Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2013
03/20/2013CN102986043A Light-emitting diode chip and method for producing a light-emitting diode chip
03/20/2013CN102985750A Luminous flux control member and illumination device
03/20/2013CN102985511A Optoelectronic component
03/20/2013CN102985463A Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting semiconductor element and process for producing same, and semiconductor device
03/20/2013CN102983259A LED packaging structure with high cooling efficiency
03/20/2013CN102983258A Light emitting diode crystal grain and making method thereof
03/20/2013CN102983257A Socket for LED lamp filament
03/20/2013CN102983256A LED package
03/20/2013CN102983255A 发光装置 Light-emitting device
03/20/2013CN102983254A White light light-emitting diode (LED) encapsulation method
03/20/2013CN102983253A Curing method for LED fluorescent glue
03/20/2013CN102983252A Color temperature adjustable light-emitting diode (LED) light-emitting device and manufacturing method thereof
03/20/2013CN102983251A Polarized fluorescent powder, fluorescent powder polarization method and method for manufacturing light-emitting diode (LED) luminescent devices
03/20/2013CN102983250A Silica gel lens, fabrication method of silica gel lens and LED light emitting device comprising silica gel lens
03/20/2013CN102983249A Improved heat conduction light emitting diode (LED) substrate and processing technology thereof
03/20/2013CN102983248A Package for mounting optical semiconductor element and optical semiconductor device employing the same
03/20/2013CN102983247A Lens, package and packaging method for semiconductor light-emitting device
03/20/2013CN102983246A Light-emitting diode (LED) light-emitting device and manufacturing method thereof and LED advertisement module provided with LED light-emitting device
03/20/2013CN102983245A Packaging structure for ultraviolet luminous diode
03/20/2013CN102983244A An LED lighting assembly and an illuminating apparatus having the LED lighting assembly
03/20/2013CN102983243A Light emitting device and the packaging including a light emitting structure
03/20/2013CN102983242A Light-emitting diode element
03/20/2013CN102983241A Manufacturing method of light emitting diode (LED) chip
03/20/2013CN102983240A Ultraviolet light-emitting diode with transparent zinc oxide base conducting layer and fabrication method of ultraviolet light-emitting diode
03/20/2013CN102983239A Sapphire combined substrate used for manufacturing luminescent device
03/20/2013CN102983238A Manufacturing method of luminescent device with annular reflecting layer
03/20/2013CN102983237A Epitaxial growth structure with high brightness and high light emitting efficiency
03/20/2013CN102983236A LED chip and manufacturing method thereof
03/20/2013CN102983235A Manufacturing method of nanoscale patterned substrate
03/20/2013CN102983234A Method for manufacturing flexible pyramid array GaN-based semiconductor light-emitting diode
03/20/2013CN102983233A Manufacture method for gallium-nitride-based light-emitting diode
03/20/2013CN102983232A Manufacture method for vertical light-emitting diode
03/20/2013CN102983231A Gallium nitride based light emitting diode with reflecting layer in square annular structure
03/20/2013CN102983230A Method of manufacturing quantum dot layer, transfer method, and quantum dot optoelectronic device
03/20/2013CN102983147A Light emitting diode chip and production method thereof
03/20/2013CN102983146A LED array capable of reducing uneven brightness distribution
03/20/2013CN102983129A Light emitting device
03/20/2013CN102983128A LED and manufacturing method thereof
03/20/2013CN102983127A LED composite chip, processing method and display screen using composite chip
03/20/2013CN102983126A Led发光芯片阵列封装结构 Led light-emitting chip array package
03/20/2013CN102983125A LED (Light Emitting Diode) encapsulating body, manufacturing method thereof and LED system containing LED encapsulating body
03/20/2013CN102983124A Light emitting diode (LED) light source with cooling device
03/20/2013CN102983123A Light-emitting diode (LED) integration module provided with upper and lower electrodes LED chip ceramics substrate and integration technique thereof
03/20/2013CN102983084A Lighting device and encapsulation method therefor
03/20/2013CN102977885A Photoluminescence fluorescent material and white light emitting device
03/20/2013CN102977884A Phosphors and white light emitting devices utilizing the same
03/20/2013CN102977604A 光半导体装置 The optical semiconductor device
03/20/2013CN102977554A Epoxy/organosilicon co-curing composite material for LED packaging and preparation method
03/20/2013CN102977336A Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
03/20/2013CN102456823B Surface-mount light-emitting device
03/20/2013CN102364712B Synthetic jet heat radiating device
03/20/2013CN102321370B Anti-static high heat conductivity light-emitting diode (LED) packaging substrate material and production process thereof
03/20/2013CN102270711B Method for improving light emitting efficiency of blue-green LED (Light-Emitting Diode) on silicon substrate
03/20/2013CN102255012B Manufacturing method and structure of high-voltage direct-current light-emitting diode chip
03/20/2013CN102210029B Silicon light-emitting element
03/20/2013CN102203137B Melt-processable, injection-moldable thermoplastic polymer composition and semi-conductive devices fabricated therewith
03/20/2013CN102185079B Light Emitting Diode (LED) and manufacturing process thereof
03/20/2013CN102163660B Light emitting diode (LED) packaging process
03/20/2013CN102157664B LED (light-emitting diode) lamp panel adopting sputtering circuit and production method thereof
03/20/2013CN102130286B Light-emitting diode (LED) packaging structure and method
03/20/2013CN102110705B Alternating current light emitting diode
03/20/2013CN102104060B Semiconductor structure and forming method thereof
03/20/2013CN102084503B Light emitting device having remotely located light scattering material
03/20/2013CN102071024B Fluorescent powder for LED (light emitting diode) with warm white light and silicate garnet thereof
03/20/2013CN102064091B Nitride semiconductor component and method for the production thereof
03/20/2013CN102054932B Thermoradiation structure and manufacturing method thereof
03/20/2013CN102054851B Light-emitting diode (LED) and manufacturing method thereof
03/20/2013CN102047452B Light emitting device, planar light source, liquid crystal display device and method for manufacturing light emitting device
03/20/2013CN102044605B Semiconductor light-emitting device and method for manufacturing the same
03/20/2013CN102024891B Light-emitting element
03/20/2013CN102017082B Group III nitride semiconductor device and method for manufacturing the same, group III nitride semiconductor light-emitting device and method for manufacturing the same, and lamp
03/20/2013CN101963296B Manufacture method of LED integrated structure
03/20/2013CN101958377B Light emitting device, light emitting device package and lighting system having the same
03/20/2013CN101944563B LED (Light Emitting Diode) chip and preparation method thereof
03/20/2013CN101937954B Epitaxial growth method for improving inner quantum efficiency of GaN-based LED
03/20/2013CN101930987B Luminous element and manufacturing method thereof
03/20/2013CN101859853B 氮化物半导体发光二极管 The nitride semiconductor light-emitting diode
03/20/2013CN101789476B Method for manufacturing light-emitting diode chip
03/20/2013CN101789473B GaN-based vertical structure light-emitting diode and preparation method thereof
03/20/2013CN101752489B Electronic component mounting module and electrical apparatus
03/20/2013CN101710606B LED support
03/20/2013CN101658071B Led illumination device and its drive method
03/20/2013CN101586780B Reflector and lighting apparatus
03/20/2013CN101576238B Method and equipment for welding LED lamp bead
03/20/2013CN101533801B Optical device manufacturing method
03/20/2013CN101383393B Nitride semiconductor element with a supporting substrate and a method for producing a nitride semiconductor element
03/20/2013CN101363608B Luminescence module for semiconductor light source light fitting and semiconductor light fitting
03/19/2013US8401396 Optical communication module and method for using the same
03/19/2013US8400051 Light-emitting device and lighting apparatus incorporating same
03/19/2013US8399944 Light emitting diode and method for fabricating the same
03/19/2013US8399906 AlGaInP-based light-emitting diode with double reflective layers and fabrication method thereof
03/19/2013US8399905 Flat panel display apparatus
03/19/2013US8399904 Light emitting device and lighting system having the same
03/19/2013US8399903 LED lamps
03/19/2013US8399902 Light emitting device and method of manufacturing light emitting device
03/19/2013US8399901 Light emitting device
03/19/2013US8399900 Light emitting device and method for manufacturing a light emitting device
03/19/2013US8399899 Light emitting device
03/19/2013US8399898 Polarized light emitting device
03/19/2013US8399897 Optical device package