Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
11/2009
11/19/2009WO2009138223A2 Aluminum-containing substrate comprising a microporous layer of an aluminum phosphate zeolite, method for the production thereof, and use thereof
11/19/2009WO2009118083A3 Composition for manufacturing sio2 resist layers and method of its use
11/19/2009WO2009114217A8 Method of electrolytically dissolving nickel into electroless nickel plating solutions
11/19/2009DE112004001309B4 Verfahren zur Herstellung eines Dünnschicht-Supraleiters mittels metallorganischer Abscheidung einer Vorläufer-Lösung von Pulver eines supraleitenden Oxids A method for producing a thin-film superconductor by metalorganic deposition of a precursor solution of a powder of an oxide superconductor
11/18/2009CN101580933A Deposit fluid recycling utilization method
11/18/2009CN101580657A Ink and method for manufacturing conductive wires by ink
11/18/2009CN101579632A Nickel palladium/ silicon microchannel catalyst and application thereof on preparing electrode of integratable direct methanol fuel cell
11/18/2009CN100560795C Method for producing hypereutectic Al-Si alloy modifier by chemical deposition
11/18/2009CN100560794C Surface processing technology for Mg-alloy
11/18/2009CN100560255C Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition
11/17/2009USRE40983 Method to plate C4 to copper stud
11/12/2009WO2009136861A1 Apparatus and method for depositing and curing flowable material
11/12/2009WO2009136044A2 Mesostructured coatings comprising a specific texture agent for application in aeronautics and aerospace
11/12/2009WO2009032567A3 Corrosion resistant aluminum alloy substrates and methods of producing the same
11/12/2009WO2009019147A3 Deposition from ionic liquids
11/12/2009DE102007018845B4 Verfahren zur Abscheidung einer metallhaltigen Substanz auf einem Substrat und Beschichtungsmaterial dafür A method of depositing a metal-containing substance on a substrate and coating material for
11/11/2009EP1227173B9 Electroless plating method
11/11/2009CN101578394A Plated material having metal thin film formed by electroless plating, and method for production thereof
11/11/2009CN101578393A Plated material having metal thin film formed by electroless plating, and method for production thereof
11/11/2009CN101578392A Plated article and method for producing the same
11/11/2009CN101577148A Transparent conducting film and preparation method thereof
11/11/2009CN101576118A Unleaded Cu-based sliding bearing material and preparation method thereof
11/11/2009CN100558939C Low temperature preparation method for alcohol heat assistant ferro-electricity film
11/10/2009US7616016 Probe card assembly and kit
11/10/2009US7615277 Formation method of metal layer on resin layer, printed wiring board, and production method thereof
11/10/2009CA2345552C Novel sol-gel calcium phosphate ceramic coatings and method of making same
11/05/2009WO2009134732A2 Open pore ceramic matrix foams coated with metal or metal alloys and methods of making same
11/05/2009WO2009133751A1 Plated molded article and method for producing the same
11/05/2009WO2009044144A3 Method of manufacture of an electrode for a fuel cell
11/05/2009DE19639174C5 Verfahren für das außenstromlose Vernickeln Method for electroless nickel plating
11/04/2009EP2113578A2 Metal body with metallic protective coating
11/04/2009EP2113037A1 Conductive fibrous web and method for making the same
11/04/2009CN100557080C Substrate with photocatalytic coating
11/03/2009US7611569 Electroless copper compositions
10/2009
10/29/2009DE102008020037A1 Coating method comprises treating surface with activator, followed by electroless plating with nickel-phosphorus alloy, activator containing hydrochloric acid, nickel chloride, acetic acid, citric acid, lactic acid, succinic acid and water
10/28/2009EP2112250A1 Stainless separator for fuel cell and method of manufacturing the same
10/28/2009EP2111482A2 Medical devices with extended or multiple reservoirs
10/28/2009CN101568669A Method of surface treatment for metal glass part, and metal glass part with its surface treated by the method
10/28/2009CN101567269A Coating and thermal decomposition process for preparing RuO* electrode material of super-capacitor
10/28/2009CN101565836A IrO2 seed embedded iridium coating titanium anode and preparation method thereof
10/28/2009CN101565833A Positive and negative alternate electrolysis-resistance metal oxide electrode
10/28/2009CN100554507C Method for assembling nano zinc oxide on magnesium-lithium alloy surface
10/22/2009WO2008148679A3 Method for creating a dry lubricant layer
10/21/2009CN101562216A Method for preparing textured ZnO membrane with pyramid-like structure
10/21/2009CN101560662A Method for performing neutral electronickelling following magnesium alloy chemical nickeling
10/21/2009CN101560654A Method for repairing defects of palladium and palladium alloy composite membranes
10/21/2009CN100552844C Silver-nanotin oxide electric contact material preparing process
10/21/2009CN100552085C Plating material, polyamic acid solution and polyimide resin solution which are used to form the plating material, and printed wiring board using them
10/20/2009US7604845 Filling the holes of the internal member with padding plugs each of which has a core member made from a metal material and a metal- resin composite layer covering surface of core; forming a ceramic coating film; extracting the padding plugs
10/20/2009US7604835 Resist pattern for metalization; catalyst on substrate exposed to vacuum ultraviolet radiation to break carbon to carbon double bonds; washed with surfactant to clean surface before metalization
10/20/2009US7604833 Circuit elements formed on a ceramic substrate surface and conductive balls are used as electronic part terminals; using rubber buffers having a concave part to house the balls to protect them when stress is applied tothe substrate to open surface division grooves to divide the substrate; chip resistor
10/15/2009WO2009125143A2 Method for forming a priming layer for depositing a metal on a substrate
10/15/2009WO2009090419A3 Method for deposition of ceramic films
10/15/2009WO2009068674A3 Protective layers deposited without current
10/15/2009WO2009010781A3 Coatings
10/15/2009US20090258238 Silicide formation utilizing ni-doped cobalt deposition source
10/14/2009CN101555594A Preparation method for forming controllable palladium alloy composite film
10/14/2009CN100551205C Electroformed metal structure and method for electroformed metal integrated circuit structrue
10/14/2009CN100549229C Method for forming thin silver mirror film, and method for forming coating film comprising thin silver mirror film
10/14/2009CN100549228C Electroless gold plating solution
10/14/2009CN100549227C Method for processing internal wall of hyperpure silicon alkyl gas cylinder
10/14/2009CN100548539C Method for manufacturing ultra-fine hard alloy composite powder
10/13/2009US7601278 Precursor solution, method of preparation thereof and use thereof
10/13/2009CA2315543C Electrostatically fiber planted steel sheet and production process therefor
10/08/2009WO2009122813A1 Thermoplastic polyurethane resin composition for plated dual molding, dual-molded article for plating, plated dual-molded article, and their production methods
10/08/2009WO2009122812A1 Thermoplastic polyurethane resin composition for plated dual molding, dual-molded article for plating, plated dual-molded article, and their production methods
10/08/2009US20090253573 Catalyst composition and deposition method
10/08/2009US20090253270 oxidation to deposit a metal oxide on semiconductor substrate surface by applying the chemical bath and applying the co-reactant bath; liquid phase depositing an oxide of hafnium, aluminium, titanium, zirconium, scandium, yttrium and lanthanium
10/08/2009US20090253262 Electroless plating system
10/08/2009US20090249976 Palladium complexes for printing circuits
10/08/2009DE112007003026T5 Verfahren zur Herstellung eines Glas-Formwerkzeugs A process for producing a glass-forming die
10/07/2009EP2106554A1 Second surface metallization
10/07/2009EP1520060B1 Metallisation
10/07/2009CN101553530A Resin composition for metal plating, molded article thereof, and metal-plated molded article
10/07/2009CN101552049A Structure of transparent conductive layer and preparation method thereof
10/07/2009CN101550546A A preparation method of surface metallized composite material through chemical plating under photocatalysis
10/07/2009CN100547120C Method for producing electroplating button of mobile phone
10/07/2009CN100547111C Chemical stannum-plating solution
10/06/2009US7598204 Metallic reagent
10/06/2009US7597763 Electroless plating systems and methods
10/01/2009WO2009120204A1 Platinum loaded substrate for a fuel cell and method for producing same
10/01/2009US20090242236 Method of forming conductive tracks
09/2009
09/30/2009EP2105444A1 Novel tin amino-alkoxide complexes and process for preparing thereof
09/30/2009EP2104752A2 Method for stabilizing and functionalizing porous metallic layers
09/30/2009EP2104655A1 Ceramic coating material
09/30/2009EP1538237B1 Method for metal plating and pre-treating agent
09/30/2009CN101548029A Method for production of metal-coated polyimide resin substrate having excellent thermal aging resistance property
09/30/2009CN101545105A Method for preparing high wear-resistant nickel-tin-phosphorus composite plating layer and plating bath
09/30/2009CN101545104A Nanometer chemical composite plating method
09/30/2009CN100545998C Substrate holding apparatus, substrate holding method, and substrate processing apparatus
09/30/2009CN100545306C Copper plating solution and method for copper plating
09/30/2009CN100545305C Activating process for nonmetal basal body chemical plating
09/24/2009WO2009117187A1 Process for preventing plating on a portion of a molded plastic part
09/24/2009WO2009115504A1 Optimized passivation on ti-/zr-basis for metal surfaces
09/24/2009WO2009115192A2 Ni-p layer system and process for its preparation
09/24/2009DE112006004139T5 Alkalische chemische Silber-Plattierlösung Alkaline chemical silver plating solution
09/23/2009EP2103712A1 Ni-P layer system and process for its preparation
09/23/2009EP2103661A1 Palladium Complexes For Printing Circuits
09/23/2009EP2102384A2 Sol-gel coating method and composition
09/23/2009EP2101931A2 Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films
1 ... 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 ... 163