Patents for B23K 101 - Articles made by soldering, welding or cutting (5,065)
07/2004
07/13/2004US6762390 Rail welding device
07/08/2004WO2003065420A3 Method for producing a semiconductor element
07/08/2004US20040129689 Method of making hole in ceramic green sheet
07/08/2004US20040129685 Multibeam laser drilling apparatus
07/07/2004EP1434667A1 Method and device for overlapping welding of two coated metal sheets with a beam of high energy density
07/07/2004CN1511433A Method for drilling microholes using laser beam
07/07/2004CN1511072A Process of making shaped product
07/06/2004US6760054 Imaging apparatus utilizing laser beams
07/06/2004US6759625 Device for the laser processing of workpieces
07/06/2004US6759143 Capable of enduring high power sputtering
07/01/2004US20040126996 Method and apparatus for machining substrate
07/01/2004US20040124233 Method and protection apparatus for installation of a temperature-sensitive electronic component
06/2004
06/30/2004EP1433582A1 Method and apparatus for cutting a semiconductor wafer
06/30/2004EP1433195A2 Method of machining substrates
06/30/2004EP1432547A1 Three components linked to each other by means of a welded connection
06/30/2004CN1509219A Hollow product, Method and device for making same, fluid transporting system using the same
06/30/2004CN1508630A Method and apparatus for laser marking identification code
06/30/2004CN1155450C Method employing UV laser pulses of varied energy density to form blind vias in multilayered targets
06/29/2004US6756132 Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials
06/24/2004WO2004052586A1 Device and method for laser processing
06/24/2004US20040121493 Chip scale marker and method of calibrating marking position
06/24/2004DE10256254A1 Laser welding method e.g. for components of electronic circuit board housing for automobile control device, allowing further component to be held between welded components
06/23/2004EP1431242A2 Bonding method for flip-chip semiconductor device, mems device package and package method using the same
06/23/2004CN1507379A Method of brazing thin heat exchanging plates and brazed plate heat exchanger produced according to the method
06/23/2004CN1507023A Side welding method for flip-chip semiconductor device
06/23/2004CN1506187A 激光加工方法 The laser processing method
06/22/2004US6753500 Method and apparatus for cutting a substrate using laser irradiation
06/22/2004CA2265215C Welding monitoring system
06/17/2004WO2004050291A1 Laser processing device
06/17/2004US20040112882 Laser processing apparatus
06/17/2004US20040112880 Laser machining method
06/17/2004US20040112879 Identification-code laser marking method and apparatus
06/17/2004US20040112580 Lining device for a plate heat exchanger
06/16/2004EP1428671A1 Digital media cutter
06/16/2004EP1097023B1 Device for the laser processing of workpieces
06/15/2004US6749104 Heat exchanger manufacturing methods and brazing filler metal compositions useful therein, characterized by low nickel leaching rates
06/10/2004WO2004048026A1 Method of welding shaft-like part on plurally piled steel plates
06/10/2004US20040108366 Iron-chromium base brazing filler metals
06/10/2004CA2502555A1 Method of welding shaft-like part on plurally piled steel plates
06/09/2004EP1425947A1 Method for laser beam drilling with a perforated mask
06/09/2004CN1503893A Lining device for plate heat exchanger
06/03/2004US20040106294 Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same
06/03/2004US20040105519 Manufacturing method and device of control rods for nuclear reactors
06/03/2004US20040104846 Method of machining glass substrate and method of fabricating high-frequency circuit
06/02/2004CN1501490A 电路装置及其制造方法 Circuit device and manufacturing method thereof
06/01/2004US6742702 Gas injection type soldering method and apparatus
05/2004
05/27/2004US20040101431 Iron, cobalt, tungsten alloy support bonded to steel blade; powder metallurgy
05/26/2004EP1422750A1 Method and apparatus for splitting semiconducor wafer
05/26/2004EP1422010A1 Soldered copper heat exchangers and welding method of manufacturing them
05/25/2004US6740178 Method for producing a sintered honeycomb body
05/20/2004US20040097012 Semiconductor wafer processing to increase the usable planar surface area
05/20/2004US20040094607 System and method for mounting electronic components onto flexible substrates
05/20/2004US20040094600 Device for applying solder globules
05/20/2004US20040094400 Method of processing a surface of a workpiece
05/19/2004CN1498067A Method for processing hole on ceramic sheet
05/19/2004CN1498066A Solder structure and soldering method of electronic assembly
05/19/2004CN1496779A 激光加工装置和激光加工方法 The laser processing apparatus and laser processing method
05/19/2004CN1150078C Method for welding railroad rails
05/13/2004WO2002101888A3 Multi-beam micro-machining system and method
05/13/2004US20040089644 Laser machining method and laser machining apparatus
05/12/2004EP1073539B1 Use of lead-free solder alloy powder paste in pcb production
05/11/2004US6734083 Dicing method and dicing apparatus for dicing plate-like workpiece
05/11/2004US6732907 Soldering method, soldering device, and method and device of fabricating electronic circuit module
05/06/2004WO2004026517A3 Solder hierarchy for lead free solder joint
05/06/2004US20040084607 Laser irradiation apparatus and method
05/06/2004US20040084434 Method and apparatus for splicing tubular heater sections
05/06/2004US20040084417 Clad material for lead wire connection
05/06/2004EP1414642A1 Flat metal product, especially for use as wall for a heat exchanger, and heat exchanger having a double wall from copper and titanium
05/05/2004CN1494470A Controlled attenuation capillary
05/05/2004CN1148484C Method and system for welding railroad rails
05/04/2004US6730173 Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module
04/2004
04/29/2004US20040078976 Stainless steel honeycomb panel and method for manufacturing thereof
04/29/2004DE10296913T5 Segmentiertes Laserschneiden Segmented laser cutting
04/29/2004DE10296512T5 Quasi-kontinuierliches diodengepumptes Festkörper-Uv-Lasersystem und Verfahren zu seiner Anwendung Quasi-continuous diode-pumped solid-state laser Uv System and method for its use
04/27/2004US6727458 Energy-efficient, laser-based method and system for processing target material
04/22/2004WO2002088615A9 A lining device for a plate heat exchanger
04/22/2004US20040077250 Method and apparatus for patterning an organic electroluminescence device
04/22/2004DE10296468T5 Bearbeitung einer Speicherverbindungsleitung mit einer Gruppe von mindestens zwei Laserimpulsen Processing a memory connection line with a group of at least two laser pulses
04/22/2004DE10295946T5 Widerstandstrimmen mit kleinem gleichförmigem Lichtfleck von Festkörper-UV-Laser Resistor trimming with small uniform light spot of solid-state UV laser
04/21/2004CN1491467A Processing memory link with set of at least two laser pulses
04/21/2004CN1491398A On-the-fly beam path error correction for memory link processing
04/20/2004US6722554 Soldering apparatus
04/15/2004US20040069837 Method of manufacturing plate type titanium heat exchanger
04/15/2004US20040069835 Friction stir welding method and structure body
04/15/2004US20040069834 Minimizing deformation by placing at the region a connecting member that joins two plates forming two faces; members at the region have a a raised portion that protrudes toward the tool side; simultaneous welding of both sides
04/15/2004US20040069833 Friction stir welding method and structure body
04/15/2004US20040069758 Method and device for applying a solder to a substrate
04/15/2004US20040069478 Heat exchanger
04/15/2004US20040068955 Friction stir welding hollow frame member
04/15/2004DE10296339T5 Fliegende Strahlpfadfehlerkorrektur für eine Speicherverbindungsbearbeitung Flying beam path error correction for a memory link processing
04/14/2004CN1489504A Resistor trimming with small uniform spot from solid-state UV laser
04/14/2004CN1145541C Laser processing device and method
04/13/2004US6721343 Laser processing apparatus with position controller
04/13/2004US6720524 Method and apparatus for laser drilling
04/13/2004CA2214054C Process for the aluminothermic welding of rails with alloying of the weld metal in the rail head region
04/08/2004WO2003072289A3 Method of producing metallic packaging
04/08/2004US20040065718 Solder joint structure and method for soldering electronic components
04/08/2004US20040065715 Friction stir welding method and structure body formed by friction stir welding
04/08/2004US20040065714 Friction stir welding method and structure body
04/08/2004US20040065713 Friction stir welding method
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