Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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11/19/2009 | WO2009138223A2 Aluminum-containing substrate comprising a microporous layer of an aluminum phosphate zeolite, method for the production thereof, and use thereof |
11/19/2009 | WO2009118083A3 Composition for manufacturing sio2 resist layers and method of its use |
11/19/2009 | WO2009114217A8 Method of electrolytically dissolving nickel into electroless nickel plating solutions |
11/19/2009 | DE112004001309B4 Verfahren zur Herstellung eines Dünnschicht-Supraleiters mittels metallorganischer Abscheidung einer Vorläufer-Lösung von Pulver eines supraleitenden Oxids A method for producing a thin-film superconductor by metalorganic deposition of a precursor solution of a powder of an oxide superconductor |
11/18/2009 | CN101580933A Deposit fluid recycling utilization method |
11/18/2009 | CN101580657A Ink and method for manufacturing conductive wires by ink |
11/18/2009 | CN101579632A Nickel palladium/ silicon microchannel catalyst and application thereof on preparing electrode of integratable direct methanol fuel cell |
11/18/2009 | CN100560795C Method for producing hypereutectic Al-Si alloy modifier by chemical deposition |
11/18/2009 | CN100560794C Surface processing technology for Mg-alloy |
11/18/2009 | CN100560255C Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition |
11/17/2009 | USRE40983 Method to plate C4 to copper stud |
11/12/2009 | WO2009136861A1 Apparatus and method for depositing and curing flowable material |
11/12/2009 | WO2009136044A2 Mesostructured coatings comprising a specific texture agent for application in aeronautics and aerospace |
11/12/2009 | WO2009032567A3 Corrosion resistant aluminum alloy substrates and methods of producing the same |
11/12/2009 | WO2009019147A3 Deposition from ionic liquids |
11/12/2009 | DE102007018845B4 Verfahren zur Abscheidung einer metallhaltigen Substanz auf einem Substrat und Beschichtungsmaterial dafür A method of depositing a metal-containing substance on a substrate and coating material for |
11/11/2009 | EP1227173B9 Electroless plating method |
11/11/2009 | CN101578394A Plated material having metal thin film formed by electroless plating, and method for production thereof |
11/11/2009 | CN101578393A Plated material having metal thin film formed by electroless plating, and method for production thereof |
11/11/2009 | CN101578392A Plated article and method for producing the same |
11/11/2009 | CN101577148A Transparent conducting film and preparation method thereof |
11/11/2009 | CN101576118A Unleaded Cu-based sliding bearing material and preparation method thereof |
11/11/2009 | CN100558939C Low temperature preparation method for alcohol heat assistant ferro-electricity film |
11/10/2009 | US7616016 Probe card assembly and kit |
11/10/2009 | US7615277 Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
11/10/2009 | CA2345552C Novel sol-gel calcium phosphate ceramic coatings and method of making same |
11/05/2009 | WO2009134732A2 Open pore ceramic matrix foams coated with metal or metal alloys and methods of making same |
11/05/2009 | WO2009133751A1 Plated molded article and method for producing the same |
11/05/2009 | WO2009044144A3 Method of manufacture of an electrode for a fuel cell |
11/05/2009 | DE19639174C5 Verfahren für das außenstromlose Vernickeln Method for electroless nickel plating |
11/04/2009 | EP2113578A2 Metal body with metallic protective coating |
11/04/2009 | EP2113037A1 Conductive fibrous web and method for making the same |
11/04/2009 | CN100557080C Substrate with photocatalytic coating |
11/03/2009 | US7611569 Electroless copper compositions |
10/29/2009 | DE102008020037A1 Coating method comprises treating surface with activator, followed by electroless plating with nickel-phosphorus alloy, activator containing hydrochloric acid, nickel chloride, acetic acid, citric acid, lactic acid, succinic acid and water |
10/28/2009 | EP2112250A1 Stainless separator for fuel cell and method of manufacturing the same |
10/28/2009 | EP2111482A2 Medical devices with extended or multiple reservoirs |
10/28/2009 | CN101568669A Method of surface treatment for metal glass part, and metal glass part with its surface treated by the method |
10/28/2009 | CN101567269A Coating and thermal decomposition process for preparing RuO* electrode material of super-capacitor |
10/28/2009 | CN101565836A IrO2 seed embedded iridium coating titanium anode and preparation method thereof |
10/28/2009 | CN101565833A Positive and negative alternate electrolysis-resistance metal oxide electrode |
10/28/2009 | CN100554507C Method for assembling nano zinc oxide on magnesium-lithium alloy surface |
10/22/2009 | WO2008148679A3 Method for creating a dry lubricant layer |
10/21/2009 | CN101562216A Method for preparing textured ZnO membrane with pyramid-like structure |
10/21/2009 | CN101560662A Method for performing neutral electronickelling following magnesium alloy chemical nickeling |
10/21/2009 | CN101560654A Method for repairing defects of palladium and palladium alloy composite membranes |
10/21/2009 | CN100552844C Silver-nanotin oxide electric contact material preparing process |
10/21/2009 | CN100552085C Plating material, polyamic acid solution and polyimide resin solution which are used to form the plating material, and printed wiring board using them |
10/20/2009 | US7604845 Filling the holes of the internal member with padding plugs each of which has a core member made from a metal material and a metal- resin composite layer covering surface of core; forming a ceramic coating film; extracting the padding plugs |
10/20/2009 | US7604835 Resist pattern for metalization; catalyst on substrate exposed to vacuum ultraviolet radiation to break carbon to carbon double bonds; washed with surfactant to clean surface before metalization |
10/20/2009 | US7604833 Circuit elements formed on a ceramic substrate surface and conductive balls are used as electronic part terminals; using rubber buffers having a concave part to house the balls to protect them when stress is applied tothe substrate to open surface division grooves to divide the substrate; chip resistor |
10/15/2009 | WO2009125143A2 Method for forming a priming layer for depositing a metal on a substrate |
10/15/2009 | WO2009090419A3 Method for deposition of ceramic films |
10/15/2009 | WO2009068674A3 Protective layers deposited without current |
10/15/2009 | WO2009010781A3 Coatings |
10/15/2009 | US20090258238 Silicide formation utilizing ni-doped cobalt deposition source |
10/14/2009 | CN101555594A Preparation method for forming controllable palladium alloy composite film |
10/14/2009 | CN100551205C Electroformed metal structure and method for electroformed metal integrated circuit structrue |
10/14/2009 | CN100549229C Method for forming thin silver mirror film, and method for forming coating film comprising thin silver mirror film |
10/14/2009 | CN100549228C Electroless gold plating solution |
10/14/2009 | CN100549227C Method for processing internal wall of hyperpure silicon alkyl gas cylinder |
10/14/2009 | CN100548539C Method for manufacturing ultra-fine hard alloy composite powder |
10/13/2009 | US7601278 Precursor solution, method of preparation thereof and use thereof |
10/13/2009 | CA2315543C Electrostatically fiber planted steel sheet and production process therefor |
10/08/2009 | WO2009122813A1 Thermoplastic polyurethane resin composition for plated dual molding, dual-molded article for plating, plated dual-molded article, and their production methods |
10/08/2009 | WO2009122812A1 Thermoplastic polyurethane resin composition for plated dual molding, dual-molded article for plating, plated dual-molded article, and their production methods |
10/08/2009 | US20090253573 Catalyst composition and deposition method |
10/08/2009 | US20090253270 oxidation to deposit a metal oxide on semiconductor substrate surface by applying the chemical bath and applying the co-reactant bath; liquid phase depositing an oxide of hafnium, aluminium, titanium, zirconium, scandium, yttrium and lanthanium |
10/08/2009 | US20090253262 Electroless plating system |
10/08/2009 | US20090249976 Palladium complexes for printing circuits |
10/08/2009 | DE112007003026T5 Verfahren zur Herstellung eines Glas-Formwerkzeugs A process for producing a glass-forming die |
10/07/2009 | EP2106554A1 Second surface metallization |
10/07/2009 | EP1520060B1 Metallisation |
10/07/2009 | CN101553530A Resin composition for metal plating, molded article thereof, and metal-plated molded article |
10/07/2009 | CN101552049A Structure of transparent conductive layer and preparation method thereof |
10/07/2009 | CN101550546A A preparation method of surface metallized composite material through chemical plating under photocatalysis |
10/07/2009 | CN100547120C Method for producing electroplating button of mobile phone |
10/07/2009 | CN100547111C Chemical stannum-plating solution |
10/06/2009 | US7598204 Metallic reagent |
10/06/2009 | US7597763 Electroless plating systems and methods |
10/01/2009 | WO2009120204A1 Platinum loaded substrate for a fuel cell and method for producing same |
10/01/2009 | US20090242236 Method of forming conductive tracks |
09/30/2009 | EP2105444A1 Novel tin amino-alkoxide complexes and process for preparing thereof |
09/30/2009 | EP2104752A2 Method for stabilizing and functionalizing porous metallic layers |
09/30/2009 | EP2104655A1 Ceramic coating material |
09/30/2009 | EP1538237B1 Method for metal plating and pre-treating agent |
09/30/2009 | CN101548029A Method for production of metal-coated polyimide resin substrate having excellent thermal aging resistance property |
09/30/2009 | CN101545105A Method for preparing high wear-resistant nickel-tin-phosphorus composite plating layer and plating bath |
09/30/2009 | CN101545104A Nanometer chemical composite plating method |
09/30/2009 | CN100545998C Substrate holding apparatus, substrate holding method, and substrate processing apparatus |
09/30/2009 | CN100545306C Copper plating solution and method for copper plating |
09/30/2009 | CN100545305C Activating process for nonmetal basal body chemical plating |
09/24/2009 | WO2009117187A1 Process for preventing plating on a portion of a molded plastic part |
09/24/2009 | WO2009115504A1 Optimized passivation on ti-/zr-basis for metal surfaces |
09/24/2009 | WO2009115192A2 Ni-p layer system and process for its preparation |
09/24/2009 | DE112006004139T5 Alkalische chemische Silber-Plattierlösung Alkaline chemical silver plating solution |
09/23/2009 | EP2103712A1 Ni-P layer system and process for its preparation |
09/23/2009 | EP2103661A1 Palladium Complexes For Printing Circuits |
09/23/2009 | EP2102384A2 Sol-gel coating method and composition |
09/23/2009 | EP2101931A2 Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films |