Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
01/2009
01/13/2009US7476460 Oxidation of metal compound forming oxides for fuel cells
01/13/2009US7476418 Etching and planarizing a substrate by irradiation with a focused ion beam, decomposing and depositing an organic gas into a columnar electrode, and then attaching the nanotubes to the electrode; maintained electroconductivity between nanotubes and electrodes
01/13/2009US7476412 Method for the metalization of an insulator and/or a dielectric
01/08/2009WO2009004774A1 Metal-laminated polyimide substrate, and method for production thereof
01/08/2009WO2009003901A1 Process for metalizing polyamide blends
01/08/2009WO2008135478A3 Preliminary metallizing treatment of zinc surfaces
01/08/2009US20090007814 Electroless metallizing bath comprising an aqueous solution of a metal salt, a reducing agent, and fine particulates where the bath is essentially free of heavy metal stabilizers; environmentally friendly; health; wear resistance; protective coatings; nickel chloride, sodium hypophosphite, diamonds
01/08/2009DE102007030594A1 Component with high gloss surface coating with base, wettability, activator and sealing layers useful in motor vehicle, kitchen ware and jewellery component industries provides means for coating without use of electrical energy
01/07/2009EP2012568A1 Method for forming metal pattern, metal pattern and printed wiring board
01/07/2009EP2011917A2 Method for manufacturing embossed conductive cloth
01/07/2009EP2010338A2 Method for forming a tribologically enhanced surface using laser treating
01/07/2009EP2010229A1 A substrate having an electron donating surface with metal particles comprising palladium on said surface
01/07/2009EP1390563B1 Substrate with photocatalytic coating
01/07/2009CN101338418A Ternary alloy plating solution without electrodeposition
01/07/2009CN101338417A Surface treating method for hydrogen occluding alloy
01/07/2009CN101338416A Shading member, manufacturing method thereof, film and photo mask using the member
01/06/2009US7473307 To produce electroless copper plating film having stable and improved adhesivity and low electrical resistance; improve the reliability and price competitiveness of products
01/01/2009US20090000549 Substrate processing method and apparatus
12/2008
12/31/2008WO2009000874A2 Ultra-hard composite layers on metal surfaces and method for producing the same
12/31/2008WO2009000676A2 Method for generating a ceramic layer on a component
12/31/2008WO2009000674A2 Substrate with a catalytically active surface and method for the production thereof
12/31/2008WO2009000657A2 Component comprising a ceramic layer containing a dye and method for the production thereof
12/31/2008EP2009143A1 Bipolar electroless deposition method
12/31/2008EP2009142A1 Composition for etching treatment of resin molded article
12/31/2008EP2009141A2 Thermal barrier system and bonding method
12/31/2008EP2007440A1 A biocompatible substrate having an electron donating surface with metal particles comprising palladium on said surface
12/31/2008EP1556737B1 Methods for fabrication of nanometer-scale engineered structures for mask repair application
12/31/2008CN101336309A Cobalt-based alloy electroless plating solution and electroless plating method using the same
12/31/2008CN101333616A Whisker- toughened cermet cutting tool and method for preparing same
12/31/2008CN100447300C Wear resistant friction reducing nickel base composite coating layer and its preparation method
12/31/2008CN100447299C Plated polyester resin article and method for production thereof
12/31/2008CN100447298C Method for cladding titanium dioxide nano film on surface of zinc sulphide phosphor powder
12/30/2008US7471182 Core having superior end face insulation and method of treating core end faces to give insulation coating
12/24/2008WO2008155453A1 Coating and method for producing same
12/24/2008WO2008155251A1 Solution-processed solid electrolytic layer device and fabrication
12/24/2008WO2008036984A3 Technique for plating substrate devices using voltage switchable dielectric material and light assistance
12/24/2008EP2006415A2 Surface modification liquid for plastic and method of metallizing plastic surface therewith
12/24/2008EP2004908A2 Method for applying a metal on a substrate
12/24/2008EP2004907A2 Method for applying a metal on paper
12/24/2008EP2004873A1 Process for the treatment of metal coated particles
12/24/2008DE20221901U1 Lösung zur Vorbehandlung einer zu metallisierenden Kunstoffoberfläche Solution for pretreating a plastic surface to be metallized
12/24/2008CN101331245A Plated resin molding
12/24/2008CN101328582A Copper plating method of wirelike material and coppered wire
12/24/2008CN100445425C Polytetrafluoroethylene dispersion for electroless nickel plating applications
12/24/2008CN100445424C Method and apparatus for growing three-dimensional photon crystal film by pressure-reducing self-assembling
12/24/2008CN100444992C Coated powder and process for the preparation thereof
12/23/2008US7468320 Reduced electromigration and stressed induced migration of copper wires by surface coating
12/18/2008WO2008153939A1 Multilayer printed wiring boards with holes requiring copper wrap plate
12/18/2008WO2008152974A1 Method for production of metal-coated polyimide resin substrate having excellent thermal aging resistance property
12/18/2008WO2008127418A3 Sol-gel coating method and composition
12/18/2008WO2006111837A3 Method for production of foamed metal
12/18/2008US20080311400 Nanotube growth and device formation
12/18/2008CA2690270A1 Method for treating an at least partially metallized textile, treated textile and the use thereof
12/17/2008EP2002460A2 Surface treatments for spiral bevel gear sets
12/17/2008EP2001811A2 Modified surfaces and method for modifying a surface
12/17/2008EP1415019B1 Treatment for improved magnesium surface corrosion-resistance
12/17/2008EP1371754B1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component
12/17/2008CN101326306A Palladium complex and catalyst-imparting treatment solution using the same
12/17/2008CN101326001A Production of nanosized materials
12/17/2008CN101325112A Cadmium oxide base room-temperature rare magnetic semiconductor nano material doped with nickel ion and preparation method thereof
12/17/2008CN100444331C Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
12/17/2008CN100443631C Preparation method of manganese-cobalt-nickel thin film heat-sensitive material
12/16/2008US7465358 Measurement techniques for controlling aspects of a electroless deposition process
12/11/2008WO2008149717A1 Light reflecting plate, method of manufacturing the same, and light reflecting device
12/11/2008WO2008148679A2 Method for creating a dry lubricant layer
12/11/2008WO2008148642A1 Method for metal coating thermoplastic particles
12/11/2008WO2008123767A3 An undercoating layer formulation for non-platable grade substrate for electroless metal plating
12/10/2008EP1773951A4 Wood preservative composition
12/10/2008EP1668167B1 Protection of metallic surfaces against thermally-induced wrinkling (rumpling)
12/10/2008CN101319325A Method of manufacturing fine helical nickel-carbon alloy material
12/10/2008CN101319319A Electroless gold plating bath, electroless gold plating method and electronic parts
12/10/2008CN101319318A Electroless gold plating bath, electroless gold plating method and electronic parts
12/10/2008CN101319317A Anti-rust plating liquid, formulating method and process for plating metal tableware with the same
12/10/2008CN101319316A Method for chemical nickel plating on aluminum and aluminum alloy surface
12/10/2008CN101319315A Activation method before flexible backing material chemical plating based on numerator self-assembly technique
12/10/2008CN101319314A Thin-layer metal membrane material and method of producing the same
12/10/2008CN100442951C Method for the manufacture of printed circuit boards with integral plated resistors
12/10/2008CN100441738C Chemical gold plating liquid
12/10/2008CN100441737C High temperature corrosion and wear resistant technical process for oil-well pump cylinder plunger valve
12/10/2008CN100441736C Supersonic and atomized filming method and device for preparing YBCO thin film
12/04/2008WO2008039577A3 Polyimide solvent cast films having low coefficient of thermal expansion and method of manufacture thereof
12/04/2008US20080299309 Method for producing a coating with improved adhesion
12/04/2008US20080296165 Plating apparatus
12/03/2008EP1997936A1 Composition for metal surface treatment, metal surface treatment method, and metal material
12/03/2008EP1997933A1 Plating method of electrode can of flat alkaline cell and plating apparatus thereof
12/03/2008CN101314848A Non-ammonia type plating solution for chemical nickel plating
12/02/2008US7459182 Suspending an organic substrate in an aqueous solution of a fluorine scavenger; adding an aqueous solution of one or more fluorine containing group 3 to 15 metal complexes; subjecting the suspension to microwave radiation to deposit the metal oxide; substrate may then be dissolved
11/2008
11/27/2008WO2008143190A1 Pretreatment process for electroless plating of resin molded body, method for plating resin molded body, and pretreatment agent
11/27/2008WO2008051344A3 Method and apparatus for coating a medical device by electroless plating
11/27/2008WO2007134843A3 Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell
11/26/2008EP1458905B1 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes
11/26/2008CN101313010A Method to produce adhesiveless metallized polyimide film
11/26/2008CN101311309A Ni-Fe-La-P four-component alloy plating solution for chemical plating on fiberglass and method for preparing same
11/26/2008CN101311308A Five-component alloy plating solution for chemical plating on surface of fiberglass and method for preparing same
11/26/2008CN101311307A Ni-Fe-La-P four-component alloy plating solution for chemical plating on surface of fiberglass and method for preparing same
11/26/2008CN101311306A Method for plating copper on surface of carbon nanotube
11/26/2008CN101311305A Method for plating nickel on surface of carbon nanotube
11/26/2008CN100436643C Plating apparatus
11/26/2008CN100436469C Selectively coating metal to nucleic acid by nano metal particles generated in-situ
11/25/2008US7456501 Semiconductor structure having recess with conductive metal
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