Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
08/2008
08/28/2008US20080203396 Electro-Optical Substrate, Method for Designing the Same, Electro-Optical Device, and Electronic Apparatus
08/28/2008US20080202409 Method of growing GaN crystal, method of producing single crystal GaN substrate, and single crystal GaN substrate
08/28/2008DE102008011061A1 Led-Weisslichtquelle mit verbesserter Farbwiedergabe Led white light source with improved color reproduction
08/28/2008DE102008010320A1 Lichtemittierende Vorrichtung A light emitting device
08/28/2008DE102008009642A1 Gruppe-III-Nitrid-Dioden auf Trägersubstraten mit niedrigem Index Group III nitride diodes on carrier substrates with low index
08/28/2008DE102008009262A1 Semiconductor chip i.e. thin film LED chip, has electrically conductive contact layer permeable for radiations emitted by active area, and photonic crystal or quasi-crystal arranged at side flank of semiconductor body
08/28/2008DE102008008058A1 Verfahren zur Herstellung von in Kompaktgehäusen untergebrachten Lichtemissionsvorrichtungen mit vorderseitigen Kontakten durch Formpressen A process for preparing accommodated in compact housings light emitting devices with front-side contacts by compression molding
08/28/2008DE102007009839A1 Hydride vapor phase epitaxy method for producing aluminum gallium indium nitride mono-crystal, used in optoelectronics, particularly for ight-emitting diodes, involves utilizing mixture of aluminum, gallium and indium metals
08/28/2008DE102007009412A1 Hydride vapor phase epitaxy process for the production of aluminum-gallium-nitrogen monocrystals useful in laser diode, comprises converting mixture of aluminum, gallium and indium metals having hydrogen compounds of halogens to halides
08/28/2008DE102007009351A1 Leuchtmittel Lamp
08/28/2008DE102007008783A1 Controllable light emitting diode driver for generation of stable current has direct current input for direct current voltage, where field-effect transistor is provided as voltage adjuster around voltage difference
08/28/2008DE102007008524A1 Strahlung emittierender Chip mit mindestens einem Halbleiterkörper Radiation emitting chip with at least a semiconductor body
08/28/2008DE102007007258A1 Illuminant i.e. LED, has collecting lens deflecting portion of electromagnetic radiations such that lens forms radioactive cone of illuminant and includes breakage surface, and reflection surface for radiations emitted by crystal
08/28/2008DE102007006583A1 Method for manufacturing luminescent diode, involves superimposing housing on substrate, which is provided with two metal electrodes, where substrate is provided in center with isolation area which separates two metal electrodes
08/27/2008EP1962568A2 Structure of light emitting diode and method to assemble thereof
08/27/2008EP1962350A1 Emitting surface of light emitting diode packages
08/27/2008EP1962339A1 Method for evaluating semiconductor substrate
08/27/2008EP1962014A1 Lighting apparatus using filter and condenser for LED illumination
08/27/2008EP1961046A1 Phosphors protected against moisture and led lighting devices
08/27/2008EP1960830A1 Illumination device
08/27/2008EP1781741B1 Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter
08/27/2008EP1719155B1 Semiconductor device and method using nanotube contacts
08/27/2008EP1704170A4 Uv curing method and apparatus
08/27/2008CN201107810Y Luminous diode conducting wire rack structure
08/27/2008CN201107809Y Luminous diode encapsulation structure
08/27/2008CN201107423Y Printed-type light conducting plate for electronic product press key light source
08/27/2008CN201106815Y Anticorrosion LED light source for ship
08/27/2008CN101253660A Method for laterally cutting through a semiconductor wafer and optoelectronic component
08/27/2008CN101253637A Optoelectronic component
08/27/2008CN101253636A Method for laterally cutting through a semiconductor wafer and optoelectronic component
08/27/2008CN101253623A Method for the production of a semiconductor component comprising a planar contact, and semiconductor component
08/27/2008CN101253442A Edge-lit backlight having light recycling cavity with concave transflector
08/27/2008CN101253435A Light source and method of providing a bundle of light
08/27/2008CN101253362A Light emitting diode comprising multiple dies and optical system with number of lens elements
08/27/2008CN101252797A Light emitting apparatus
08/27/2008CN101252165A Surface mounting type light emitting diode and method for manufacturing the same
08/27/2008CN101252164A Surface mounting type light emitting diode and method for manufacturing the same
08/27/2008CN101252163A SMD high power LED ceramic packaging base
08/27/2008CN101252162A High power LED ceramic packaging base
08/27/2008CN101252161A LED using alloy to fix chip
08/27/2008CN101252160A Light emitting semiconductor device
08/27/2008CN101252159A White luminous device
08/27/2008CN101252158A LED nanometer technology for improving external quantum efficiency
08/27/2008CN101252157A Encapsulation structure of LED light source
08/27/2008CN101250752A Group iii nitride semiconductor substrate
08/27/2008CN101250750A Amorphous diamond materials and associated methods for the use and manufacture thereof
08/27/2008CN101250408A Warm-white light-emitting diode and fluorescent powder having orange radiation thereof
08/27/2008CN101250407A Borosilicate fluorescent powder and method for making same
08/27/2008CN100414729C Light-emitting diode
08/27/2008CN100414728C White light LED package radiating structure
08/27/2008CN100414727C Method for controlling thickness of coating fluorescent dye for white light LED
08/27/2008CN100414726C LED chip package and packaging method thereof
08/27/2008CN100414725C Semiconductor light emitting device
08/27/2008CN100414724C Light emitting device
08/27/2008CN100414723C LED structure
08/27/2008CN100414722C Method for fabricating tube core of light emitting diode in gallium nitride substrate by using technique of reverse filling welding
08/27/2008CN100414704C Plane flip-chip LED integrated chip and producing method
08/27/2008CN100414701C Light-emitting system, light-emitting device, and forming method therefor
08/27/2008CN100414698C Power surface mount light emitting die package
08/27/2008CN100414005C Production method for semiconductor crystal and semiconductor luminous element
08/27/2008CN100413855C Curable polycyclic compounds and process for the production thereof
08/27/2008CN100413632C Snagau solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same
08/26/2008US7417367 Patterned light emitting devices
08/26/2008US7417292 Arrangement for connecting the terminal contacts of an optoelectronic component to a printed circuit board
08/26/2008US7417264 Top-emitting nitride-based light emitting device and method of manufacturing the same
08/26/2008US7417263 Transparent electrode
08/26/2008US7417262 Waveguide integrated circuit
08/26/2008US7417259 Light-emitting device having light-emitting elements
08/26/2008US7417258 Semiconductor light-emitting device, and a method of manufacture of a semiconductor device
08/26/2008US7417257 III-nitride device with improved layout geometry
08/26/2008US7417220 Solid state device and light-emitting element
08/26/2008US7416906 Soldering method for semiconductor optical device, and semiconductor optical device
08/26/2008US7416604 Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
08/26/2008CA2498472C Headlamp
08/21/2008WO2008101156A2 High color rendering index white led light system using multi-wavelength pump sources and mixed phosphors
08/21/2008WO2008100991A1 Led devices having lenses and methods of making same
08/21/2008WO2008100502A1 Al(x)ga(1-x)n-cladding-free nonpolar iii-nitride based laser diodes and light emitting diodes
08/21/2008WO2008100298A1 Led lighting device
08/21/2008WO2008100276A2 Shaped articles comprising semiconductor nanocrystals and methods of making and using same
08/21/2008WO2008099838A1 Method for manufacturing compound semiconductor element, and compound semiconductor element
08/21/2008WO2008099784A1 Led package and structure for mounting three-dimensional circuit component
08/21/2008WO2008099699A1 Light-emitting diode
08/21/2008WO2008099542A1 Light emitting element and surface area illumination device
08/21/2008WO2008099531A1 Backlight device and planar display device using the same
08/21/2008WO2008098832A1 Fabrication process for package with light emitting device on a sub-mount
08/21/2008WO2008098606A1 Mounting lenses for led modules
08/21/2008WO2008079938A3 Light emitting diodes (leds) with improved light extraction by roughening
08/21/2008WO2008078298A3 Iii-nitride light emitting device with reduced strain light emitting layer
08/21/2008WO2008078298A2 Iii-nitride light emitting device with reduced strain light emitting layer
08/21/2008WO2008078237A3 Carrier and optical semiconductor device based on such a carrier
08/21/2008WO2008078235A3 Light-emitting apparatus with shaped wavelength converter
08/21/2008WO2008075248A3 Lighting device of leds on a transparent substrate
08/21/2008WO2008075248A2 Lighting device of leds on a transparent substrate
08/21/2008WO2008067441A9 Lighting device and lighting method
08/21/2008WO2008063985A3 A POINT DEFECT ENGINEERED SI LIGHT-EMITTING DIODE AT 1.218 μM
08/21/2008WO2008060531A9 Light emitting diode and laser diode using n-face gan, inn, and ain and their alloys
08/21/2008WO2008051596A3 Solid state light sheet and encapsulated bare die semiconductor circuits
08/21/2008WO2007147278A3 Led light source and method
08/21/2008WO2007062169A3 Red and yellow phosphor-converted leds for signal applications
08/21/2008US20080199984 Oled patterning method