Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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08/21/2013 | CN103258947A Semiconductor light emitting apparatus, image displaying apparatus |
08/21/2013 | CN103258946A Light emitting diode light bar and manufacturing method thereof |
08/21/2013 | CN103258945A Light-emitting diode and manufacturing method thereof |
08/21/2013 | CN103258944A Method for manufacturing LED package |
08/21/2013 | CN103258943A Completely-manual red-and-blue-light type photosynthetic light turning glass plane light source |
08/21/2013 | CN103258942A Optical structural body and light-emitting device |
08/21/2013 | CN103258941A Light-emitting diode (LED) device, fluorescent powder film for wrapping LED chip and fluorescent powder film wrapping method |
08/21/2013 | CN103258940A Encapsulating method for full-solid white light-emitting diode |
08/21/2013 | CN103258939A Novel LED module encapsulation automation complete equipment |
08/21/2013 | CN103258938A Manufacturing method of heat conduction light-emitting diode (LED) light bar package substrate comprising fluorescent powder |
08/21/2013 | CN103258937A Transparent paster-type light emitting diode (LED) light source |
08/21/2013 | CN103258936A LED packaging substrate and method for coating in shape-preserving mode |
08/21/2013 | CN103258935A Electronic unit base and electronic module and electronic device using the same |
08/21/2013 | CN103258934A Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board by brushing printing ink |
08/21/2013 | CN103258933A Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board through copper plating |
08/21/2013 | CN103258932A Semiconductor package and fabrication method thereof |
08/21/2013 | CN103258931A Photoelectric element with transparent bonding structure and manufacturing method thereof |
08/21/2013 | CN103258930A GaN LED epitaxial wafer structure and preparation method |
08/21/2013 | CN103258929A Light-emitting diode (LED) chip and preparation method thereof |
08/21/2013 | CN103258928A Light-emitting diode (LED) chip and preparation method thereof |
08/21/2013 | CN103258927A GaN based extension structure for improving antistatic capacity of LED and growing method of GaN based extension structure |
08/21/2013 | CN103258926A LED vertical chip structure and manufacturing method |
08/21/2013 | CN103258925A Light emitting component |
08/21/2013 | CN103258924A Tool for wiping LED chip |
08/21/2013 | CN103258923A Quantum well barrier layer growing method for improving CaN-based LED light-emitting efficiency |
08/21/2013 | CN103258922A A light-emitting diode device and a method for increasing light extraction of a light-emitting diode |
08/21/2013 | CN103258921A Method for encapsulating light emitting diodes |
08/21/2013 | CN103258920A Manufacturing method of light emitting diode encapsulating structures |
08/21/2013 | CN103258844A Method of growing a high quality iii-v compound layer on a silicon substrate |
08/21/2013 | CN103258836A High voltage light emitting diode chip and its manufacturing method |
08/21/2013 | CN103258819A LED multi-cup integrated COB package implementation method |
08/21/2013 | CN103258773A Semiconductor component coating film processing method |
08/21/2013 | CN103254900A Phosphor and light-emitting device thereof |
08/21/2013 | CN103254894A Alloy powder for raw material of inorganic functional material and phosphor |
08/21/2013 | CN103254889A Manufacturing method of phosphor film, packaging method of corresponding light emitting diode |
08/21/2013 | CN102573163B High-voltage power supply of electron beam melting furnace |
08/21/2013 | CN102427075B LED apparatus and field sequential display |
08/21/2013 | CN102403419B Manufacturing technology of high-power LED radiating structure |
08/21/2013 | CN102334201B Light-emitting apparatus, light-emitting apparatus unit, and light-emitting apparatus production method |
08/21/2013 | CN102277165B Fluorescent powder based on ultraviolet light or blue light excitation, preparation method thereof and application thereof |
08/21/2013 | CN102272924B Radiation substrate for power LED and power LED product and manufacturing method thereof |
08/21/2013 | CN102270734B Method for manufacturing surface mounting type power LED (light emitting diode) support and product thereof |
08/21/2013 | CN102199426B Stable red fluorescent material, its preparation method and method for enhancing luminescent efficiency |
08/21/2013 | CN102185090B Luminescent device adopting COB (chip on board) packaging and manufacturing method thereof |
08/21/2013 | CN102185087B High-power LED (Light Emitting Diode) encapsulating structure |
08/21/2013 | CN102104094B Light-emitting component and manufacturing method thereof |
08/21/2013 | CN101889356B Light emitting device |
08/21/2013 | CN101749578B Light source apparatus |
08/21/2013 | CN101740698B Semiconductor light emitting device |
08/21/2013 | CN101740558B Light-emitting element head, light-emitting element chip, image forming apparatus and signal supply method |
08/21/2013 | CN101572978B 发光二极管驱动模块 LED Driver Module |
08/20/2013 | US8514350 Light emitting device, display device, and color conversion sheet |
08/20/2013 | US8513882 Color display device having white sub-pixels and embedded light reflective layers |
08/20/2013 | US8513876 Fluorescent substance, method for producing the same, and light-emitting device using the same |
08/20/2013 | US8513873 Light emission device |
08/20/2013 | US8513790 Package-base structure of luminescent diode |
08/20/2013 | US8513746 MEMS sensor and method for producing MEMS sensor, and MEMS package |
08/20/2013 | US8513701 Manufacturing method for liquid crystal display device |
08/20/2013 | US8513699 Light-emitting device |
08/20/2013 | US8513698 LED package |
08/20/2013 | US8513696 Lateral thermal dissipation LED and fabrication method thereof |
08/20/2013 | US8513695 LED package and method for making the same |
08/20/2013 | US8513694 Nitride semiconductor device and manufacturing method of the device |
08/20/2013 | US8513693 Miniature leadless surface mount lamp with dome and reflector cup |
08/20/2013 | US8513692 Light emitting devices |
08/20/2013 | US8513691 Light emitting device including reflective optic housing at least partially filled with reflective material |
08/20/2013 | US8513690 Light emitting diode structure having two lighting structures stacked together and driven by alternating current |
08/20/2013 | US8513689 Organic light emitting diode lighting apparatus |
08/20/2013 | US8513688 Method for enhancing electrical injection efficiency and light extraction efficiency of light-emitting devices |
08/20/2013 | US8513687 Semiconductor light emitting device and semiconductor light emitting apparatus |
08/20/2013 | US8513686 High output small area group III nitride LEDs |
08/20/2013 | US8513685 Electrically pixelated luminescent device incorporating optical elements |
08/20/2013 | US8513684 Nitride semiconductor light emitting device |
08/20/2013 | US8513683 Optical integrated semiconductor light emitting device |
08/20/2013 | US8513682 Optoelectronic component and production method for an optoelectronic component |
08/20/2013 | US8513680 Semiconductor package and method of manufacturing the same |
08/20/2013 | US8513678 Light-emitting device |
08/20/2013 | US8513670 Pixel structure and pixel circuit having multi-display mediums |
08/20/2013 | US8513645 Gallium nitride-based epitaxial wafer and method of producing gallium nitride-based semiconductor light-emitting device |
08/20/2013 | US8513644 Strain-controlled atomic layer epitaxy, quantum wells and superlattices prepared thereby and uses thereof |
08/20/2013 | US8513643 Mixed alloy defect redirection region and devices including same |
08/20/2013 | US8513118 Method for producing compound semiconductor light-emitting device |
08/20/2013 | US8513035 LED chip, LED and a method for manufacturing LED chip |
08/20/2013 | US8511855 Configuration of multiple LED module |
08/20/2013 | US8511853 Point light source and light source module using the same |
08/15/2013 | WO2013119927A1 Light emitting devices and packages and related methods with electrode marks on leads |
08/15/2013 | WO2013119029A1 Method for separating semiconductor devices using nanoporous structure |
08/15/2013 | WO2013118076A1 Low cost encapsulated light-emitting device |
08/15/2013 | WO2013118072A2 Wavelength converted light emitting device |
08/15/2013 | WO2013118002A1 Molded lens forming a chip scale led package and method of manufacturing the same |
08/15/2013 | WO2013117944A1 Enhanced light extraction |
08/15/2013 | WO2013117768A1 A cmos-compatible germanium tunable laser |
08/15/2013 | WO2013117760A1 Light emitting diode chip |
08/15/2013 | WO2013117155A1 Semiconductor structure and method for forming same |
08/15/2013 | US20130210982 Silicone resin composition having high refractive index |
08/15/2013 | US20130210181 Process for producing a layer composite consisting of a luminescence conversion layer and a scattering layer |
08/15/2013 | US20130210180 Light emitting diodes |
08/15/2013 | US20130210179 Printing phosphor on led wafer using dry film lithography |
08/15/2013 | US20130210178 Light-emitting device and method for manufacturing the same |
08/15/2013 | US20130209671 Method and apparatus for load-locked printing |