| Patents for B23K 101 - Articles made by soldering, welding or cutting (5,065) |
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| 07/20/2005 | CN1211808C Covered conductor forming coil and soldering method thereof, and electric acoustic converter |
| 07/20/2005 | CN1211180C Hollow structural member for friction welding |
| 07/19/2005 | US6918531 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection |
| 07/14/2005 | US20050150935 Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacks |
| 07/14/2005 | US20050150934 Method of producing metallic packaging |
| 07/14/2005 | US20050150639 Method for producing an integrated heat exchanger and an integrated heat exchanger produced thereby |
| 07/14/2005 | US20050150522 Method for removing resin layer from resin-coated metal tube |
| 07/13/2005 | EP1551591A1 Seam-welded air hardenable steel tubing |
| 07/13/2005 | CN1638913A Laser machining method |
| 07/13/2005 | CN1638912A Operating method and trolley for a laser machining system |
| 07/13/2005 | CN1638910A Plasma-resistant, welded aluminum structures for use in semiconductor processing apparatus |
| 07/13/2005 | CN1638906A Method of producing metallic packaging |
| 07/13/2005 | CN1636663A Jet type welding apparatus |
| 07/13/2005 | CN1210460C Method of welding steel guide rails |
| 07/12/2005 | US6915940 Device for applying solder globules |
| 07/07/2005 | US20050145681 Method of brazing aluminum products and furnace therefor |
| 07/07/2005 | DE102004051180A1 Waferteilungsverfahren Wafer dividing method |
| 07/06/2005 | EP1483419A4 Lead-free tin-silver-copper alloy solder composition |
| 07/06/2005 | CN1636426A Method for drilling holes in a substrate, in particular in circuit substrate |
| 07/06/2005 | CN1209220C Method for producing radiator |
| 07/05/2005 | US6914213 Method and device for overlapping welding of two coated metal sheets with a beam of high energy density |
| 07/05/2005 | US6914185 Insulating coated layer is colored for a better absorption of a laser beam |
| 06/30/2005 | DE10360623B3 Vorrichtung zum fluiden Abdichten eines Rohrabschnitts Apparatus for fluid sealing a pipe section |
| 06/29/2005 | EP1545826A2 Solder hierarchy for lead free solder joint |
| 06/29/2005 | CN1633513A Lead-free tin-silver-copper alloy solder composition |
| 06/29/2005 | CN1632328A Friction welding method and structure body formed by friction welding |
| 06/29/2005 | CN1208214C Structure mfg. mehtod and structure |
| 06/29/2005 | CN1208167C Component for friction welding |
| 06/29/2005 | CN1208166C Structural body manufacturing method and structural body |
| 06/29/2005 | CN1208165C Structure body and vehicle manufacturing method |
| 06/28/2005 | CA2253567C Arrangement and method for producing expanded material |
| 06/23/2005 | US20050134868 Method of checking a laser processed deteriorated layer |
| 06/23/2005 | US20050133487 Cutting tool and a method for the manufacture thereof |
| 06/23/2005 | DE102004055443A1 Waferbearbeitungsverfahren Wafer processing method |
| 06/23/2005 | DE102004052252A1 Bearbeitungsverfahren unter Verwendung eines Laserstrahls Machining method using a laser beam |
| 06/23/2005 | DE102004050414A1 Lötverfahren Soldering |
| 06/22/2005 | EP1543914A1 Laser welding method |
| 06/22/2005 | EP1543911A1 Device for fluid tight sealing of tubular sections |
| 06/22/2005 | EP1542825A1 Method for manufacturing a metallic tubular assembly |
| 06/22/2005 | CN1631066A Latching micro magnetic relay packages and methods of packaging |
| 06/22/2005 | CN1629625A Method of checking a laser processed deteriorated layer |
| 06/21/2005 | US6909087 Method of processing a surface of a workpiece |
| 06/16/2005 | US20050127299 Apparatus for checking a laser processed deteriorated layer |
| 06/16/2005 | US20050127143 Solder joint structure and method for soldering electronic components |
| 06/15/2005 | EP1456862B1 Solder ring for production of vacuum tube and method for the production of such a solder ring and of a vacuum tube |
| 06/15/2005 | CN1626836A Friction welding method and structure body formed by friction welding method |
| 06/14/2005 | US6905063 Method of manufacturing semiconductor device |
| 06/09/2005 | DE102004049887A1 Laserstrahlmaschine Laser beam machine |
| 06/08/2005 | EP1345728B1 Method of making a composite aluminium sheet |
| 06/08/2005 | CN1205846C Printed-wiring board processing method |
| 06/07/2005 | US6902102 Soldering method and solder joint member |
| 06/02/2005 | DE102004043895A1 Mehrstrahliges Mikro-Bearbeitungssystem und Verfahren Multi-beam micro-processing system and method |
| 06/02/2005 | DE102004043474A1 Waferbearbeitungsverfahren Wafer processing method |
| 06/01/2005 | EP1535690A1 Method of brazing aluminum product and furnace therefor |
| 06/01/2005 | CN1623006A Procedure and arrangement for coating a metal surface with a thin layer containing metal |
| 06/01/2005 | CN1203957C Friction welding method and structure using the friction welding method |
| 06/01/2005 | CN1203956C Friction welding method and structure using the friction welding method |
| 06/01/2005 | CN1203954C Friction stirring and welding method |
| 06/01/2005 | CN1203953C Short-circuit arc welding machine and method for controlling thereof |
| 05/26/2005 | US20050109742 Processing method using laser beam |
| 05/25/2005 | EP1532315A1 Welding of an element of a track unit and a rail section without adding any material |
| 05/25/2005 | CN1620713A Machining substrates, particularly semiconductor wafers |
| 05/25/2005 | CN1620353A 激光标记 Laser marking |
| 05/25/2005 | CN1619777A 晶片加工方法 Wafer processing method |
| 05/25/2005 | CN1618563A 摩擦焊接方法 Friction welding method |
| 05/24/2005 | US6896170 Wire bonder for ball bonding insulated wire and method of using same |
| 05/24/2005 | US6895659 Process of manufacturing fluid jetting apparatuses |
| 05/19/2005 | US20050106782 Wafer processing method |
| 05/19/2005 | US20050103820 Solder ring for production of vacuum tube and method for the production of such a solder ring and of a vacuum tube |
| 05/19/2005 | US20050103757 Method and device for the formation of pipes |
| 05/18/2005 | CN1617305A 晶片加工方法 Wafer processing method |
| 05/17/2005 | US6894747 Manufacturing method for reflector, reflector, and liquid crystal display |
| 05/17/2005 | US6892928 Method of manufacturing tubular body, by friction stir welding |
| 05/17/2005 | US6892925 Solder hierarchy for lead free solder joint |
| 05/11/2005 | CN1615200A Flux collection method and system |
| 05/11/2005 | CN1201644C Method and device for laser drilling of organic materials |
| 05/11/2005 | CN1201081C Method for producing compressor piston |
| 05/10/2005 | US6890430 Solder dross removal apparatus and method |
| 05/10/2005 | US6889890 Brazing-filler material and method for brazing diamond |
| 05/05/2005 | US20050095817 Silicon wafer dividing method and apparatus |
| 05/04/2005 | DE10207288B4 Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat A method for drilling holes by means of a laser beam in a substrate, in particular in an electric circuit substrate |
| 05/04/2005 | CN1612793A Method for laser machining a workpiece with laser spot enlargement |
| 05/04/2005 | CN1612304A Wafer dividing method |
| 05/04/2005 | CN1611319A Processing method using laser beam |
| 05/04/2005 | CN1199765C Circuit base board production method |
| 05/04/2005 | CN1199758C Laser processing appts. and its method |
| 05/04/2005 | CN1199756C Structural member for friction welding |
| 05/03/2005 | US6886733 Conductive powder applying device immersing substrate into conductive powder by rotating tank including conductive powder and substrate at opposing positions |
| 04/28/2005 | US20050090077 Wafer dividing method |
| 04/28/2005 | US20050088610 Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same |
| 04/27/2005 | CN1610068A Method of dividing a non-metal substrate |
| 04/27/2005 | CN1608779A Brazing method |
| 04/27/2005 | CN1198702C System and method for feature compensation of an ablated inkjet nozzle plate |
| 04/26/2005 | US6884650 Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same |
| 04/26/2005 | US6883701 Iron-chromium base brazing filler metals |
| 04/21/2005 | US20050082350 Brazing method |
| 04/21/2005 | US20050082264 Laser beam machine |
| 04/20/2005 | EP1524052A2 Cutting tool together with a method for the manufacture thereof |
| 04/20/2005 | CN1607988A Brazed copper heat exchangers and method for making same by welding |
| 04/20/2005 | CN1607383A Laser beam machine |