Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
05/2011
05/11/2011EP2318328A2 Method for deposition of ceramic films
05/11/2011CN201826014U Primary and secondary hanger
05/11/2011CN102051689A Preparation method of metal/alloy nanoparticle-semiconductor nanowire or nanorod composite nano system
05/11/2011CN102051607A Electroless copper plating solution
05/11/2011CN102051606A Method for coating copper on surface of iron powder
05/11/2011CN102051605A Method for anti-corrosive surface treatment of aluminum or aluminum alloy product
05/11/2011CN102051604A Austenitic stainless steel surface chemical nickel-phosphorus plating method
05/11/2011CN102049529A Method for preparing Ge material by adopting Ge acid radical ion water-solubility precursor
05/11/2011CN101664803B Preparation method of coated copper-silver metal powder
05/11/2011CN101646805B Methods for producing metal oxide thin film, capacitor, hydrogen separation membrane-electrolyte membrane assembly, and fuel cell
05/11/2011CN101630633B Substrate proximity processing structures and methods for using and making the same
05/11/2011CN101565833B Positive and negative alternate electrolysis-resistance metal oxide electrode
05/11/2011CN101490310B Process for metallization of plastic surfaces
05/11/2011CN101372740B Copper plating bath for coating copper and method for surface copper plating permanent magnetic material using the same
05/11/2011CN101237027B Method for depositing air light-sensitive material on substrate
05/10/2011US7938948 Silver and silver alloy plating bath
05/05/2011WO2011052966A2 Method for manufacturing conductive metal thin film using carboxylic acid
05/05/2011DE102009051439A1 Producing metallic conductive coating or partial coating made of metal on coated substrate, comprises applying metal coating made of an ionic solution at coated region on semiconductor surface of substrate, using light irradiation
05/04/2011EP2316140A1 COMPOSITIONS AND METHODS FOR THE MANUFACTURE OF RARE EARTH METAL-Ba2Cu3O7-THIN FILM
05/04/2011CN201817549U Chemical plating solution circulating device
05/04/2011CN102041492A Method for carrying out surface modification on plating layer of chemical-plating nickel-cobalt-ferrum alloy fabric by utilizing rare-earth metal salt
05/04/2011CN102041491A Coating processing method
05/04/2011CN102041490A Process for electronickelling chemical plating roll surface of inner cavity of water-cooling roll of cold-rolled sheet hot galvanizing production line
05/04/2011CN102041489A Reproducible chemical nickel plating process
05/04/2011CN102041488A Pre-plating process of chemically-plated Ni-P alloy
05/04/2011CN101717927B Solution for replacing silver plating in deposited nanostructure on surface of silicon matrix and use method thereof
05/04/2011CN101440490B Novel protection technique for plating multilayer coating on surface of sintered Nd-Fe-B permanent magnet
04/2011
04/28/2011WO2011049818A1 Composition and process for improved zincating magnesium and magnesium alloy substrates
04/28/2011WO2011048984A1 Process for production of plating bath, plating bath, and electronic component
04/28/2011WO2011048983A1 Method for preparation of plating bath, plating bath, and electronic component
04/28/2011WO2011048149A1 Method of producing porous metal oxide films using template assisted electrostatic spray deposition
04/27/2011EP2314734A1 Method of producing porous metal oxide films using template assisted electrostatic spray deposition
04/27/2011EP1760171B1 Pretreating agent for electroless plating and method of electroless plating using the same
04/27/2011EP1734539B1 Corrosion-resistant rare earth magnets and process for production thereof
04/27/2011CN1540692B 镀覆接线端 Plated terminals
04/27/2011CN102037063A Method for conditioning insulating resin and its use
04/27/2011CN102031523A A method of reducing the quantity of lead
04/27/2011CN102031507A Hanging basket for bearing a plurality of board pieces and method for treating the board pieces
04/27/2011CN102031506A Preparation method and application of Ni-P micro-nanometer material
04/27/2011CN102031505A Treating fluid for coarsening and activating polyimide and method for coarsening and activating surface of polyimide
04/27/2011CN102031052A Neodymium iron boron rare earth permanent magnet surface coating and application method thereof
04/27/2011CN102029391A Stainless steel based metal fiber porous material with high specific surface area and preparation method thereof
04/27/2011CN102029089A System and method for circulating and filtering chemical copper deposition solution
04/27/2011CN101709463B Surface treatment method for improving wear resistance and corrosion resistance of austenitic stainless steel shell
04/27/2011CN101311308B Five-component alloy plating solution for chemical plating on surface of fiberglass and method for preparing same
04/27/2011CN101148757B Composition of surface chemistry plating liquid and preparation method for wooden electromagnetic screen material
04/21/2011US20110088934 Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same
04/21/2011DE102004047423C5 Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung Electrolessly deposited nickel alloy and their use
04/20/2011CN201804716U Isolated-type roller for local chemical plating of electronic ceramic surface
04/20/2011CN201801594U Copper deposition hanging basket
04/20/2011CN201801593U Water bath deposition film plating tank
04/20/2011CN102021544A Magnesium alloy surface chemical nickel plating solution and method thereof
04/20/2011CN102021543A Composite complexing agent and chemical nickel-plating solution containing same
04/20/2011CN102021542A Photochemical activating fluid and nonmetallic surface selective activating method
04/20/2011CN102021541A Manufacturing process for workpiece for electroless plating
04/20/2011CN102021540A Method for production of electroless plating material
04/20/2011CN101760730B Low-temperature chemical tinning solution and tinning method
04/20/2011CN101654797B Chemical-copper plating liquid and copper plating production process
04/20/2011CN101565836B IrO2 seed embedded iridium coating titanium anode and preparation method thereof
04/20/2011CN101501249B Partial plating method, laser plating equipment and plating member
04/20/2011CN101415863B Conductive powder plated by electroless plating and process for producing the same
04/20/2011CN101413117B Pretreatment solution for electroless copper plating
04/20/2011CN101338416B Shading member, manufacturing method thereof, film and photo mask using the member
04/20/2011CN101070461B Super-high heat-conductive diamond-copper composite package material and production method
04/14/2011WO2009090419A8 Method for deposition of ceramic films
04/14/2011US20110083785 Electrode forming method
04/13/2011EP2309036A1 Anti-displacement hard gold compositions
04/13/2011EP2309030A1 A method of reducing the quantity of lead released by bronze and/or brass water-system components into liquids that are intended for human consumption
04/13/2011EP2309029A1 Process for producing tin-plated steel plate, and tin-plated steel plate
04/13/2011EP2309025A1 Plated object with copper thin film formed by electroless plating
04/13/2011EP2309024A2 Process of forming a coating system, coating system formed thereby, and components coated therewith
04/13/2011EP2308587A1 Hydrogen transport membrane fabrication method
04/13/2011CN201793739U Clamp used for clamping thickness and backlight detection small plate
04/13/2011CN201793738U Sheet jig for chemical copper precipitation
04/13/2011CN1993498B Printed wiring board
04/13/2011CN102017097A Method for producing ceramic passivation layers on silicon for solar cell manufacture
04/13/2011CN102011109A Chemical codeposition method for preparing palladium alloy film
04/13/2011CN102011108A Chemical plating method for preparing ultrathin palladium film with high specific surface area
04/13/2011CN102011107A Chemical nickel-phosphorus alloy plating solution capable of obtaining high-solderability plating layer
04/13/2011CN102009390A Electroforming high-precision profiling grinding wheel and preparation process thereof
04/13/2011CN102009186A Low-cost tree-like Co-Pt core shell structure bimetallic material and preparation method thereof
04/13/2011CN102009173A Method for preparing copper-clad tungsten tungsten-copper composite powder
04/13/2011CN101733401B Method for preparing nickel-plated copper powder
04/13/2011CN101649453B Method for preparing Ni-Fe-Sm-Co-P plating liquid and glass fibre Ni-Fe-Sm-Co-P alloy
04/13/2011CN101578392B Plated article and method for producing the same
04/13/2011CN101403111B Method for improving superficial hardness of magnesium alloy
04/07/2011WO2011039310A1 Solution and method for activating the oxidized surface of a semiconductor substrate
04/07/2011US20110081779 Method and Apparatus for Material Deposition
04/07/2011CA2774790A1 Solution and method for activating the oxidized surface of a semiconductor substrate
04/06/2011EP2305856A1 Process for applying a metal coating to a non-conductive substrate
04/06/2011EP2304078A2 Method of forming a microstructure
04/06/2011CN102003695A LED heat radiator and local nickel plating device and local nickel plating method thereof
04/06/2011CN102002711A Method for coating on material
04/06/2011CN102002694A Method for preparing uniform silver conducting layer on surface of metal or nonmetal material
04/06/2011CN102002693A Plating method for metal material
04/06/2011CN102002692A Chemical plating Ni (nickel)-P (phosphorus)/Ni-P-PTFE (polytetrafluoroethylene) compound structure plating layer and preparation process
04/06/2011CN102002691A Chemically plated Ni-Zn-P anode composite structure plating and preparation technique thereof
04/06/2011CN102002690A Chemical nickel-plating method of metal surface
04/06/2011CN102002689A Method for preparing silica and alumina sol type activator used for activating nonmetal materials
04/06/2011CN102002688A No-palladium activate fluid formula and activation method of fabric chemical plating iron and nickel
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