| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 07/31/2008 | US20080179601 Nitride-based semiconductor device and method of fabricating the same |
| 07/31/2008 | US20080179587 Nitride/zinc oxide based light-emitting diodes |
| 07/31/2008 | US20080179503 Optical Device and Manufacturing Method of Optical Device |
| 07/31/2008 | US20080179380 Radiation-emitting semiconductor component and method for producing the semiconductor component |
| 07/31/2008 | DE19926958B4 Lichtemissions-Halbleiterdiode auf der Basis von Ga (In, AL) P-Verbindungen mit ZnO-Fensterschicht The light-emitting semiconductor diode based on Ga (In, Al) P compounds with ZnO window layer |
| 07/31/2008 | DE102008004443A1 Modular package for solid state light emitting device, has thermoset package body formed on leadframe and surrounding die mounting region, and on top and bottom surfaces of reduced thickness region |
| 07/31/2008 | DE102007019079A1 Optoelectronic semiconductor chip producing method, involves forming epitaxial covering layer that is downstream of semiconductor section, and electrically activating p-doped region of section before or during formation of covering layer |
| 07/31/2008 | DE102007018307A1 Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips Semiconductor chip and method for producing a semiconductor chip |
| 07/31/2008 | DE102007011124A1 Organischer Halbleiterlaser und Verfahren zu dessen Herstellung Organic semiconductor laser and method of manufacturing the |
| 07/31/2008 | DE102007006349A1 Anordnung zur Erzeugung von Mischlicht und Verfahren zur Herstellung einer solchen Anordnung Arrangement for the generation of mixed light and methods of making such an arrangement |
| 07/31/2008 | DE102007004304A1 Thin-film light emitting diode chip, has layer stack made of primary radiation surfaces lying opposite to each other so that thin-film light emitting diode chip has two primary radiation directions |
| 07/31/2008 | DE102007003991A1 Opto-electronic semiconductor chip, has undoped region of undoped intermediate layer arranged between n-type tunnel layer and p-type tunnel layer, where n-type and p-type tunnel layers are separated from each other by undoped region |
| 07/31/2008 | DE102007002714A1 Neue Materialien für organische Elektrolumineszenzvorrichtungen New materials for organic electroluminescent |
| 07/30/2008 | EP1951008A1 Method for manufacturing flexible electric devices and flexible electric device |
| 07/30/2008 | EP1950814A1 LED with light diverging arrangement |
| 07/30/2008 | EP1950730A2 Backlight and liquid crystal display |
| 07/30/2008 | EP1950239A1 Transparent inorganic-oxide dispersion, resin composition containing inorganic oxide particles, composition for encapsulating luminescent element, luminescent element, hard coat, optical functional film, optical part, and process for producing resin composition containing inorganic oxide particles |
| 07/30/2008 | EP1949463A2 High light extraction efficiency light emitting diode (led) |
| 07/30/2008 | EP1949462A1 Gallium nitride-based compound semiconductor light-emitting device |
| 07/30/2008 | EP1949461A2 Assembling lighting elements onto a substrate |
| 07/30/2008 | EP1949460A1 Method for fabricating high-quality semiconductor light-emitting devices on silicon substrates |
| 07/30/2008 | EP1949459A1 Method of making light emitting device having a molded encapsulant |
| 07/30/2008 | EP1949458A1 Fabrication of semiconductor devices for light emission |
| 07/30/2008 | EP1948757A1 Light emitting device with an improved caalsin light converting material |
| 07/30/2008 | EP1534992A4 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
| 07/30/2008 | CN201093441Y LED lighting lamp fitting |
| 07/30/2008 | CN201093437Y LEDs with heat radiators |
| 07/30/2008 | CN201093381Y LED lamp socket and lamp component for automatic production |
| 07/30/2008 | CN201093379Y High power light-emitting diode ceramic substrate |
| 07/30/2008 | CN201093375Y LED lamp lens structure |
| 07/30/2008 | CN201093374Y Supportless high-power LED lamp cap |
| 07/30/2008 | CN201093369Y LED light source packaging to curved surface |
| 07/30/2008 | CN201093366Y Three primary colors multiple chips power luminous tube with excellent hot gateway |
| 07/30/2008 | CN201093360Y LED lamp pearl of R, G, B three-in-one complete color screen |
| 07/30/2008 | CN201093292Y LED car light cooling device |
| 07/30/2008 | CN201093272Y High-power LED barrel lamp |
| 07/30/2008 | CN201093263Y Heat radiation type LED road lamp |
| 07/30/2008 | CN201093219Y AC high-power LED lighting lamp |
| 07/30/2008 | CN201093214Y Direct inserting type LED |
| 07/30/2008 | CN201093211Y Light conversion body of highlight LED sunlight lamp |
| 07/30/2008 | CN101233787A Lighting system |
| 07/30/2008 | CN101233624A 交流发光器件 AC light emitting device |
| 07/30/2008 | CN101233623A Injection radiator |
| 07/30/2008 | CN101233622A Optoelectronic semiconductor chip |
| 07/30/2008 | CN101233619A A package and manufacturing method for a microelectronic component |
| 07/30/2008 | CN101233210A Red phosphor, method for manufacturing the same and light emitting diode for using the same |
| 07/30/2008 | CN101232761A Led drive circuit |
| 07/30/2008 | CN101232757A Driving system of light emitting element, and driving method thereof |
| 07/30/2008 | CN101232070A Illuminating device of single core quantum spot white light LED |
| 07/30/2008 | CN101232069A Packaging carrier of high luminance LED |
| 07/30/2008 | CN101232068A Semiconductor light emitting element |
| 07/30/2008 | CN101232067A Light emitting diode and manufacturing method thereof, integrated light emitting diode, and display |
| 07/30/2008 | CN101232066A Encapsulant profile for light emitting diodes |
| 07/30/2008 | CN101232065A Phosphor position in light emitting diodes |
| 07/30/2008 | CN101232064A Illuminating device |
| 07/30/2008 | CN101232063A Method for assembling high power LED desk lamp |
| 07/30/2008 | CN101232062A Method for enhancing light sending efficiency of high power LED chip |
| 07/30/2008 | CN101232061A Luminous source packaging |
| 07/30/2008 | CN101232060A Solid-state luminous element and manufacturing method thereof |
| 07/30/2008 | CN101232007A Light emitting diode package, backlight unit and liquid crystal display having the same |
| 07/30/2008 | CN101231975A Chip packaging body and method of manufacturing the same |
| 07/30/2008 | CN101230968A Lens for LED light source package |
| 07/30/2008 | CN101230957A Backlight apparatus, backlight controlling method and liquid crystal display apparatus |
| 07/30/2008 | CN101230271A Red-light fluorescent powder for LED and method for making same |
| 07/30/2008 | CN101230262A Method for reducing light decay of white light luminescent diode |
| 07/30/2008 | CN101230245A Gluewater for packaging light-emitting diode and uses thereof |
| 07/30/2008 | CN100407527C 具有量子井结构的半导体元件和半导体元件的形成方法 The method for forming a semiconductor quantum well structure elements and semiconductor element |
| 07/30/2008 | CN100407465C 一种生长在蓝宝石衬底上的复合缓冲层及制备方法 Grown on a sapphire substrate, a buffer layer and a composite prepared |
| 07/30/2008 | CN100407464C 制造发光二极管的方法 The method of manufacturing a light emitting diode |
| 07/30/2008 | CN100407463C 半导体光电器件 Semiconductor optoelectronic devices |
| 07/30/2008 | CN100407462C 一种发光二极管的封装方法 A light emitting diode packaging method |
| 07/30/2008 | CN100407461C 高发光效率的发光元件的制造方法 The method of manufacturing the light emitting device of high luminous efficiency |
| 07/30/2008 | CN100407460C 发光二极管灯组 Light-emitting diode lamps |
| 07/30/2008 | CN100407459C 电致发光的方法与装置 Electroluminescence method and apparatus |
| 07/30/2008 | CN100407458C 具有窄辐射光谱的半导体发光器件 The semiconductor light emitting device having a narrow radiation spectrum |
| 07/30/2008 | CN100407457C 氮化镓基高亮度高功率蓝绿发光二极管芯片 High brightness and high power GaN-based blue and green light-emitting diode chips |
| 07/30/2008 | CN100407456C 表面安装型发光二极管及其制造方法 Surface-mounted type light emitting diode and its manufacturing method |
| 07/30/2008 | CN100407455C 用于辐射元件的外壳及其加工方法和辐射元件 Housing and a processing method for the radiating element and the radiating element |
| 07/30/2008 | CN100407454C 发光器件及制造发光器件的方法 The light emitting device and a method of manufacturing the light emitting device |
| 07/30/2008 | CN100407453C 表面安装型led及使用它的发光装置 Surface mount led light emitting device and use it |
| 07/30/2008 | CN100407452C 制备用于发光器件的量子点硅酸类薄膜的方法 The method for preparing a quantum dot light emitting device of the film of silicate |
| 07/30/2008 | CN100407451C 防发黄缩聚物组合物及制品 Anti-yellowing condensation polymer compositions and articles |
| 07/30/2008 | CN100407450C Zn系半导体发光元器件的制造方法 Zn-based method for manufacturing a semiconductor light-emitting components |
| 07/30/2008 | CN100407449C 标准封装应用中高可靠性的坚固Ⅲ族发光二极管 Standard packaging applications with high reliability rugged family of light-emitting diodes Ⅲ |
| 07/30/2008 | CN100407448C 基于电致磷光的极高效有机发光器件 Based electrophosphorescence very efficient organic light-emitting device |
| 07/30/2008 | CN100407436C 用于含多个像素元件的显示器的透镜和导引其中光的方法 A method for containing a plurality of pixel elements of the display in which a lens and a light guide |
| 07/30/2008 | CN100407374C 氮化物半导体基底以及使用该基底的氮化物半导体装置 The nitride semiconductor substrate and the nitride semiconductor device using the substrate |
| 07/30/2008 | CN100407272C 可供辨识的平面显示器及辨识系统 Flat panel displays for identification and recognition system |
| 07/30/2008 | CN100407253C 旋转式电子显示板及其驱动方法 Plates and driving method rotary electronic display |
| 07/30/2008 | CN100406620C Li-doped p-Zn1-xMgxO crystal film and method for preparing same |
| 07/29/2008 | US7405433 Semiconductor light emitting device |
| 07/29/2008 | US7405431 Light-emitting semiconductor device having an overvoltage protector |
| 07/29/2008 | US7405096 Manufacturing method of nitride semiconductor device and nitride semiconductor device |
| 07/29/2008 | US7405094 Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same |
| 07/29/2008 | US7405093 Methods of assembly for a semiconductor light emitting device package |
| 07/29/2008 | US7404756 Process for manufacturing optical and semiconductor elements |
| 07/24/2008 | WO2008089165A2 High performance led package |
| 07/24/2008 | WO2008088320A1 Zno nanostructure-based light emitting device |
| 07/24/2008 | WO2008088165A1 Light emitting diode with high electrostatic discharge and fabrication method thereof |
| 07/24/2008 | WO2008087930A1 Iii nitride compound semiconductor element and method for manufacturing the same, iii nitride compound semiconductor light emitting element and method for manufacturing the same, and lamp |