| Patents for C22C 12 - Alloys based on antimony or bismuth (648) |
|---|
| 05/05/2004 | CN1494101A Alloy type temp fuse and wire for temp fuse element |
| 04/27/2004 | US6725517 Method for plugging a hole and a cooling element manufactured by said method |
| 04/08/2004 | US20040066268 Alloy type thermal fuse and wire member for a thermal fuse element |
| 04/01/2004 | WO2004027120A1 Dark layers |
| 03/25/2004 | DE10243139A1 Alloy for decorative or functional purposes e.g. as a coating material for buttons and sliding clasp fasteners and absorbing layers in solar cells contains tin, copper, bismuth and oxidic oxygen |
| 03/24/2004 | EP1399600A1 Compositions, methods and devices for high temperature lead-free solder |
| 03/09/2004 | US6703113 Pb-free solder composition and soldered article |
| 03/04/2004 | WO2004018719A1 Negative volume expansion lead-free electrical connection |
| 02/26/2004 | WO2004017435A1 Filled skutterudite-based alloy, production method thereof and thermoelectric conversion device fabricated using the alloy |
| 02/04/2004 | CN1472764A Alloy temperature fuse and wire material therefor |
| 01/14/2004 | EP1381066A2 Alloy type thermal fuse and wire member for a thermal fuse element |
| 01/02/2004 | EP1375689A1 Member having separation structure and method for manufacture thereof |
| 12/24/2003 | CN1463294A Unleaded solder |
| 12/02/2003 | US6656291 Sn-Bi solder powder; acid anhydride activating agent |
| 11/25/2003 | US6653548 To provide thermoelectromotive force; efficiency |
| 11/18/2003 | US6649833 Negative volume expansion lead-free electrical connection |
| 11/18/2003 | US6648210 Tombstoning susceptibility and reflow peak temperature reduction; printed circuit boards; mixing with a SnBi alloy powder, which is lower melting to produce a Cu, Ag, Sb, Sn, Bi alloy |
| 10/30/2003 | US20030201310 Packaging method using lead-free solder |
| 09/24/2003 | CN1444214A Information recording medium, medium mfg. method, information recording method and reproducing method |
| 09/18/2003 | US20030174610 Information recording media, manufacturing technique and information recording method |
| 09/17/2003 | CN1442870A Alloy type hot melt fuse and fuse component |
| 09/17/2003 | CN1442868A Alloy type hot melt fuse and fuse component |
| 09/11/2003 | US20030169144 Alloy type thermal fuse and fuse element thereof |
| 09/11/2003 | US20030169143 Alloy type thermal fuse and fuse element thereof |
| 09/11/2003 | US20030168333 Metal or metal alloy based sputter target and method for the production thereof |
| 09/10/2003 | EP1343188A2 Alloy type thermal fuse and fuse element thereof |
| 09/10/2003 | EP1343187A2 Alloy type thermal fuse and fuse element thereof |
| 07/31/2003 | WO2003061897A1 Lead-free solder material |
| 07/30/2003 | CN1116425C Production process for antimony selenium alloy |
| 07/01/2003 | US6585149 Packaging method using lead-free solder |
| 06/19/2003 | WO2003026828A3 Improved compositions, methods and devices for high temperature lead-free solder |
| 06/11/2003 | CN1422969A Co-Sb series skutterudite compound thermoelectric material preparation method |
| 05/22/2003 | US20030095731 Sliding member |
| 05/14/2003 | CN1417358A Prepn of Co-Sb alloy as thermoelectric material |
| 05/07/2003 | CN1415774A Padding for fixing system with state memory and applied technical procedure |
| 05/01/2003 | US20030082393 Graphite impregnated with molten metal |
| 04/10/2003 | US20030066476 High performance p-type thermoelectric materials and methods of preparation |
| 04/03/2003 | WO2003026834A1 Lead-free soft solder, especially electronics solder |
| 04/03/2003 | WO2003026828A2 Improved compositions, methods and devices for high temperature lead-free solder |
| 03/13/2003 | US20030048961 Sliding member |
| 02/20/2003 | US20030034381 Packaging method using lead-free solder |
| 01/30/2003 | US20030019216 Thermoelectric module, method for making thermoelectric module, thermoelectric device, and fiber floodlight device |
| 01/02/2003 | EP1268874A1 Metal or metal alloy based sputter target and method for the production thereof |
| 12/19/2002 | WO2002101105A1 Unleaded solder |
| 12/18/2002 | EP1266975A1 Lead-free solder |
| 12/05/2002 | WO2002097145A1 Compositions, methods and devices for high temperature lead-free solder |
| 11/12/2002 | US6479121 Optical recording medium and method of fabricating same |
| 10/23/2002 | CN1093016C Sealing material and emthod for low-pressure casting crucible |
| 10/15/2002 | USRE37875 Solid imaging process using component homogenization |
| 10/01/2002 | US6458319 High performance P-type thermoelectric materials and methods of preparation |
| 09/12/2002 | WO2002070762A1 Member having separation structure and method for manufacture thereof |
| 08/27/2002 | US6439315 Automatic sprinkler head |
| 08/01/2002 | US20020100499 For use in Peltier module; efficiency |
| 07/24/2002 | CN1360529A Method for plugging hole and cooling element manufactured by said method |
| 07/17/2002 | CN1359162A Quality factor omproved thermoelectric material, its making method and assembly using same |
| 07/03/2002 | EP1218137A1 Method for plugging a hole and a cooling element manufactured by said method |
| 06/19/2002 | EP1215736A2 Thermoelectric material and process for producing it |
| 06/13/2002 | US20020069907 To provide thermoelectromotive force; efficiency |
| 06/05/2002 | CN1352311A Production process for antimony-selenium alloy |
| 05/21/2002 | US6391417 Ag--in--sb--te based phase-change optical information recording medium with high overwriting repetition number, high recording density, excellent reproduction characteristics capable of attaining high speed recording and reproduction. |
| 03/07/2002 | DE10042013A1 Electromagnet used in actuators for operating gas exchange valves in I.C. engines comprises a magnetic coil arranged in a yoke and fixed using a casting composition made of a metal or metal alloy |
| 01/31/2002 | US20020012608 Pb-free solder composition and soldered article |
| 01/31/2002 | US20020011527 Automatic sprinkler head |
| 01/02/2002 | CN1328898A Non-Pb flux composition and welding product |
| 11/13/2001 | US6316279 Method of producing thermoelectric semiconductor |
| 10/30/2001 | US6309759 Lining overcoated with bismuth, or alloy thereof |
| 10/18/2001 | WO2001077403A1 Metal or metal alloy based sputter target and method for the production thereof |
| 10/11/2001 | DE10017414A1 Sputtertarget auf der Basis eines Metalls oder einer Metalllegierung und Verfahren zu dessen Herstellung Sputtering target on the basis of a metal or a metal alloy and process for its preparation |
| 08/14/2001 | US6273969 Alloys and methods for their preparation |
| 05/30/2001 | EP1103337A1 Tin-bismuth-based lead-free solder |
| 05/22/2001 | US6235981 P-type thermoelectric converting substance and method of manufacturing the same |
| 04/26/2001 | DE10032624A1 Gleitlager und sein Herstellungsverfahren Bearings and its production method |
| 02/07/2001 | EP1073539A1 Lead-free solder alloy powder paste use in pcb production |
| 01/23/2001 | US6177167 Rewritable phase-change optical information recording medium having a large recording capacity and capable of rewriting information recorded therein |
| 01/18/2001 | WO2001003873A1 Method for plugging a hole and a cooling element manufactured by said method |
| 08/30/2000 | CN1264631A Sealing material and method for low-pressure casting crucible |
| 08/24/2000 | WO2000048784A1 Lead-free solder alloy powder paste use in pcb production |
| 08/15/2000 | US6103967 Thermoelectric module and method of manufacturing the same |
| 07/05/2000 | EP1015213A1 Solid imaging process using component homogenization |
| 03/01/2000 | EP0982090A1 Method of preparation of highly dispersed metal alloys |
| 01/05/2000 | EP0969525A1 thermoelectric module |
| 11/09/1999 | US5980812 Solid imaging process using component homogenization |
| 10/06/1999 | EP0948061A2 P-type thermoelectric converting substance and method of manufacturing the same |
| 07/28/1999 | EP0932148A1 Recordable elements comprising a super-sensitive markable phase-change layer |
| 03/12/1999 | CA2215861A1 Thermoelectric alloy and method of manufacturing the same |
| 03/09/1999 | US5879244 Made by adding bismuth, bismuth alloy or mixture to the resin having higher coefficient of resilence than common golf balls and keeping its spin properties which can remarkably extend its carry |
| 11/05/1998 | WO1998048993A1 Solid imaging process using component homogenization |
| 06/03/1998 | EP0845324A1 Solder Compositions |
| 05/26/1998 | US5755896 Consisting of specified concentations of bismuth, tin,indiaum and minor propotions of other metals; electronics |
| 11/12/1996 | CA2094725C Lead-free firearm bullets and cartridges including same |
| 10/31/1996 | DE19538992A1 Wismut-Zinn-Lötmittel-Verbindungen mit verbesserten mechanischen Eigenschaften Bismuth-tin solder connections having improved mechanical properties |
| 08/01/1996 | DE19542043A1 Bleifreie Niedertemperaturlegierung und Verfahren zur Bildung einer mechanisch überlegenen Verbindung unter Verwendung dieser Legierung A lead-free low-temperature alloy and method of forming a mechanically superior compound using this alloy |
| 07/16/1996 | US5535678 One piece; bismuth alloy; nontoxic |
| 04/24/1996 | CN1031651C Process for refining bismuth |
| 02/14/1996 | EP0555310B1 Lead-free firearm bullets and cartridges including same |
| 12/21/1994 | EP0629467A1 Lead free, tin-bismuth solder alloys |
| 11/29/1994 | US5368814 Lead free, tin-bismuth solder alloys |
| 05/18/1994 | EP0397663B1 Electrodeposition of tin-bismuth alloys |
| 04/19/1994 | CA2060199C Non-toxic shot and shot shell containing same |
| 11/10/1993 | EP0478608B1 Non-toxic shot and shot shell containing same |