C25D 3 - Electroplating; Baths therefor

Patents for C25D 3 - Electroplating; Baths therefor (11,896)
12/2011
12/21/2011	CN102292471A 银的绿色氯化方法 Green silver chloride method
12/21/2011	CN102290484A 用于制备太阳电池的半导体薄膜的含Sb溶液体系及制备方法 Sb solution system and method for the preparation of semiconductor thin films solar cells containing
12/21/2011	CN102286762A 一种镀银的铜合金线 One kind of silver-plated copper alloy wire
12/21/2011	CN102286761A 一种印制线路板高分散光亮酸性镀铜添加剂及其制备方法和应用 One kind of highly dispersed PCB bright acid copper plating additive and its preparation method and application
12/21/2011	CN102286760A 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统 Electrochemical filled with a metal of high aspect ratio features large recessed methods aqueous solution plating tank, plating equipment and systems
12/21/2011	CN102286743A 一种钢铁基镶嵌金刚石涂层及其制备方法 One kind of steel base inlaid diamond coating and its preparation method
12/21/2011	CN101974769B 以氨基甲叉二膦酸为主配位剂的碱性无氰镀铜电镀液 A fork two amino acid-based complexing agents alkaline non-cyanide copper plating solution
12/21/2011	CN101219589B 不锈钢基自润滑复合材料及制造方法 Stainless steel base self-lubricating composite materials and manufacturing methods
12/15/2011	WO2011154493A1 Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition
12/15/2011	US20110303547 Method for producing a hard coating with high corrosion resistance on articles made of anodizable metals or alloys
12/15/2011	DE102010017354A1 Verfahren zum Herstellen eines warmgeformten und gehärteten, mit einer metallischen Korrosionsschutzbeschichtung überzogenen Stahlbauteils aus einem Stahlflachprodukt A method for producing a thermoformed and cured, coated with a metallic anti-corrosion coating the steel member from a steel flat product
12/15/2011	CA2801875A1 Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition
12/14/2011	EP2395131A1 Silver-containing alloy plating bath and electrolytic plating method using the same
12/14/2011	EP2393964A1 Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
12/14/2011	CN202072780U 一种电镀系统及其喷流装置 One kind of plating system and the jet device
12/14/2011	CN202070203U 新型富铜液储槽 The new copper-rich liquid storage tank
12/14/2011	CN1944716B 凸点形成用非氰系电解镀金浴 Bump forming system with a non-cyanide electroless gold plating bath
12/14/2011	CN102280388A 基于单晶铜键合丝的制备方法 Based on the preparation method of single crystal copper bonding wire
12/14/2011	CN102277605A 光面粗化电解铜箔的制造工艺 Smooth roughened electrolytic copper foil manufacturing process
12/14/2011	CN102277604A 一种电镀Ni叠层膜及其制备方法 One kind of plating Ni laminated film and method
12/14/2011	CN102277602A 一种金属-玻璃封接技术的金属前期处理方法 Metal - metal glass sealing technology pre-treatment method
12/14/2011	CN102277601A 含辅助配位剂的无氰镀银电镀液 Auxiliary complexing agent containing silver plating electroplating solution
12/14/2011	CN102277600A 一种电镀铜门表面处理的方法 A method of electroplating copper door surface treatment
12/14/2011	CN102277599A 低温治疗探针真空绝热隔层金属组件表面处理工艺 Hypothermia probe vacuum insulation barrier metal component surface treatment processes
12/14/2011	CN102277597A 特殊锂电池用双面光电解铜箔的制备 Preparation of special lithium-sided copper foil used photoelectric
12/14/2011	CN102276796A 镀液及镀覆方法 Bath and plating method
12/14/2011	CN102276446A Method for preparing potassium dihydrogen citrate (malononitrile alloy (I)) for gold plating and monohydrate thereof
12/14/2011	CN101736389B 电镀镍基-石墨自润滑材料及其覆层处理方法 Electroplated nickel base - graphite self-lubricating material and coating treatment
12/14/2011	CN101363128B 用于形成突起的非氰类电解金电镀液 Non-cyanide electrolytic gold plating solution for forming the protrusions
12/13/2011	US8075918 Electroplating a plurality of purified carbon nanocapsules onto a substrate; thermal conductivity, chemical resistance, non oxidizing
12/08/2011	WO2011151785A1 Composition for metal electroplating comprising leveling agent
12/08/2011	US20110300408 Method and device for producing low-wear hard coatings
12/08/2011	DE102010022743A1 Electrical conductor for transmitting high frequency cables/signals, comprises wire-shaped electrical conductor comprising electrically conductive material or along its entire length all around having electrically conductive material layer
12/07/2011	EP2392692A1 Composition for metal electroplating comprising leveling agent
12/07/2011	CN102272356A 电沉积液、系统及方法 Electrodeposition bath, the system and method
12/07/2011	CN102268721A 表面处理自动添加机 Surface treatment machine automatically added
12/07/2011	CN102268707A 含金属锌的复合硅烷膜的制备方法及其用途 Zinc metal composite silane film preparation and use
12/07/2011	CN102268703A 铁-镍或铁-镍-铬合金箔的制备方法及所使用的电解液 Iron - nickel or iron - nickel - chromium alloy foil preparation and electrolyte used
12/07/2011	CN102268702A 铜铟镓硒薄膜的光电化学沉积制备法 Photoelectrochemical deposition (CVD) of copper indium gallium selenide thin films
12/07/2011	CN102268701A 一种光亮无氰镀银电镀液及其配制方法 One kind of bright silver plating electroplating solution and its preparation method
12/07/2011	CN102268673A 一种塑料太阳能集热器选择吸收涂层的制备方法 Choose a plastic solar collector absorbing coating preparation
12/07/2011	CN101892498B 一种在离子液体溶液中电沉积制备铱层的方法 A method for the preparation of the iridium layer electrodeposition in ionic liquid solution
12/07/2011	CN101851712B 合金镀层轴瓦 Bearing alloy plating
12/07/2011	CN101704160B 一种钨与铜及其合金异种金属连接方法 One of the tungsten and copper and its alloys dissimilar metal connection method
12/07/2011	CN101373651B 湿法喷砂式钕铁硼永磁材料的表面前处理方法 Wet the surface pretreatment method of blasting type NdFeB
12/07/2011	CN101194049B 电沉积青铜的方法 Electric deposited bronze
12/01/2011	WO2011149965A2 Copper filling of through silicon vias
12/01/2011	WO2011149330A1 Method of electrodepositing nickel-cobalt alloy
12/01/2011	WO2011147447A1 Process for forming corrosion protection layers on metal surfaces
12/01/2011	US20110293961 Silver-containing alloy plating bath and method for electrolytic plating using same
12/01/2011	US20110290660 Plating bath and method
12/01/2011	US20110290659 Composition for metal electroplating comprising leveling agent
12/01/2011	US20110290658 Additive for chromium electrolytes
12/01/2011	US20110290656 Method for electrochemically depositing carbon nitride films on a substrate
12/01/2011	US20110290655 Method for electrochemically depositing carbon film on a substrate
11/2011
11/30/2011	CN202054913U 可焊性镀锡铝合金带 Weldability of aluminum alloy with tin
11/30/2011	CN102260891A 双脉冲电沉积纳米晶镍钴合金的方法 Double pulse electrodeposited nanocrystalline nickel-cobalt alloy method
11/30/2011	CN102260890A 一种用于无汞锌锰碱性电池防气涨的电镀铟合金 A mercury-indium alloy plating zinc-manganese alkaline batteries for anti-gas up
11/30/2011	CN102260889A 一种高耐蚀光亮柔软的锌钴合金电镀工艺 A high corrosion soft bright zinc-cobalt alloy plating
11/30/2011	CN102260888A 一种金属表面镀饰锌镍合金及三价铬钝化的方法 A metal plated zinc-nickel alloy ornaments and trivalent chromium passivation method
11/30/2011	CN101935854B 电解铜箔用添加剂的制备方法、制品及其应用 A method of producing an electrolytic copper foil additives, their application,
11/30/2011	CN101838828B 一种无氰镀金电镀液 A non-cyanide gold plating solution
11/30/2011	CN101748451B 轴瓦四元合金电镀工艺 Bearing quaternary alloy plating process
11/29/2011	US8066865 Electroplating methods and chemistries for deposition of group IIIA-group via thin films
11/29/2011	US8066864 Crosslinked polymers, galvanization baths comprising them and use thereof
11/29/2011	CA2562977C Strong, lightweight article containing a fine-grained metallic layer
11/24/2011	WO2011036076A3 Copper electroplating composition
11/24/2011	US20110287272 Polymer compositions for metal coating, articles made therefrom and process for same
11/24/2011	US20110287270 Method for forming a boron-containing thin film and multilayer structure
11/24/2011	US20110284386 Through silicon via filling using an electrolyte with a dual state inhibitor
11/23/2011	CN202047164U Herringbone cover plate of processor
11/23/2011	CN202047155U Device for moisturizing strip steel in electroplating tank through gravity method
11/23/2011	CN202047153U Electroplating hard chromium pin hole elimination device
11/23/2011	CN202047151U Foil producing machine with auxiliary cathode
11/23/2011	CN102257035A Composition for metal electroplating comprising leveling agent
11/23/2011	CN102251266A Method for preparing nano platinum/titanium dioxide nanotube electrode by pulse electrodeposition
11/23/2011	CN102250319A Copper electroplating bath and method
11/23/2011	CN102248241A Method for connecting bump bottom metal layer containing Co-based film with lead-free welding spot
11/23/2011	CN101851773B Bi2S3/TiO2 nanotube array and preparation method thereof
11/23/2011	CN101851772B Cu2OTiO2 nanotube array and preparation method thereof
11/22/2011	US8062765 Silver layer formed by electrosilvering substrate material
11/22/2011	US8062498 Method of manufacturing a cathode plate, and a cathode plate
11/17/2011	WO2011142338A1 Method of manufacturing aluminum structure, and aluminum structure
11/17/2011	US20110281108 Surface cooling
11/17/2011	CA2784182A1 Method for producing aluminum structural body and aluminum stuctural body
11/16/2011	EP2386668A1 Product with an anti-microbial surface layer and method for producing same
11/16/2011	CN202039141U Corrosion-resistant and wear-resistant alloy electroplated member
11/16/2011	CN102245805A Two-layer flexible copper-clad laminate substrate and process for producing same
11/16/2011	CN102242385A Clean and environment-friendly iron wires galvanizing apparatus and its technology
11/16/2011	CN102242383A Post-processing method for electroplating of solar welding strip
11/16/2011	CN102242382A Production method of silver-plated conductor for producing highly sophisticated products for aviation and aerospace
11/16/2011	CN102242381A Alkaline non-cyanide copper plating solution with main coordination agent of methylenediphosphonate
11/16/2011	CN102242380A Method for reinforcing uniformity of zinc plating passivation layer
11/16/2011	CN101876082B Ionic liquid gallium chloride/1-methyl-3-ethylimidazole chloride system electroplating solution
11/16/2011	CN101839341B Piston ring and surface spongy chromium plating technique thereof
11/16/2011	CN101542021B Deposition of conductive polymer and metallization of non-conductive substrates
11/16/2011	CN101522954B Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell
11/16/2011	CN101269557B Method for producing composite binding layer by using combination of plating and electro beam physics vapour deposition
11/10/2011	WO2011109660A3 Compositions containing tin nanoparticles and methods for use thereof
11/10/2011	WO2011064556A3 New ionic liquids

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