Patents
Sitemap › C23 - Coating metallic material; Coating material with metallic material; Chemical surface treatment; Diffusion treatment of metallic material; Coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general; Inhibiting corrosion of metallic material or incrustation in general › C23C - Coating metallic material; Coating material with metallic material; Surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; Coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general › C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
04/2010
04/21/2010EP2176896A1 Solution-processed solid electrolytic layer device and fabrication
04/21/2010CN1906705B Conductive fine particle and anisotropic conductive material
04/21/2010CN1707759B Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
04/21/2010CN1641075B Magnesium and Mg alloy surface activating method and surface plating method
04/21/2010CN101696500A Method for anticorrosion treatment on surface of magnesium alloy material
04/21/2010CN101696496A Activating treatment type coppered welding wire process
04/20/2010US7700485 Electro- and electroless plating of metal in the manufacture of PCRAM devices
04/20/2010CA2446791C Substrate with photocatalytic coating
04/15/2010WO2010041278A1 A method for obtaining a coating of a metal compound onto a substrate, an apparatus and a substrate thereof
04/15/2010WO2009156415A3 Method for producing metal oxide layers
04/15/2010US20100092739 Coating for microwavable food product
04/15/2010US20100089761 Method of surface treatment for metal glass part, and metal glass part with its surface treated by the method
04/15/2010US20100089323 Method for coating internal member having holes in vacuum processing apparatus and the internal member having holes coated by using the coating method
04/15/2010US20100089263 Doctor blade
04/15/2010DE102008050983A1 Method for manufacturing a solderable multilayer-structure by manufacturing electrically conductive first layer on an electrically insulated substrate and activating a surface of the first layer
04/14/2010EP2175048A1 Metal plating composition for deposition of tin-zinc alloys onto a substrate
04/14/2010EP2173924A2 Coatings
04/14/2010EP1556878B1 Enhanced field emission from carbon nanotubes mixed with particles
04/14/2010EP1436435B1 Method of anodizing of magnesium and magnesium alloys and producing conductive layers on an anodized surface
04/14/2010CN201437554U Single-head steel bottle chemical outside-bath plating circulation system
04/14/2010CN201437553U Double-head steel bottle chemical outside-bath plating circulation system
04/14/2010CN101693992A Stabilization amd performance of autocatalytic electroless processes
04/14/2010CN101693135A Preparation method of flexible medical silver electrode material
04/13/2010US7695755 Electrode for electrochemical processes and method for producing the same
04/08/2010WO2010040016A2 Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom
04/08/2010WO2010038894A1 Treatment method using plasma
04/07/2010EP2172579A2 Mixture and technique for coating an internal surface of an article
04/07/2010EP2171119A1 Method and apparatus for applying a material on a substrate
04/07/2010CN201436308U Surface tin plating device for conductor wire and the like
04/07/2010CN1747798B Fiber and sheet equipment wear surfaces of extended resistance and methods for their manufacture
04/06/2010US7691664 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
04/06/2010US7691541 Additive and subtractive correction using direct write nanolithography; fine control over lateral dimensions and height
04/06/2010US7691433 Method for structured application of molecules to a strip conductor and molecular memory matrix
04/06/2010US7691189 electroless plating solution comprising aqueous solution of 0.025-0.25 mol/L basic compound, 0.03-0.15 mol/L reducing agent, 0.02-0.06 mol/L copper ion, 0.05-0.3 mol/L tartaric acid; nickel ion formed from nickel chloride or nickel sulfate; reducing agent comprises formaldehyde or hydrazine; uniformity
04/01/2010WO2010036189A1 Method for the electrolytic plating of an article, and an electrolytic solution
04/01/2010WO2010035708A1 Method for forming metal coating film, and electrically conductive particle
04/01/2010WO2010035452A1 Resin composition, cured body and multilayer body
04/01/2010WO2010035451A1 Semi-cured body, cured body, multilayer body, method for producing semi-cured body, and method for producing cured body
04/01/2010WO2010035415A1 Half mirror and process for producing same
04/01/2010WO2010035383A1 Ferrite-coated body and process for production thereof
04/01/2010WO2010015489A3 Method for depositing nickel and noble metal from the same bath
04/01/2010US20100080969 Method for metallizing a component
03/2010
03/31/2010EP2167704A2 Functional material for printed electronic components
03/31/2010CN101688308A Metal-laminated polyimide substrate, and method for production thereof
03/31/2010CN101688298A Method and device for preparing a multilayered coating on a substrate
03/31/2010CN101684554A Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof
03/31/2010CN101684553A Method for preparing noncrystalline-nano-crystalline compound Ni-P alloy plating
03/31/2010CN101684552A Electroless nickel plating method and circuit board manufactured by same
03/31/2010CN101684551A Non-metallic component with metalized surface and manufacturing method thereof
03/31/2010CN101684210A Nickel-plating boron carbide/aluminum composite coating as well as preparation method and application
03/31/2010CN101684200A Plastic blending material, preparation method thereof and surface metalized plastic part
03/30/2010US7687879 Intermediate semiconductor device structure
03/30/2010US7687076 Oxidizing silver nitrate with a persulfate producing a deposition product of silver oxide or Ag2SO4; antimicrobial properties
03/30/2010US7686875 Aqueous copper salt and cobalt salt; triamine complexing agent (eethylenediamine, polypropylenediamine), sulfuric, nitric, hydrochloric, fluoroboric, or acetic acid pH modifier; potassium bromide, can be maintained in an acidic pH environment
03/30/2010US7686874 Electroless plating bath composition and method of use
03/25/2010WO2010032854A1 Electroconductive particles and anisotropic electroconductive material using the same
03/24/2010CN201427996Y Straightening and tempering device of tempering tin-plating bronze steel wire used for high-resistance plastic deformation tire bead
03/24/2010CN101681993A Solution-processed solid electrolytic layer device and fabrication
03/24/2010CN101680094A Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board
03/24/2010CN101680093A Etching solution, and method for metallization of plastic surface employing the method
03/24/2010CN100595333C Zirconium phosphate compound film for surface corrosion resistance of copper or alloy thereof and preparation thereof
03/24/2010CN100595326C Ni-Fe-La-P four-component alloy plating solution for chemical plating on surface of fiberglass and method for preparing same
03/24/2010CN100595325C Electroless plating process for preparing woody electro-magnetic screen material
03/24/2010CN100595324C Manufacturing method of amorphous nickel/phosphorus/alumina composite material
03/24/2010CN100595323C Surface chemical plating Ni-P process using nickel sulfate as main salt
03/24/2010CN100595322C Cleanout method of metal deposited on surface of chemical plating equipment
03/23/2010US7682431 Plating solutions for electroless deposition of ruthenium
03/18/2010WO2010029073A1 Containers coated by deposition of a sol-gel on their inner surface
03/18/2010WO2009144186A3 Method for manufacturing transparent conducting oxides
03/18/2010WO2009062488A3 Process for machining a structured surface
03/17/2010EP2162567A2 Method for treating an at least partially metallised textile, treated textile and use thereof
03/17/2010EP2162566A1 Multilayer printed wiring boards with holes requiring copper wrap plate
03/17/2010EP2162565A2 Ultra-hard composite layers on metal surfaces and method for producing the same
03/17/2010CN201424505Y Treatment device for thick-specification tempered tin plating bronze rejected bead wire
03/17/2010CN101675186A Process for applying a metal coating to a non-conductive substrate
03/17/2010CN101675181A Preliminary metallizing treatment of zinc surfaces
03/17/2010CN101671820A Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
03/17/2010CN101671819A Non-noble metal activating solution of polyimide film and surface activating process thereof
03/17/2010CN101671818A Synthetic resin complex
03/17/2010CN101670245A Method for preparing high hydrogen permeation selectivity metal palladium-based composite membrane
03/17/2010CN100594262C Electroless deposition methods and systems
03/17/2010CN100594260C Method for coating the interior of a hollow component and a hollow component having an interior coating
03/16/2010US7678258 Void-free damascene copper deposition process and means of monitoring thereof
03/16/2010US7678183 complexing agent such as ammonia and amine compounds, reducing agent such as phosphinic acid and phosphinate salts, and at least one unsaturated carboxylic acid compound such as acrylic acid, propiolic acid, crotonic acid, isocrotonic acid, methacrylic acid, citraconic acid
03/11/2010WO2010027950A2 Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating process
03/11/2010WO2010026926A1 Rolling bearing
03/11/2010WO2010026571A2 Metal nanowire thin-films
03/11/2010WO2010026243A1 Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method.
03/11/2010WO2009036977A3 Method for partially coating complex components with catalytically active components
03/11/2010CA2732661A1 Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method
03/10/2010EP2160482A2 Method for generating a ceramic layer on a component
03/10/2010CN101668880A Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package
03/10/2010CN101665930A Magnesium alloy direct chemical plating NI-P-SiC plating solution formula and plating process
03/10/2010CN101665929A High corrosion resistance plating solution of electroless Ni-P alloy plating and electroless plating method thereof
03/10/2010CN100593756C Photosensitive resin composition and method for the formation of a resin pattern using the composition
03/04/2010WO2010023895A1 Sensitizing solution for electroless plating and electroless plating method
03/04/2010WO2010022916A1 Method for producing ceramic passivation layers on silicon for solar cell manufacture
03/04/2010WO2010022641A1 Plastic composition and method of selective metallization on the surface thereof
03/04/2010US20100055466 Oxhidation inhibition of carbon-carbon composites
03/04/2010US20100055422 Electroless Deposition of Platinum on Copper
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