| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 04/18/2013 | US20130092932 Semiconductor device and method for manufacturing the same |
| 04/18/2013 | US20130092915 Organic el display unit, method of manufacturing the same, and solution used in method |
| 04/18/2013 | US20130092914 Transparent light emitting device with controlled emission |
| 04/18/2013 | US20130092911 Light-Emitting Device |
| 04/18/2013 | US20130092901 Epitaxial wafer for light-emitting diodes |
| 04/18/2013 | US20130092900 Nanowire sized opto-electronic structure and method for manufacturing the same |
| 04/18/2013 | US20130092899 Coalesced nanowire structures with interstitial voids and method for manufacturing the same |
| 04/18/2013 | US20130092898 Semiconductor light-emitting device |
| 04/18/2013 | US20130092897 Ultrafast photonic crystal cavity single-mode light-emitting diode |
| 04/18/2013 | US20130092896 Optoelectronic Device with a Wide Bandgap and Method of Making Same |
| 04/18/2013 | US20130092310 Buffer film for multi-chip packaging |
| 04/18/2013 | DE112011102336T5 LED Paketanordnung LED package arrangement |
| 04/18/2013 | DE102012218927A1 Licht emittierende Vorrichtung (LED), Fertigungsverfahren dafür und ein LED-Modul, das diese verwendet Light emitting device (LED), manufacturing method thereof and an LED module that uses this |
| 04/18/2013 | DE102011116232A1 Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung The optoelectronic semiconductor chip and method of manufacture |
| 04/18/2013 | DE102011116230A1 Keramisches Konversionselement, optoelektronisches Halbleiterbauelement mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements Ceramic conversion element, optoelectronic semiconductor device with a ceramic conversion element and method of manufacturing a ceramic conversion element |
| 04/18/2013 | DE102011116229A1 Keramisches Konversionselement, optoelektronisches Bauelement mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements Ceramic conversion element, optoelectronic component with a ceramic conversion element and method of manufacturing a ceramic conversion element |
| 04/18/2013 | DE102011115879A1 Optoelektronisches Bauelement und Leuchtstoffe Optoelectronic device and phosphors |
| 04/18/2013 | DE102011084365A1 LED-Modul mit einem Kühlkörper LED module to a heat sink |
| 04/17/2013 | EP2581955A1 Light-reflective anisotropic electrically conductive paste, and light-emitting device |
| 04/17/2013 | EP2581954A1 Die-bonding material for optical semiconductor devices and optical semiconductor device using same |
| 04/17/2013 | EP2581953A2 Light emitting device |
| 04/17/2013 | EP2581952A2 Light emitting diode, light emitting diode package and lighting apparatus including the same |
| 04/17/2013 | EP2581475A1 Preparation method of a type p Zinc oxide ZnO or of a type p ZnMgO |
| 04/17/2013 | EP2580792A1 Radiation-emitting semiconductor body, method for producing a radiation-emitting semiconductor body, and radiation-emitting semiconductor component |
| 04/17/2013 | EP2580791A2 Nanostructure optoelectronic device having sidewall electrical contact |
| 04/17/2013 | CN202888245U High-power LED (Light Emitting Diode) heat sink |
| 04/17/2013 | CN202888244U Heat radiation support assembly with packaged LED |
| 04/17/2013 | CN202888243U Power-type light emitting diode and light emitting diode support |
| 04/17/2013 | CN202888242U LED (light-emitting diode) light-emitting structure |
| 04/17/2013 | CN202888241U Light emitting diode lens |
| 04/17/2013 | CN202888240U Lighting device |
| 04/17/2013 | CN202888239U Heat dissipation carrier structure of light-emitting diode (LED) luminous chip |
| 04/17/2013 | CN202888238U Optical device provided with isolation layer |
| 04/17/2013 | CN202888237U LED (Light Emitting Diode) packaging structure |
| 04/17/2013 | CN202888236U High-efficiency radiating high-power light-emitting diode (LED) |
| 04/17/2013 | CN202888235U LED packaging structure |
| 04/17/2013 | CN202888234U LED packaging structure with fluorescence conversion layer |
| 04/17/2013 | CN202888233U Chip-type LED |
| 04/17/2013 | CN202888232U Led light source module |
| 04/17/2013 | CN202888231U LED support and LED with high light-emitting efficiency |
| 04/17/2013 | CN202888230U LED packaging paster |
| 04/17/2013 | CN202888229U Novel LED packaging paster |
| 04/17/2013 | CN202888228U A directly-plugging LED, a LED display unit, and a LED display screen |
| 04/17/2013 | CN202888227U Concentrating module with packaged LED |
| 04/17/2013 | CN202888226U LED full-color display screen |
| 04/17/2013 | CN202888225U LED support with high light out-coupling efficiency, and LED |
| 04/17/2013 | CN202888224U LED module for directly packaging LED chip on soft and hard combined lead circuit board |
| 04/17/2013 | CN202888223U LED chip |
| 04/17/2013 | CN202888222U LED expitaxial structure |
| 04/17/2013 | CN202888221U Light emitting diode based on sapphire substrate |
| 04/17/2013 | CN202888175U Packaging structure of high-power LED (Light Emitting Diode) integrated chip |
| 04/17/2013 | CN202888174U LED light source module |
| 04/17/2013 | CN202888173U LED packaging device and illuminating device |
| 04/17/2013 | CN202888172U LED wafer and power LED |
| 04/17/2013 | CN202888137U LED pretesting machine |
| 04/17/2013 | CN202884530U Light-emitting diode (LED) circuit module set |
| 04/17/2013 | CN202884529U Light emitting diode (LED) module capable of forming LED support through direct injection-molding on circuit board |
| 04/17/2013 | CN202884526U Light-emitting diode (LED) illuminating device |
| 04/17/2013 | CN202880524U LED packaged product reeling device |
| 04/17/2013 | CN103053223A Color conversion filter |
| 04/17/2013 | CN103053038A Substrate for mounting, light emitting device, and lamp |
| 04/17/2013 | CN103053037A Fluorescent member and light-emitting module |
| 04/17/2013 | CN103053036A Light emitting diode having distributed Bragg reflector |
| 04/17/2013 | CN103053035A Light emitting semiconductor device |
| 04/17/2013 | CN103053034A Fabricating method of nano structure for antireflection and fabricating method of photo device integrated with antireflection nano structure |
| 04/17/2013 | CN103053013A Laminated semiconductor substrate, semiconductor chip, and method for manufacturing laminated semiconductor substrate |
| 04/17/2013 | CN103053007A Ultraviolet irradiation device |
| 04/17/2013 | CN103052842A Light-emitting device and illumination device |
| 04/17/2013 | CN103052839A Bulb-type lamp and illuminating device |
| 04/17/2013 | CN103052699A Surface-treated fluorescent material and process for producing surface-treated fluorescent material |
| 04/17/2013 | CN103050617A LED (Light Emitting Diode) plate tube type aluminum circuit board |
| 04/17/2013 | CN103050616A Compound heat-conducting copper foil substrate |
| 04/17/2013 | CN103050615A High-color-rendering white light LED (light emitting diode) device |
| 04/17/2013 | CN103050614A Integrated LED (Light Emitting Diode) light source lens available for color blending |
| 04/17/2013 | CN103050613A LED (Light Emitting Diode) packaging structure and manufacturing method thereof |
| 04/17/2013 | CN103050612A Coating process of white LED (Light Emitting Diode) fluorescent powder |
| 04/17/2013 | CN103050611A High photosynthetic efficiency white light LED (light-emitting diode) flip chip |
| 04/17/2013 | CN103050610A High photosynthetic efficiency white light LED (light-emitting diode) flip chip |
| 04/17/2013 | CN103050609A Preparation method of white chip for LED (Light Emitting Diode) |
| 04/17/2013 | CN103050608A LED (light emitting diode) packaged based on zinc oxide-bismuth oxide composite ceramic substrate and preparation method thereof |
| 04/17/2013 | CN103050607A LED (Light Emitting Diode) heat dissipation substrate |
| 04/17/2013 | CN103050606A High-color-rendering high-power LED (light emitting diode) encapsulation structure and manufacture method of high-color-rendering high-power LED encapsulation structure |
| 04/17/2013 | CN103050605A LED (light emitting diode) light source module and LED light source thereof |
| 04/17/2013 | CN103050604A Manufacturing method of MLCOB (Multi Lens Chips On Board) light source module |
| 04/17/2013 | CN103050603A Manufacturing method of LED (Light Emitting Diode) packaging structure |
| 04/17/2013 | CN103050602A Light-emitting device |
| 04/17/2013 | CN103050601A Luminous device |
| 04/17/2013 | CN103050600A Chip of light-emitting diode and preparation method thereof |
| 04/17/2013 | CN103050599A Light emitting diode provided with outer ring electrode and manufacturing method thereof |
| 04/17/2013 | CN103050598A Hybrid unequal space patterned substrate and manufacturing method thereof |
| 04/17/2013 | CN103050597A Nitride semiconductor growth substrate and manufacturing method of the same, nitride semiconductor epitaxial substrate and nitride semiconductor element |
| 04/17/2013 | CN103050596A Light emitting diode provided with patterned substrate |
| 04/17/2013 | CN103050595A Nitride light emitting diode |
| 04/17/2013 | CN103050594A Method for manufacturing nitride semiconductor structure |
| 04/17/2013 | CN103050593A AlGaInP quaternary light-emitting diode epitaxial wafer and growth method thereof |
| 04/17/2013 | CN103050592A LED (Light Emitting Diode) epitaxial structure with P (Positive) type superlattice and preparation method thereof |
| 04/17/2013 | CN103050591A Surface plasmon electro excitation source and manufacturing method thereof |
| 04/17/2013 | CN103050590A Semiconductor light emitting device |
| 04/17/2013 | CN103050589A Light-emitting element including light-emitting layer sandwiched between two semiconductor layers |
| 04/17/2013 | CN103050588A LED (light emitting diode) and manufacturing method thereof |