Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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03/06/2013 | EP2564436A2 Light emitting device with trenches and a top contact |
03/06/2013 | EP2564435A1 Led wafer with laminated phosphor layer |
03/06/2013 | EP2241607B1 Light-emitting device using oxynitride phosphor |
03/06/2013 | CN202772194U Flip type light-emitting diode |
03/06/2013 | CN202772193U Surface mounted device light emitting diode |
03/06/2013 | CN202772192U LED heat-dissipating module |
03/06/2013 | CN202772191U Material belt structure made from composite metal |
03/06/2013 | CN202772190U LED support, LED and LED lighting device |
03/06/2013 | CN202772189U LED lighting device packaging structure |
03/06/2013 | CN202772188U Lighting apparatus packaging structure |
03/06/2013 | CN202772187U Lighting apparatus |
03/06/2013 | CN202772186U LED lighting device |
03/06/2013 | CN202772185U Light-emitting diode element based on sapphire substrate |
03/06/2013 | CN202772184U Light-emitting diode substrate |
03/06/2013 | CN202772183U Packaging structure for LED nixie tube |
03/06/2013 | CN202772182U LED support |
03/06/2013 | CN202772181U LED support |
03/06/2013 | CN202772180U Novel LED support |
03/06/2013 | CN202772179U Porcelain mouth used for wire bonding |
03/06/2013 | CN202772178U LED packaging support |
03/06/2013 | CN202772177U Light-emitting diode chip with overvoltage protection structure |
03/06/2013 | CN202772176U Light-emitting diode chip structure |
03/06/2013 | CN202772175U Light-emitting diode |
03/06/2013 | CN202772174U Vertically structured LED (Light-emitting diode) chip |
03/06/2013 | CN202772173U Light-emitting diode with sapphire substrate |
03/06/2013 | CN202772135U Lighting device |
03/06/2013 | CN202772134U Light-emitting device and illumination device |
03/06/2013 | CN202771738U Light-emitting diode (LED) efficacy high-efficiency transition glass display screen |
03/06/2013 | CN202771153U Nano-imprint device for high-brightness LED graphics |
03/06/2013 | CN202769310U High-power white LED (light-emitting diode) light source module |
03/06/2013 | CN102960070A LED control device and liquid crystal display apparatus |
03/06/2013 | CN102959807A Connector and illumination device |
03/06/2013 | CN102959748A Light emitting devices and methods |
03/06/2013 | CN102959747A Light-emitting device and manufacturing method therefor |
03/06/2013 | CN102959746A 光电子半导体构件 Optoelectronic semiconductor components |
03/06/2013 | CN102959745A LED device and method for manufacturing same |
03/06/2013 | CN102959744A Method for manufacturing light-emitting element and light-emitting element manufacturing device |
03/06/2013 | CN102959743A Light emitting device and LED bulb |
03/06/2013 | CN102959742A Electronic arrangement and method for producing electronic arrangement |
03/06/2013 | CN102959741A Optoelectronic component and method for producing same |
03/06/2013 | CN102959740A Nanowire-based optoelectronic device for light emission |
03/06/2013 | CN102959739A Group III nitride semiconductor device and method for producing same |
03/06/2013 | CN102959314A Illumination device |
03/06/2013 | CN102959310A Led bulb |
03/06/2013 | CN102959140A Epitaxial film formation method, vacuum treatment device, method for producing semiconductor light-emitting element, semiconductor light-emitting element, lighting device |
03/06/2013 | CN102959044A Beta-type sialon and production method therefor and light-emitting device |
03/06/2013 | CN102959041A Phosphor material and light-emitting device |
03/06/2013 | CN102959005A B stage sheet, metal foil with applied resin, metal substrate and led substrate |
03/06/2013 | CN102958860A Lead-free glass for sealing semiconductor |
03/06/2013 | CN102956807A Efficiently integrated LED (Light Emitting Diode) light source |
03/06/2013 | CN102956806A Thermal conducting, insulating and voltage resisting integrated device |
03/06/2013 | CN102956805A Light emitting element |
03/06/2013 | CN102956804A Multifunctional surface-mounted LED |
03/06/2013 | CN102956803A Semiconductor light-emitting device |
03/06/2013 | CN102956802A Illumination device |
03/06/2013 | CN102956801A Wavelength conversion structure, manufacturing method thereof and light-emitting device comprising wavelength conversion structure |
03/06/2013 | CN102956800A Wavelength conversion structure, manufacturing method thereof and light emitting device |
03/06/2013 | CN102956799A Light emitting device |
03/06/2013 | CN102956798A High-light outlet efficiency LED (light emitting diode) reflecting cup and manufacture method thereof |
03/06/2013 | CN102956797A Manufacturing method for LED (Light Emitting Diode) |
03/06/2013 | CN102956796A Light-emitting diode crystal grain module and packaging method and removing fixture thereof |
03/06/2013 | CN102956795A TOP LED (Light Emitting Diode) metal support and manufacturing method thereof |
03/06/2013 | CN102956794A Light emitting device package |
03/06/2013 | CN102956793A Light emitting device package and lighting system |
03/06/2013 | CN102956792A Light emitting diode packaging structure |
03/06/2013 | CN102956791A LED package structure |
03/06/2013 | CN102956790A LED lead frame and manufacture method thereof |
03/06/2013 | CN102956789A Package structure of multilayer arrayed LED light engine |
03/06/2013 | CN102956788A LED support |
03/06/2013 | CN102956787A Electronic module, light emitting device and manufacture method of electronic module |
03/06/2013 | CN102956786A Semiconductor light emitting device and method manufacturing thereof |
03/06/2013 | CN102956785A Led array capable of reducing uneven brightness distribution |
03/06/2013 | CN102956784A Light-emitting diode structure and method for manufacturing same |
03/06/2013 | CN102956783A Semiconductor chip, semiconductor emitting device and manufacturing methods for semiconductor chip and semiconductor emitting device |
03/06/2013 | CN102956782A Light emitting device and light emitting device package |
03/06/2013 | CN102956781A Light-emitting element and manufacturing method thereof |
03/06/2013 | CN102956780A Photoelectric element and manufacturing method thereof |
03/06/2013 | CN102956779A Light emitting device and light emitting device package |
03/06/2013 | CN102956778A InP (indium phosphide)-based light emitting diode with interface texturing layer and manufacturing method of InP-based light emitting diode with interface texturing layer |
03/06/2013 | CN102956777A GaP (gallium phosphide)-based light emitting diode with interface texturing layer and manufacturing method of GaP-based light emitting diode with interface texturing layer |
03/06/2013 | CN102956776A GaAs (gallium arsenide)-based light emitting diode with interface texturing layer |
03/06/2013 | CN102956775A Light emitting diode chip and manufacturing method thereof |
03/06/2013 | CN102956774A Method for fabricating nanoscale column array GaN-based normal-structured light emitting diode |
03/06/2013 | CN102956773A Nitride semiconductor template and light-emitting diode |
03/06/2013 | CN102956772A Luminescent device comprising SiC combined substrate |
03/06/2013 | CN102956771A Luminescent device comprising SiC combined substrate |
03/06/2013 | CN102956770A Nitride semiconductor light-emitting element, nitride semiconductor light-emitting device, and method of manufacturing nitride semiconductor light-emitting element |
03/06/2013 | CN102956769A Nitride semiconductor light-emitting device and method for producing the same |
03/06/2013 | CN102956768A Luminescent device comprising sapphire combined substrate |
03/06/2013 | CN102956767A Method for manufacturing silicon-based electroluminescent device containing metal nanoparticles |
03/06/2013 | CN102956766A Light-emitting semiconductor structure and method for fabricating light-emitting diode device |
03/06/2013 | CN102956765A Leds and methods for manufacturing the same |
03/06/2013 | CN102956764A Packaging method for airtight multilayer arrayed light-emitting diodes |
03/06/2013 | CN102956763A Manufacture method of light emitting diode packaging structure |
03/06/2013 | CN102956762A Method and structure enabling III-V-group wafer to be reusable for epitaxial processes |
03/06/2013 | CN102956761A Method for packaging light emitting diode |
03/06/2013 | CN102956760A Method for realizing multilayer circuit on single-layer conducting plane |
03/06/2013 | CN102956759A Method for preparing ITO (indium tin oxide) patterns by stripping |
03/06/2013 | CN102956758A Method for manufacturing LED packaging structure |
03/06/2013 | CN102956757A Manufacturing method of LED encapsulation structure |