
| 08/31/2005 | CN1662709A Welding of an element of a track unit and a rail section without adding any material |
| 08/31/2005 | CN1662342A Method of manufacturing annular body |
| 08/31/2005 | CN1216713C Friction welding method |
| 08/30/2005 | US6935551 Ultrasonic bonding method of coated electric wires and ultrasonic bonding apparatus using same |
| 08/25/2005 | US20050184036 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
| 08/25/2005 | DE102004059154A1 Verfahren zum Überprüfen einer laserbearbeiteten verschlechterten Schicht A method for checking a laser processed deteriorated layer |
| 08/24/2005 | EP1237677B1 Soldering flux |
| 08/24/2005 | CN1658996A Method and apparatus for splicing tubular heater sections |
| 08/24/2005 | CN1658742A Reflux welding device |
| 08/24/2005 | CN1657220A Laser based splitting method, object to be split, and semiconductor element chip |
| 08/24/2005 | CN1216404C Manufacturing method of semiconductor device |
| 08/24/2005 | CN1216161C Method and apparatus for separating oxide of solder produced by jet solder groove |
| 08/18/2005 | US20050178005 Method of manufacturing annular body |
| 08/17/2005 | CN1214886C Method for producing sintered honeycomb |
| 08/16/2005 | US6929169 Solder joint structure and method for soldering electronic components |
| 08/16/2005 | CA2107923C Flash butt welding facility |
| 08/11/2005 | US20050172713 Sensor stem, sensor device having the same, and method of manufacturing sensor device |
| 08/10/2005 | EP1345728B8 Method of making a composite aluminium sheet |
| 08/10/2005 | CN1214450C Manufacturing method of semiconductor device |
| 08/09/2005 | US6927164 Method of fabricating semiconductor device and semiconductor device |
| 08/04/2005 | US20050170613 Wafer dividing method |
| 08/04/2005 | US20050166987 Clad pipe |
| 08/04/2005 | DE102004042032A1 Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung Laser processing method and laser processing apparatus |
| 08/03/2005 | EP1389158B1 Dual laser cutting of wafers |
| 08/03/2005 | CN1650678A Method for creating a trench structure in a polymer substrate |
| 08/02/2005 | US6924987 Wiring board and process for producing the same |
| 08/02/2005 | US6924829 Web processing method and web processing device |
| 08/02/2005 | US6924452 Welding device and method |
| 08/02/2005 | US6924023 Method of manufacturing a structure having pores |
| 07/28/2005 | US20050161491 Friction stir welding method and structure body formed |
| 07/28/2005 | US20050161252 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 07/27/2005 | CN1645999A Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacks |
| 07/27/2005 | CN1645563A Semiconductor wafer processing method |
| 07/27/2005 | CN1644297A Multiple beam micro-machining system and method |
| 07/21/2005 | WO2005065881A1 Laser processing method and device |
| 07/21/2005 | US20050158968 Wafer laser processing method |
| 07/21/2005 | US20050155958 Laser machining method and laser machining apparatus |
| 07/21/2005 | US20050155954 Semiconductor wafer processing method |
| 07/20/2005 | EP1555079A2 Process for manufacturing cooling elements made of plate piling, with soldering material on the inner surfaces of passages or openings of the plates |
| 07/20/2005 | EP1286803B1 Method for producing a structural member from plates stacked on top of each other and soldered together |
| 07/20/2005 | EP1173304B1 Method for producing a surface-alloyed cylindrical, partially cylindrical or hollow cylindrical component |
| 07/20/2005 | CN1643999A Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 07/20/2005 | CN1643656A Method for deviding substrate |
| 07/20/2005 | CN1642686A Welding method and structural body joined by using the welding method |
| 07/20/2005 | CN1640609A Laser machining method and laser machining apparatus |
| 07/20/2005 | CN1211862C Device and method for burning to remove thin layers on support material |