Patents for H05K 1 - Printed circuits (98,583)
02/2015
02/24/2015US8960557 Wireless IC device
02/24/2015US8959762 Method of manufacturing an electronic module
02/24/2015US8959760 Printed wiring board and method for manufacturing same
02/24/2015US8959759 Method for assembling computer modules small in thickness
02/24/2015US8959758 Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device
02/24/2015US8959756 Method of manufacturing a printed circuit board having an embedded electronic component
02/19/2015WO2015023637A1 Conductor pad for flexible circuits and flexible circuit incorporating the same
02/19/2015WO2015022994A1 Heat-radiating circuit board and electronic device
02/19/2015WO2015022993A1 Ceramic circuit board and electronic device
02/19/2015WO2015022956A1 Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
02/19/2015WO2015022607A1 Electrical and / or electronic device comprising at least one printed circuit
02/19/2015WO2015022210A1 Multi-layer eddy current probe, method for producing a multi-layer eddy current probe, and test device having a multi-layer eddy current probe
02/19/2015WO2015021640A1 Circuit board structure and power supply module having same
02/19/2015US20150050585 Resin composition, printed circuit board using the composition, and method of manufacturing the same
02/19/2015US20150050509 Photocurable resin composition, image display device, and method for producing same
02/19/2015US20150050504 Core substrate and method of manufacturing the same
02/19/2015US20150050473 Resin composition, printed circuit board using the composition, and method of manufacturing the same
02/19/2015US20150049498 Glass based multichip package
02/19/2015US20150049450 Electronic device and method of manufacturing electronic device
02/19/2015US20150049449 Display device
02/19/2015US20150049448 Semiconductor device
02/19/2015US20150049447 Base Substrate Which Prevents Burrs Generated During the Cutting Process and Method for Manufacturing the Same
02/19/2015US20150049446 Embedded electronic component and method of manufacturing electronic component embedded substrate
02/19/2015US20150049445 Method for manufacturing electronic component embedding substrate and electronic component embedding substrate
02/19/2015US20150049444 Conductor pad for flexible circuits and flexible circuit incorporating the same
02/19/2015US20150049443 Chip arrangement
02/19/2015US20150049442 Ceramic circuit board and electronic device
02/19/2015US20150049441 Circuit board with corner hollows
02/19/2015US20150049440 Transparent conductive laminate and electronic device or module
02/19/2015US20150049439 Circuit module
02/19/2015US20150049421 Electronic device package structure and method fabricating the same
02/19/2015US20150049262 Flexible touch panel stucture and electronic watch using the same
02/19/2015US20150048917 Printed circuit board and power supply device
02/19/2015US20150048675 In-vehicle power conversion system
02/19/2015US20150048505 Wiring substrate, method of manufacturing the same, and semiconductor device
02/19/2015US20150047893 Package
02/19/2015US20150047892 Pcb backdrilling method and system
02/19/2015US20150047891 Integrated Circuit Features with Fine Line Space and Methods for Forming the Same
02/19/2015US20150047890 Multilayer ceramic capacitor and board for mounting thereof
02/19/2015US20150047889 Addition of Polymers to Thiophene Monomers in the In Situ Polymerization
02/19/2015US20150047888 Coil component and board having the same
02/19/2015US20150047887 Mounting circuit board of multilayer ceramic capacitor
02/19/2015US20150047885 Patterned conductive film, method of fabricating the same, and application thereof
02/19/2015US20150047884 Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board
02/19/2015US20150047883 Transparent conductive coatings on an elastomeric substrate
02/19/2015US20150047882 Graphitic Substrates with Ceramic Dielectric Layers
02/19/2015US20150047881 Masking layer formed by applying developable photosensitive resin compositions on panel structure
02/19/2015US20150047185 Electrode joining method, production method of electrode joined structure, and production system of electrode joined structure
02/19/2015DE19955570B4 Stromrichteranordnung Converter assembly
02/19/2015DE102013216245A1 Leiterplatte mit einem Magnetfeldsensor für einen elektrischen Servomotor Printed circuit board with a magnetic field sensor for an electric servo motor
02/19/2015DE102013108781A1 Flugzeugsitzsteuereinheit Airplane seat control unit
02/19/2015DE102013013464A1 Elektronisches Bauteil Electronic component
02/18/2015EP2838327A1 Heat dissipating circuit board and electronic device
02/18/2015EP2838326A1 Ceramic circuit board and electronic device
02/18/2015EP2838325A1 Ceramic circuit board and electronic device
02/17/2015US8958215 Circuit board for peripheral circuits of high-capacity modules, and a high-capacity module including a peripheral circuit using the circuit board
02/17/2015US8958214 Motherboard assembly for interconnecting and distributing signals and power
02/17/2015US8958213 Mounting structure of chip component
02/17/2015US8958211 Circuit board and electronic device
02/17/2015US8958209 Electronic power module, and method for manufacturing said module
02/17/2015US8958200 Display mount with post-installation adjustment features
02/17/2015US8957746 Parallel 1/4 wavelength line frequency filter
02/17/2015US8957697 Circuit board, image forming apparatus, and method of managing reuse information of circuit board
02/17/2015US8957507 Technology of reducing radiation noise of semiconductor device
02/17/2015US8957499 Laminate stacked capacitor, circuit substrate with laminate stacked capacitor and semiconductor apparatus with laminate stacked capacitor
02/17/2015US8957325 Optimized via cutouts with ground references
02/17/2015US8957324 Interconnect for high-frequency printed circuit
02/17/2015US8957323 Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same
02/17/2015US8957322 Conductive films having low-visibility patterns and methods of producing the same
02/17/2015US8957321 Printed circuit board, mount structure thereof, and methods of producing these
02/17/2015US8957320 Printed wiring board
02/17/2015US8957319 Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same
02/17/2015US8957318 Stabilization agents for silver nanowire based transparent conductive films
02/17/2015US8957316 Electrical component assembly for thermal transfer
02/17/2015US8957315 Stabilization agents for silver nanowire based transparent conductive films
02/17/2015US8956732 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board
02/17/2015US8955983 Thermal management for handheld projectors
02/17/2015US8955215 High performance surface mount electrical interconnect
02/16/2015CA2857794A1 Chip assembly for reusable surgical instruments
02/12/2015WO2015019423A1 Electronic circuit connecting structure
02/12/2015WO2015019266A1 Compound to form electrical tracks into
02/12/2015WO2015018881A1 Circuit board assembly, control device for a cooler fan module and method
02/12/2015WO2015018588A1 Polyamide films and process for preparation
02/12/2015WO2015018414A1 Camera module with optimized heat dissipation
02/12/2015US20150044889 Electrical connector and assembly of the electrical connector and a circuit board
02/12/2015US20150044492 Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil
02/12/2015US20150044485 Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same
02/12/2015US20150044484 Prepreg and laminated board
02/12/2015US20150044451 Black photosensitive resin composition and use of same
02/12/2015US20150044425 Method for processing resin product and resin product
02/12/2015US20150044388 Plating method and product
02/12/2015US20150043228 Semiconductor device, and method of manufacturing semiconductor device
02/12/2015US20150043188 Method For Manufacturing A Printed Circuit Board, Printed Circuit Board And Rear View Device
02/12/2015US20150043186 Joined structural body of members, joining method of members, and package for containing an electronic component
02/12/2015US20150043185 Composite electronic component and board having the same
02/12/2015US20150043184 Circuit substrate and electronic device
02/12/2015US20150043183 Wiring board with built-in electronic component
02/12/2015US20150043181 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
02/12/2015US20150043177 Electronic module
02/12/2015US20150043176 Circuit board and display device having the same
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