| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 04/04/2013 | DE102011115312A1 Halbleiterschichtenfolge, optoelektronischer Halbleiterchip und Verfahren zur Herstellung einer Halbleiterschichtenfolge The semiconductor layer sequence, an optoelectronic semiconductor chip and method of manufacturing a semiconductor layer sequence, |
| 04/04/2013 | DE102011115299A1 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips The optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip |
| 04/04/2013 | DE102011114671A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip A method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip |
| 04/04/2013 | DE102011114670A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip A method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip |
| 04/04/2013 | DE102011114665A1 Verfahren zur Herstellung eines optoelektronischen Nitrid-Verbindungshalbleiter-Bauelements A method for producing an optoelectronic nitride compound semiconductor device |
| 04/04/2013 | DE102011114641A1 Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component, |
| 04/04/2013 | DE102011114559A1 Optoelektronisches Bauelement umfassend eine Haftschicht, Verfahren zur Herstellung einer Haftschicht in einem optoelektronischen Bauelement und Verwendung eines Klebstoffes zur Bildung von Haftschichten in optoelektronischen Bauelementen An optoelectronic component comprising an adhesive layer Process for the preparation of an adhesive layer in an optoelectronic device and use of an adhesive for forming adhesive layers in optoelectronic devices |
| 04/04/2013 | DE102011114558A1 Bauelement und Verfahren zum Herstellen dieses Bauelementes Device and method of manufacturing this component |
| 04/04/2013 | DE102011083691A1 Optoelektronisches halbleiterbauteil The optoelectronic semiconductor component |
| 04/04/2013 | DE102011083669A1 Halbleiter-Leuchtvorrichtung mit Reflexions-Oberflächenbereich Semiconductor light-emitting device with reflection surface area |
| 04/04/2013 | DE102011055549A1 Verfahren zur Herstellung eines optoelektronischen Bauelements mit einer drahtlosen Kontaktierung A process for producing an optoelectronic component with a wireless contacting |
| 04/04/2013 | DE102005030324B4 Lichtemittierende Dioden-Baugruppenanordnung, Kaltkathoden-Fluoreszenzlampe und photolumineszentes Material davon A light-emitting diode assembly arrangement, cold cathode fluorescent lamp and photoluminescent material thereof |
| 04/04/2013 | CA2848917A1 Phosphor materials and related devices |
| 04/03/2013 | EP2575185A2 Semiconductor light-emitting device and manufacturing method of the same |
| 04/03/2013 | EP2574653A2 Light emitting module and phosphor |
| 04/03/2013 | EP2574652A2 Phosphor and light-emitting equipment using phosphor |
| 04/03/2013 | CN202855803U High heat conduction LED packaging substrate |
| 04/03/2013 | CN202855802U Heat radiating structure of COB type LED packaging unit |
| 04/03/2013 | CN202855801U Eutectic substrate |
| 04/03/2013 | CN202855800U Waterproof LED digital tube |
| 04/03/2013 | CN202855799U Sealing compound die strip detachment machine of LED light source |
| 04/03/2013 | CN202855798U Dimmable COB package structure |
| 04/03/2013 | CN202855797U Easily excited long afterglow luminescence product |
| 04/03/2013 | CN202855796U Transparent ceramic white light LED packaging structure |
| 04/03/2013 | CN202855795U Big power LED packaging structure |
| 04/03/2013 | CN202855794U Direct insert type LED packaging structure |
| 04/03/2013 | CN202855793U Diode bracket having thermoelectric separating design and diode having thermoelectric separating design |
| 04/03/2013 | CN202855792U Crystal coating light-emitting diode |
| 04/03/2013 | CN202855736U TFT array substrate, and quantum dot light-emitting diode display device |
| 04/03/2013 | CN202855735U Dual-spectrum LED chip |
| 04/03/2013 | CN202855718U Automatic wafer etching cleaning machine |
| 04/03/2013 | CN202852646U High-power light-emitting diode (LED) light source automobile lamp |
| 04/03/2013 | CN202852587U Light-emitting diode (LED) plant lighting module packaged integrally |
| 04/03/2013 | CN103026804A Optoelectronic lighting module and motor vehicle headlight |
| 04/03/2013 | CN103026518A Light irradiation device, light irradiation module, and printing device |
| 04/03/2013 | CN103026517A Illumination device |
| 04/03/2013 | CN103026516A 发光二极管 Led |
| 04/03/2013 | CN103026515A Light-emitting module |
| 04/03/2013 | CN103026514A Light-emitting apparatus and method of manufacturing light-emitting apparatus |
| 04/03/2013 | CN103026513A Semiconductor component and method for producing a semiconductor component |
| 04/03/2013 | CN103026512A Component and method for producing a component |
| 04/03/2013 | CN103026511A 发光元件 Light-emitting element |
| 04/03/2013 | CN103026510A Radiation-emitting semi-conductor chip and a method for producing a radiation-emitting semi-conductor chip |
| 04/03/2013 | CN103026509A LED-based light emitting devices |
| 04/03/2013 | CN103026498A Woven mesh substrate with semiconductors, and method and device for manufacturing same |
| 04/03/2013 | CN103026488A Light-emitting diode |
| 04/03/2013 | CN103025670A Method for producing phosphor-encapsulating capillary tube, phosphor-encapsulating capillary tube, wavelength-converting member, and method for producing wavelength-converting member |
| 04/03/2013 | CN103022335A Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module |
| 04/03/2013 | CN103022334A High-voltage inverted LED chip and manufacturing method thereof |
| 04/03/2013 | CN103022333A LED core particle die bonding method |
| 04/03/2013 | CN103022332A Flip-chip substrate and manufacturing method thereof as well as flip-chip-substrate-based LED (Light Emitting Diode) packaging structure |
| 04/03/2013 | CN103022331A Light-emitting diode (LED) encapsulation structure for integrated package |
| 04/03/2013 | CN103022330A Illumination device |
| 04/03/2013 | CN103022329A Preparation method of light emitting diode (LED) mixed insulating gel and prepared product |
| 04/03/2013 | CN103022328A Solar simulator light source and realizing method thereof |
| 04/03/2013 | CN103022327A LED packaging structure and method for manufacturing same |
| 04/03/2013 | CN103022326A Intensive packaging method of LEDs |
| 04/03/2013 | CN103022325A LED packaging structure utilizing distant fluorescent powder layer and manufacturing method of LED packaging structure |
| 04/03/2013 | CN103022324A High-power LED support and high-power LED packaging structure |
| 04/03/2013 | CN103022323A Preparation and application for white light light emitting diode (LED) fluorescent powder prefabricated components |
| 04/03/2013 | CN103022322A Manufacturing method of light-emitting device |
| 04/03/2013 | CN103022321A Chip LED and manufacturing method thereof |
| 04/03/2013 | CN103022320A LED lamp structure giving off crystal light and packaging and manufacturing method for LED lamp structure |
| 04/03/2013 | CN103022319A Light emitting diode (LED) encapsulating structure |
| 04/03/2013 | CN103022318A LED display screen package process based on COB (chip on board) technology and LED display screen |
| 04/03/2013 | CN103022317A Surface mounted light-emitting diode (LED) and manufacturing method thereof |
| 04/03/2013 | CN103022316A High-power light-emitting diode (LED) lamp and packaging method thereof |
| 04/03/2013 | CN103022315A Light-emitting diode |
| 04/03/2013 | CN103022314A Light emitting device |
| 04/03/2013 | CN103022313A Light emitting module and its light emitting diode |
| 04/03/2013 | CN103022312A Light-emitting diode device and manufacturing method thereof |
| 04/03/2013 | CN103022311A GaN-LED (Light-Emitting Diode) chip structure and preparation method thereof |
| 04/03/2013 | CN103022310A Light extraction layer of LED luminous chip and LED device |
| 04/03/2013 | CN103022309A Method for preparing polyimide micro-graph on surface of GaN-based material |
| 04/03/2013 | CN103022308A Light-emitting diode grain and manufacturing method thereof |
| 04/03/2013 | CN103022307A Wafer-level LED packaging method |
| 04/03/2013 | CN103022306A Light emitting diode and production method thereof |
| 04/03/2013 | CN103022305A 发光装置 Light-emitting device |
| 04/03/2013 | CN103022304A Light-emitting element and lighting device using the same |
| 04/03/2013 | CN103022303A Method for implementing light emitting diode surface pattern preparation by using two-beam interference for assisting wet etching |
| 04/03/2013 | CN103022302A Patterned substrate of pattern improved LED chip and LED chip containing the same |
| 04/03/2013 | CN103022301A High-power GaN-based vertical structure LED with light extraction microstructure and preparation method thereof |
| 04/03/2013 | CN103022300A Method for producing micro-nanorod light-emitting diode |
| 04/03/2013 | CN103022299A Method for preparing micro-nanorod light-emitting diode |
| 04/03/2013 | CN103022298A High voltage LED chip with light guide pillar and preparation method of high voltage LED chip |
| 04/03/2013 | CN103022297A High-power gamma-irradiation-resisting super-radiation light-emitting diode |
| 04/03/2013 | CN103022296A Semiconductor extension structure and luminescent device thereof |
| 04/03/2013 | CN103022295A Aluminum nitride film growing on silicon substrate and preparation method and application thereof |
| 04/03/2013 | CN103022294A Sapphire epitaxial wafer structure and manufacturing method thereof |
| 04/03/2013 | CN103022293A 图形衬底及其制备方法 Graphics substrate and its preparation method |
| 04/03/2013 | CN103022292A InGaN-based blue light LED (Light Emitting Diode) device and preparation method thereof |
| 04/03/2013 | CN103022291A Patterned substrate equipped with omnibearing reflector and preparation method thereof |
| 04/03/2013 | CN103022290A Light-emitting diode (LED) epitaxial structure with quaternary InAlGaN and method for preparing same |
| 04/03/2013 | CN103022289A Preparation method and light emitting diode (LED) structure of indium gallium nitride (InGaN) base multiple quantum well structure |
| 04/03/2013 | CN103022288A Light emitting diode and manufacturing method thereof |
| 04/03/2013 | CN103022287A Multi-wavelength LED (light-emitting diode) chip |
| 04/03/2013 | CN103022286A Cascaded GaN-based LED (light-emitting diode) epitaxial wafer and preparation method thereof |
| 04/03/2013 | CN103022285A Multi-quantum well layer growing method capable of improving LED luminance |
| 04/03/2013 | CN103022284A LED chip cutting method and LED chip manufactured by same |
| 04/03/2013 | CN103022283A Manufacturing method of gallium arsenide based photonic crystal light emitting diode |