Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
04/2013
04/10/2013CN103038899A High voltage low current surface-emitting led
04/10/2013CN103038880A Optoelectronic component
04/10/2013CN103038878A Diode package having improved lead wire and manufacturing method thereof
04/10/2013CN103038866A 半导体装置 Semiconductor device
04/10/2013CN103038703A Liquid crystal display device
04/10/2013CN103038310A Method for producing phosphor material, phosphor material and light emitting device
04/10/2013CN103038187A Glass ceramic sintered body, reflective member using same, substrate for mounting light emitting element using same, and light emitting device
04/10/2013CN103035831A Manufacture method for light-emitting diode (LED) aluminum substrate insulation layer
04/10/2013CN103035830A Light emitting diode (LED) aluminum substrate and manufacturing method thereof
04/10/2013CN103035829A Heating element mounting substrate, method of manufacturing the same and semiconductor package
04/10/2013CN103035828A Light-emitting diode (LED) packaging structure
04/10/2013CN103035827A White light light-emitting diode (LED) packaging technology
04/10/2013CN103035826A Semiconductor light-emitting device and manufacturing method of the same
04/10/2013CN103035825A Light emitting diode package and fabrication method thereof
04/10/2013CN103035824A Dispensing method of white light light-emitting diode (LED)
04/10/2013CN103035823A Fluorescent powder body capable of exciting light-emitting diode (LED) white light
04/10/2013CN103035822A Light emitting module and phosphor
04/10/2013CN103035821A Package substrate based on flip chip and preparation method thereof
04/10/2013CN103035820A Three-dimensional light-emitting diode (LED) white light device
04/10/2013CN103035819A Package substrate and production method of the package substrate, and light-emitting diode (LED) package structure based on the same
04/10/2013CN103035818A Support frame of light emitting diode (LED) with vertical structure and light emitting diode (LED) with vertical structure
04/10/2013CN103035817A Method and apparatus for accurate die-to-wafer bonding
04/10/2013CN103035816A Lighting module and lighting device thereof
04/10/2013CN103035815A Light emitting diode packaging structure and method of fabricating the same
04/10/2013CN103035814A High heat dissipation aluminum substrate
04/10/2013CN103035813A Circuit substrate for high-temperature component, light-emitting diode (LED) assembly with circuit substrate and manufacturing method thereof
04/10/2013CN103035812A Base plate
04/10/2013CN103035811A Light-emitting diode (LED) packaging structure
04/10/2013CN103035810A Multi-loop heat conduction electrode and wire deploying and controlling method
04/10/2013CN103035809A Light emitting device
04/10/2013CN103035808A Light emitting diode and manufacturing method thereof
04/10/2013CN103035807A Light-emitting diode grain, manufacture method thereof and backlight module
04/10/2013CN103035806A Preparation method of nano graphic substrate for nitride epitaxial growth
04/10/2013CN103035805A Light emitting diode epitaxial wafer and preparation method thereof
04/10/2013CN103035804A Nitride semiconductor light emitting device and manufacturing method thereof
04/10/2013CN103035803A Light emitting diode, light emitting diode package and lighting apparatus including the same
04/10/2013CN103035802A Patterned substrate and light emitting diode (LED) chip used for LED inverted-assembly structure
04/10/2013CN103035801A Light-emitting diode (LED) graph optimized substrate and LED chip
04/10/2013CN103035800A Light-emitting diode
04/10/2013CN103035799A Light-emitting diode
04/10/2013CN103035798A 发光二极管 Led
04/10/2013CN103035797A Complete forbidden band photonic crystal structure, preparation method of the same and luminous diode
04/10/2013CN103035796A Light emitting diode chip and preparation method thereof
04/10/2013CN103035795A Nonpolar multiple quantum well growing on LiGaO2 substrate and preparation method thereof
04/10/2013CN103035794A Light-emitting diode (LED) epitaxial wafer developed on silicon (Si) substrate and preparation method thereof
04/10/2013CN103035793A Method of manufacturing nitride semiconductor device
04/10/2013CN103035792A Optimized light-emitting diode (LED) chip patterned substrate and LED chip
04/10/2013CN103035791A Light emitting diode epitaxial wafer and manufacturing method thereof
04/10/2013CN103035790A Light emitting diode epitaxial wafer and preparation method thereof
04/10/2013CN103035789A Nonpolar blue-ray light emitting diode (LED) epitaxial wafer growing on LiGaO2 substrate and preparation method thereof
04/10/2013CN103035788A Manufacturing method for nanometer-scale imaging substrate
04/10/2013CN103035787A High-luminance light-emitting diode (LED) chip and manufacture method thereof
04/10/2013CN103035786A Method for manufacturing light-emitting diode
04/10/2013CN103035785A Method for manufacturing light-emitting diode
04/10/2013CN103035784A Method for manufacturing light-emitting diode
04/10/2013CN103035632A Luminous encapsulation body and manufacturing method thereof
04/10/2013CN103035592A Heat dissipation device transmitting heat by using phonons
04/10/2013CN103035496A GaN film developed on silicon (Si) substrate and preparation method and application thereof
04/10/2013CN103034902A Chip counting machine for back-end process of semiconductor LED (Light Emitting Diode) chip
04/10/2013CN103031127A Orange fluorescent powder and preparation method thereof, and electric light source made of fluorescent powder
04/10/2013CN103031075A Polymer film and its application in a lighting assembly
04/10/2013CN102280535B Method for preparing top electrode of nanowire array LED (light-emitting diode) based on graphite oxide
04/10/2013CN102270718B Nitride light emitting diode (LED) structure and preparation method thereof
04/10/2013CN102255033B High-power LED (Light-Emitting Diode) encapsulating structure and encapsulating method
04/10/2013CN102226994B Display device for integrating LED (light-emitting diode) chip on conducting glass and manufacturing method thereof
04/10/2013CN102201512B Patterned structure substrate
04/10/2013CN102194808B LED (light emitting diode) integrated packaging device with up-down power type electrodes and packaging method thereof
04/10/2013CN102097558B Method of forming vertical structure light emitting diode with heat exhaustion structure
04/10/2013CN102074636B Light-emitting diode device with flip chip structure
04/10/2013CN102047454B Light-emitting device and fabricating method thereof
04/10/2013CN102042505B Illuminating device and manufacturing method thereof
04/10/2013CN102037575B Light-emitting element and a production method therefor
04/10/2013CN102017203B Light-emitting element and a production method therefor
04/10/2013CN101859860B Method for preparing AlGaInP-series light-emitting diode with double reflecting layers
04/10/2013CN101712869B Fluorescent substance and process for producing the same, and luminescent element using the same
04/10/2013CN101707232B LED product and manufacture method thereof
04/10/2013CN101629017B White heat-curable silicone resin composition and optoelectronic part case
04/10/2013CN101604722B Semiconductor light-emitting device
04/10/2013CN101578473B Light source
04/10/2013CN101572289B Led device with embedded top electrode element and led structure
04/10/2013CN101563637B Illumination module and method
04/10/2013CN101535923B Electronic apparatus having power generating function
04/10/2013CN101519531B White heat-curable silicone resin composition, optoelectric part case, and molding method
04/10/2013CN101248384B Etendue efficient combination of multiple light sources
04/10/2013CN101171320B 有机电致发光器件 Organic electroluminescent devices
04/09/2013US8417215 Method for positioning of wireless medical devices with short-range radio frequency technology
04/09/2013US8417081 Organic electroluminescent optocouplers
04/09/2013US8415709 Organic light-emitting display device
04/09/2013US8415708 Nitride based semiconductor light-emitting device
04/09/2013US8415707 Group III nitride semiconductor device
04/09/2013US8415706 Optical semiconductor package sealing resin material
04/09/2013US8415705 Semiconductor light emitting device
04/09/2013US8415704 Close-packed array of light emitting devices
04/09/2013US8415703 Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
04/09/2013US8415702 Reflector, manufacture method thereof and light-emitting device including the reflector
04/09/2013US8415701 LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
04/09/2013US8415700 Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system
04/09/2013US8415699 Light emitting device, light emitting device package, and illumination system
04/09/2013US8415698 Light emitting device with encapsulant formed with barriers and light emitting device package having the same
04/09/2013US8415697 Light emitting element, method for manufacturing same, and light emitting device