Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2009
03/18/2009CN101388424A LED manufacturing method
03/18/2009CN101388346A Process for growing ZnO thin-film on Si substrate
03/18/2009CN101388345A Process for growing ZnO thin-film on metal substrate
03/18/2009CN101388338A Method for preparing substrate for growing gallium nitride and method for preparing gallium nitride substrate
03/18/2009CN101388330A Semiconductor manufacture device and method by heating substrate
03/18/2009CN101388324A Preparation of germanium quantum point
03/18/2009CN101388161A LED surface mounting device and LED display with the device
03/18/2009CN101387549A Selfluminous device
03/18/2009CN101387473A LED baking molding method, oven and oven combination
03/18/2009CN100470970C Manufacturing method of nitride semiconductor device and nitride semiconductor device
03/18/2009CN100470873C Illuminating device
03/18/2009CN100470866C Semi-conductor solid-state light source device
03/18/2009CN100470865C Epitaxial wafer growth method for improving gallium nitride base LED chip antistatic capability
03/18/2009CN100470864C Light emitting device with fluorescent material
03/18/2009CN100470863C Production method for P-type gallium nitride electrode
03/18/2009CN100470862C Nitride semiconductor device
03/18/2009CN100470861C Seat structure of diode illuminating device and method for manufacturing diode illuminating device
03/18/2009CN100470859C Large power light-emitting diode
03/18/2009CN100470858C Semiconductor heterostructure and light-emitting diode including same
03/18/2009CN100470857C Gallium nitride-based semiconductor device
03/18/2009CN100470856C Solid-crystal conductive and heat-conductive packing structure of light-emitting diodes
03/18/2009CN100470855C LED lighting light source
03/18/2009CN100470854C Light emitting diode with porous SiC substrate
03/18/2009CN100470853C Novel alignment light emitting diode packaging construction
03/18/2009CN100470852C Semiconductor light-emitting device, manufacturing method thereof, and electronic image pickup device
03/18/2009CN100470842C Active matrix organic electrogenerated luminescent device and manufacturing method thereof
03/18/2009CN100470835C Electronic device containing group-III elements based nitride semiconductors
03/18/2009CN100470749C Crystal wafer testing method and structure of LED
03/18/2009CN100470744C Optical element packaging method and its packaging structure
03/18/2009CN100469584C Self-scanned light-emitting device array driving method
03/17/2009US7504772 Light-emitting diode array
03/17/2009US7504671 Semiconductor device
03/17/2009US7504669 Light emitting devices
03/17/2009US7504667 Light emitting diode having surface containing flat portion and plurality of bores
03/17/2009US7504655 Multilayer structures as stable hole-injecting electrodes for use in high efficiency organic electronic devices
03/17/2009US7504323 GaN single crystal substrate and method of making the same
03/17/2009US7504322 Growth of a semiconductor layer structure
03/17/2009US7504321 MBE growth of an algan layer or AlGaN multilayer structure
03/17/2009US7504274 Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
03/12/2009WO2009031858A2 Semiconductor light emitting device and method of fabricating the same
03/12/2009WO2009031857A2 Semiconductor light emitting device and method of fabricating the same
03/12/2009WO2009031856A2 Lighting emitting device package and method of fabricating the same
03/12/2009WO2009031696A1 Composite substrate for forming light emitting element and method for manufacturing the composite substrate
03/12/2009WO2009031684A1 Glass coated light emitting element and glass coated light emitting device
03/12/2009WO2009031647A1 ZnO-BASED SEMICONDUCTOR ELEMENT
03/12/2009WO2009031618A1 Light-emitting diode device and method for manufacturing the same
03/12/2009WO2009031495A1 Phosphor, method for producing the same, and light-emitting device using the same
03/12/2009WO2009031268A1 Diffraction grating light emitting diode
03/12/2009WO2009031240A1 Self-luminous light-emitting device
03/12/2009WO2009031091A1 Light output device
03/12/2009WO2009031089A1 Light emitting device comprising a composite sialon-based ceramic material
03/12/2009WO2009030193A1 Optical component, method for producing said component, and optoelectronic assembly unit comprising said component
03/12/2009WO2009002129A3 Semiconductor light emitting device and method of manufacturing the same
03/12/2009US20090068822 Method for preparing substrate for growing gallium nitride and method for preparing gallium nitride substrate
03/12/2009US20090068780 Method of fabricating semiconductor optoelectronic device and recycling substrate during fabrication thereof
03/12/2009US20090068779 Method for manufacturing nitride semiconductor device
03/12/2009US20090068776 Method for fabricating semiconductor substrate for optoelectronic components
03/12/2009US20090068774 LED Bonding Structures and Methods of Fabricating LED Bonding Structures
03/12/2009US20090067180 Lens assembly
03/12/2009US20090066965 High power broadband superluminescent diode
03/12/2009US20090066878 Liquid Crystal Display Apparatus
03/12/2009US20090066374 Drive circuit, light emitting diode head, and image forming apparatus
03/12/2009US20090066263 Light Emitting Element Control Circuit
03/12/2009US20090066262 Light- Emitting Diode Lighting Apparatus and Vehicle Light Lighting Apparatus Using the Same
03/12/2009US20090066230 Phosphor and use thereof
03/12/2009US20090066221 Electroluminescent device
03/12/2009US20090065938 Semiconductor Element and Method for Manufacturing Same
03/12/2009US20090065900 Group III nitride-based compound semiconductor device
03/12/2009US20090065800 Optoelectronic component, device comprising a plurality of optoelectronic components, and method for the production of an optoelectronic component
03/12/2009US20090065799 Light emitting diode package
03/12/2009US20090065798 Packaging technique for the fabrication of polarized light emitting diodes
03/12/2009US20090065796 Surface mount light emitting apparatus
03/12/2009US20090065795 Transparent conductive film on p-type layer for gan-based led and method for fabricating the same
03/12/2009US20090065794 Light emitting diode device and manufacturing method therof
03/12/2009US20090065793 Light emitting device
03/12/2009US20090065792 Method of making an led device having a dome lens
03/12/2009US20090065791 White light led with multiple encapsulation layers
03/12/2009US20090065790 LED chips having fluorescent substrates with microholes and methods for fabricating
03/12/2009US20090065789 LED chip package structure with high-efficiency light-emitting effect and method of packing the same
03/12/2009US20090065782 Field shield dielectric as a mask during semiconductor ink jet printing
03/12/2009US20090065763 Light-emitting semiconductor device
03/12/2009US20090064922 Methods of hyperdoping semiconductor materials and hyperdoped semiconductor materials and devices
03/12/2009DE202008016580U1 Leuchtbauteil zur Oberflächenmontage Luminescent component for surface mounting
03/12/2009DE112007001219T5 Weisser Leuchtstoff, und weisses lichtemittierendes Element oder Vorrichtung White fluorescent, and white light-emitting element or device
03/12/2009DE112007001060T5 Einkapselndes Material für optische Halbleiter Encapsulating material for optical semiconductors
03/12/2009DE102007058723A1 Lichtemittierende Struktur Light-emitting structure
03/12/2009DE102007058453A1 Strahlungsemittierende Vorrichtung Radiation emitting device
03/12/2009DE102007049005A1 Radiating device, especially a light-emitting diode, has a layer emitting primary radiation and a conversion layer comprising two materials which convert this radiation into first and second secondary radiation
03/12/2009DE102007043192A1 Leuchtdioden-Modul Light-emitting module
03/12/2009DE102007043182A1 Thick strip conductor producing method for e.g. LED, involves providing openings such that upper side of carrier is exposed in openings, and introducing conductor material containing electrically conductive particles in openings
03/12/2009DE102007043181A1 Optoelectronic component of receiver and transmitter for motor vehicle headlight, has semiconductor body with active zone, which is suitable for production or detection of electromagnetic radiation
03/12/2009DE102007043001A1 Bandverfahren für elektronische Bauelemente, Module und LED-Anwendungen Band method for electronic components, modules and LED applications
03/12/2009DE102007042642A1 Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement A method for producing an optoelectronic component and optoelectronic component
03/12/2009DE102007042561A1 Erkennen und Kompensieren von LED Ausfällen in langen LED-Ketten Recognizing and compensating LED failures in long LED chains
03/12/2009DE10017757B4 LED auf AlGaInN-Basis mit dicker Epitaxieschicht für eine verbesserte Lichtextraktion und Verfahren zum Herstellen des Bauelements LED AlGaInN-base with a thick epitaxial layer for improved light extraction and methods for preparing the component
03/11/2009EP2034530A2 Gan based led formed on a sic substrate
03/11/2009EP2034529A2 Light emitting diode package having heat dissipating slugs
03/11/2009EP2034528A1 Electronic component
03/11/2009EP2034527A1 Light emitting element and method for fabricating the same
03/11/2009EP2034526A1 Package for mounting optical semiconductor element and optical semiconductor device employing the same