Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
05/2013
05/16/2013DE102011086370A1 LED arrangement for use in retrofit LED lamp, has chip located on enamel layer that is formed on carrier, where thickness and material of enamel layer are selected such that minimum dielectric strength is achieved between chip and carrier
05/16/2013DE102011086365A1 LED assembly for retrofit LED lamp, has strip conductor that is electrically connected with the LED chip
05/16/2013DE102011086359A1 LED-Modul LED module
05/16/2013DE102011086193A1 LED module for use in vehicle light, has LED arranged at dielectric LED carrier that comprises contact section, and cooling body provided for removing heat of LED and directly connected with carrier, where cooling body has base plate
05/16/2013DE102011055233A1 Light emitting device for use in planar arrangement of illumination device to emit light in different applications, has electrical line connection electrically connecting contact terminal of light-emitting component with plugs and sockets
05/16/2013CA2818087A1 Process for making a heat radiating structure for high-power led
05/16/2013CA2818085A1 A method of making a heat radiating structure for high-power led
05/15/2013EP2592666A1 Color regulating device for illumination and apparatus using the same, and method of regulating color
05/15/2013EP2592665A1 Epitaxial wafer for light-emitting diodes
05/15/2013EP2592664A1 A vertical topology semiconductor light-emitting device
05/15/2013EP2592663A1 Light-emitting device with head-to-tail p-type and n-type transistors
05/15/2013EP2592117A1 Polyamide composition and article manufactured therefrom
05/15/2013EP2591518A1 Lighting elements
05/15/2013EP2591511A1 Component and method for producing a component
05/15/2013EP2591510A1 Light-emitting diode chip and method for producing a light-emitting diode chip
05/15/2013EP2591502A1 Light-emitting diode
05/15/2013EP2591280A2 Compact optically efficient solid state light source with integrated thermal management
05/15/2013CN202940272U Device using asymmetric conductive paste (ACP) for installing LED module
05/15/2013CN202940271U Macromolecular light emitting module inlaid with glass bead layer
05/15/2013CN202940270U LED chip with both sides emitting light and LED device
05/15/2013CN202940269U LED package support for high-power LED lamp
05/15/2013CN202940268U Semiconductor structure and light-emitting diode with high hole concentration
05/15/2013CN202940238U Printed flexible plastic LED module belt
05/15/2013CN202940237U Long-persistence light emitting diode packaging structure
05/15/2013CN202940218U Die bonding equipment
05/15/2013CN103109587A Coating method for an optoelectronic chip-on-board module
05/15/2013CN103109385A LED package and method for manufacturing LED package
05/15/2013CN103109384A Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation
05/15/2013CN103109383A Optoelectronic component and method for producing it
05/15/2013CN103109382A 光电子半导体芯片 Optoelectronic semiconductor chip
05/15/2013CN103109370A Lighting system including colllimators aligned with light emitting segments
05/15/2013CN103108941A Rare earth doped luminescent material
05/15/2013CN103107277A Heat radiating structure of light source
05/15/2013CN103107276A Light-emitting diode (LED) packaging structure
05/15/2013CN103107275A Device for light emitting diode (LED) heat conduction and dissipation and insulation and voltage resistance
05/15/2013CN103107274A Light-emitting diode (LED) integrated packaging module achieved by adopting transition electrode
05/15/2013CN103107273A Light-emitting diode packaging component
05/15/2013CN103107272A Substrate, light emitting device and method for manufacturing substrate
05/15/2013CN103107271A Heating element mounting substrate, method of manufacturing the same and semiconductor package
05/15/2013CN103107270A Light-emitting diode device
05/15/2013CN103107269A White light light-emitting diode (LED) high in temperature resistance and free of fluorescent powder
05/15/2013CN103107268A Total reflection type white light light-emitting diode (LED) packaging structure
05/15/2013CN103107267A Light-emitting diode (LED) package powdered glue resisting to fluorescent powder sediment and LED packaging device
05/15/2013CN103107266A Light emitting diode (LED) white light device and manufacturing method thereof
05/15/2013CN103107265A Light emitting device
05/15/2013CN103107264A Integrated light-emitting diode (LED) light source capsulation support frame
05/15/2013CN103107263A Module for mounting LED and LED module
05/15/2013CN103107262A Light-emitting component and thermoelectric separating device of light-emitting component
05/15/2013CN103107261A Semiconductor light emitting device and package
05/15/2013CN103107260A Light emitting device
05/15/2013CN103107259A Manufacturing method of light-emitting diode chip
05/15/2013CN103107258A Light-emitting diode (LED) structure with wavy side edge
05/15/2013CN103107257A Light-emitting diode (LED) epitaxy structure and manufacturing procedure
05/15/2013CN103107256A Light-emitting diode (LED) epitaxial wafer
05/15/2013CN103107255A Growth method of light-emitting diode (LED) epitaxial wafer
05/15/2013CN103107254A Light-emitting diode (LED) structure of current blocking layer with plural penetrating holes
05/15/2013CN103107253A Light emitting diode outer extending structure
05/15/2013CN103107252A Method for preparing sphere-like structure on gallium phosphide (GaP) surface of light-emitting diode (LED) with aluminum gallium indium phosphide (AlGaInP) substrate
05/15/2013CN103107251A Light emitting diode manufacturing method with hexagonal pyramid p type gallium nitride
05/15/2013CN103107250A Manufacturing method for structure of wafer level light emitting diode matrix
05/15/2013CN103107249A Method for preparing in-situ level light emitting diode (LED) array structure
05/15/2013CN103107248A Apparatus and method for die bonding
05/15/2013CN103107247A Light-emitting diode (LED) chip manufacturing method and LED chip structure
05/15/2013CN103107246A Light emitting diode and manufacturing method thereof
05/15/2013CN103107170A Anti-dazzle color temperature adjustable high-voltage light-emitting diode (LED) lamp bead and lamp composed of the same
05/15/2013CN103107169A Light emitting diode package, lighting device and backlight module
05/15/2013CN103107168A LED package structure for enhancing mixed light effect
05/15/2013CN103102688A Preparation method of vinyl silicone oil for LED (light-emitting diode) package
05/15/2013CN103102643A Thermosetting epoxy resin composition and optical semiconductor device
05/15/2013CN102354726B Radiating substrate based on flexible heat conduction material and manufacture method thereof
05/15/2013CN102324449B Chip turning device for surface-mounted device (SMD) light-emitting diode (LED) patch light splitting machine
05/15/2013CN102299244B High-power light emitting diode (LED) seamless special-shaped light source
05/15/2013CN102222760B Deep ultraviolet semiconductor luminescent device
05/15/2013CN102214745B Manufacturing method of gallium nitride based semiconductor luminescent device
05/15/2013CN102185092B Direct inserted light emitting diode (LED) radiating unit and radiating system
05/15/2013CN102163657B Preparation method of patterned substrate of LED (light-emitting diode) chip
05/15/2013CN101997079B Light-emitting device
05/15/2013CN101971372B Semiconductor body and method for producing a semiconductor body
05/15/2013CN101971364B Nitride semiconductor element and method for manufacturing the same
05/15/2013CN101939857B Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
05/15/2013CN101877378B Photoelectric element with transparent bonding structure and making method thereof
05/15/2013CN101872825B Novel method for preparing high-power white LED with low color temperature and high color rendering property
05/15/2013CN101570688B Red light-emitting material and light emitting device using same
05/15/2013CN101232067B Light emitting diode and manufacturing method thereof, integrated light emitting diode, and display
05/14/2013USRE44215 Semiconductor optoelectric device and method of manufacturing the same
05/14/2013US8441612 LED light source, its manufacturing method, and LED-based photolithography apparatus and method
05/14/2013US8441208 Light emitting module and illuminating device
05/14/2013US8441180 Light source having phosphor including divalent, trivalent and tetravalent elements
05/14/2013US8441179 Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
05/14/2013US8441029 Light emitting element including side surface dielectric layer for avoiding impurity adhesion
05/14/2013US8441028 Light emitting device including a lighting emitting chip attached on a heat conductive layer via an undercoating and method of manufacturing the light emitting device
05/14/2013US8441027 Light emitting device and light emitting device package
05/14/2013US8441026 Red emitting SiAlON-based material
05/14/2013US8441024 Semiconductor light emitting device and method for manufacturing the same
05/14/2013US8441023 Semiconductor light emitting device
05/14/2013US8441022 Semiconductor light-emitting device
05/14/2013US8441021 Display device and manufacturing method thereof
05/14/2013US8441020 Light emitting diode wafer-level package with self-aligning features
05/14/2013US8441019 Light emitting device, light emitting device package and lighting system
05/14/2013US8441016 Thin-film transistor, display device, and manufacturing method for thin-film transistors