Patents for C22C 12 - Alloys based on antimony or bismuth (648)
12/2010
12/08/2010CN101909809A Bonding material, electronic component, and bonded structure
12/08/2010CN101267911B Lead-free low-temperature solder
12/08/2010CN101232967B Lead free solder paste used for electronic component, soldering method and the electronic component
12/01/2010CN101899601A Alloy for fusible plug and fusible plug
11/2010
11/25/2010US20100294550 Bonding material, electronic component and bonded structure
11/04/2010WO2010125800A1 Bonded structure and bonding method for bonded structure
11/03/2010CN101327518B Method for preparing CoSb3 thermoelectric compound nano powder
10/2010
10/27/2010CN101488558B M-Sb-Se phase changing thin-film material used for phase changing memory
10/21/2010WO2010119836A1 Lead-free solder alloy, solder ball, and electronic member comprising solder bump
10/20/2010EP2242121A1 Thermoelectric conversion material and thermoelectric conversion module
10/20/2010EP2240615A1 Method for producing a thermoelectric intermetallic compound
10/20/2010CN101488557B Si-Sb-Se phase changing thin-film material used for phase changing memory
10/13/2010CN101857929A Zinc antimony based porous p-type thermoelectric material and preparation method thereof
10/13/2010CN101857928A P-type Zn4Sb3 based thermoelectric material and preparation method thereof
09/2010
09/15/2010EP2228168A1 Bonding material, electronic component, and bonded structure
09/08/2010CN101392337B Low melting point lead-free solder alloy
09/02/2010WO2010098357A1 Metal filler, low-temperature-bonding lead-free solder and bonded structure
08/2010
08/04/2010EP2213617A1 Hydrogen gas generating member and hydrogen gas producing method therefor
08/04/2010CN1925038B Alloy membrane component capable of reinforcing near field light
08/03/2010US7767041 Ag-Bi-base alloy sputtering target, and method for producing the same
06/2010
06/24/2010US20100159328 Preparation method of znsb-c composite and anode materials for secondary batteries containing the same composite
06/24/2010US20100159257 Bonding material, bonded portion and circuit board
06/16/2010CN101157994B Oxygen fused bath smelting method for lead-antimony ore
06/10/2010US20100139730 Use of thermoelectric materials for low temperature thermoelectric purposes
06/09/2010CN101084324B Sb-Te alloy sintering product target and process for producing the same
05/2010
05/26/2010CN101255523B Hydrogen storage alloy, hydrogen storage film and hydrogen storage tank
05/19/2010EP2186917A1 Method for producing sintered body, sintered body, sputtering target composed of the sintered body, and sputtering target-backing plate assembly
05/06/2010US20100111754 Potassium and Sodium Filled Skutterudites
04/2010
04/28/2010EP2179815A1 Bonding composition
04/27/2010US7705233 Filled skutterudite-based alloy, production method thereof and thermoelectric conversion device fabricated using the alloy
04/21/2010CN101696475A Method for separating ternary alloy of lead, tin and stibium
04/14/2010CN101693962A Method for preparing p-type filling type skutterudite compound thermoelectric material
04/07/2010EP1840240B1 Sb-Te BASED ALLOY POWDER FOR SINTERING AND SINTERED SPUTTERING TARGET PREPARED BY SINTERING SAID POWDER, AND METHOD FOR PREPARING Sb-Te BASED ALLOY POWDER FOR SINTERING
04/01/2010US20100080726 Composition and methods of preparation of target material for producing radionuclides
03/2010
03/17/2010CN101675558A Anisotropic electroconductive material
03/17/2010CN100594089C Solder composition, connecting process and substrate producing process using soldering
03/16/2010CA2272193C Improved thermoelectric module and method of manufacturing the same
02/2010
02/18/2010US20100038233 Ag-bi-base alloy sputtering target, and method for producing the same
02/17/2010EP2154734A1 Thermoelectric conversion element, and method for production thereof
02/03/2010CN101638737A Indium-sn-bismuth-amalgam used for small tube diameter
01/2010
01/21/2010US20100015004 Lead-free low-temperature solder
12/2009
12/30/2009WO2009157130A1 Joint structure and electronic component
12/24/2009DE102008006900B3 Thermoelectric alloy, useful in thermoelectric generators, comprises antimony and cobalt, and further comprises titanium, vanadium, cobalt, and antimony as well as unavoidable impurities
12/23/2009CN100573948C Thermo-electric converting material and process for producing the same
12/15/2009US7632456 Comprising base material and at least one non-metallic light element selected from boron, carbon, nitrogen and oxygen; base material is antimony, tellurium, and germanium, silver, indium, or gallium; reduces the electric power needed for reset/set operation and thermal interference between memory cells
12/09/2009EP2131450A1 Anisotropic electroconductive material
12/03/2009WO2009143677A1 High melting point lead-free solder and production process thereof
12/02/2009CN101593598A Method for forming a coupled coil arrangement
11/2009
11/26/2009DE102004024114B4 Sputter-Target aus einer Legierung auf Ag-Bi-Basis und Verfahren zur Herstellung desselben Of the same sputtering target made of an alloy Ag-Bi-based and methods for preparing
10/2009
10/14/2009CN100549447C Sliding element
10/14/2009CN100549195C Filled skutterudite-base thermoelectrical composite material and its preparation
10/01/2009US20090242249 Bonding material, electronic component, bonding structure and electronic device
09/2009
09/30/2009CN101546810A Multilevel resistance conversion storage material containing germanium, antimony and selenium and application thereof
09/24/2009WO2009116213A1 Sintered target and method for production of sintered material
09/24/2009US20090235969 Ternary thermoelectric materials and methods of fabrication
09/22/2009US7591913 Thermoelectric properties by high temperature annealing
08/2009
08/26/2009EP2092579A2 Use of thermoelectric materials for low temperature thermoelectric purposes
08/11/2009US7572552 a positive electrode; a negative electrode containing an alloy having a CeNiSi2 type crystal structure; a nonaqueous electrolyte; excellent in both the charge-discharge cycle life
08/06/2009US20090196789 Solder alloy, solder ball and electronic member having solder bump
07/2009
07/30/2009WO2009093455A1 Thermoelectric conversion material and thermoelectric conversion module
07/22/2009CN100516265C Adulterated titanium-cobalt-stibium based thermoelectric composite material, and preparation method
07/09/2009WO2009084155A1 Bonding material, electronic component, and bonded structure
07/02/2009US20090166876 Semiconductor device and die bonding material
06/2009
06/25/2009WO2009077767A1 Method for producing a thermoelectric intermetallic compound
06/17/2009CN100500900C Alkali-metal atom filled cobalt stibide based skutterudite thermoelectric material and preparation method
05/2009
05/27/2009EP2061625A1 Modified solder alloys for electrical interconnects, mehtods of production and uses thereof
05/27/2009CN100491554C Method for preparing fine grain preferred tropism Bi2Te3 thermoelectric materials
05/21/2009US20090129971 Lead-free soft solder
05/20/2009CN101437900A Thermosetting resin composition, method for producing the same and circuit board
05/13/2009CN100487853C Leadless amalgam
05/06/2009EP1015213B1 Solid imaging process using component homogenization
05/06/2009CN101423907A Sn-Ge-As alloy as well as preparation method and use thereof
04/2009
04/29/2009CN101420835A Low melting point alloy thermal interface material
04/28/2009CA2377689C Method of plugging a hole and a cooling element manufactured by said method
04/23/2009US20090104071 1.0% Of magnesium, 44.25-60% bismith and the balance being tin and impurities; low melting point for bonding glass and ceramics; high bonding strength; lead-free and environmentally friendly; hermetic sealing; precision electronic parts; simplification processing; cost efficiency
04/08/2009CN100477309C Filled skutterudite-based alloy, production method thereof and thermoelectric conversion device fabricated using the alloy
04/08/2009CN100475996C Compositions, methods and devices for high temperature lead-free solder
04/01/2009CN101397612A Method for preparing skutterudite base thermoelectric block body material
03/2009
03/25/2009EP2039651A1 Hydrogen generating method, hydrogen generating alloy and method for manufacturing hydrogen generating alloy
03/25/2009CN101392337A Low melting point lead-free solder alloy
03/19/2009WO2009034775A1 Method for producing sintered body, sintered body, sputtering target composed of the sintered body, and sputtering target-backing plate assembly
03/18/2009EP2036656A1 Bonding material, electronic component, bonding structure and electronic device
03/05/2009WO2009028147A1 Bonding composition
03/05/2009WO2009028143A1 Hydrogen gas generating member and hydrogen gas producing method therefor
02/2009
02/18/2009CN101369625A Thermoelectric material, thermoelectric element, thermoelectric module and methods for manufacturing the same
02/18/2009CN101369624A Thermoelectric material, thermoelectric element, thermoelectric module and methods for manufacturing the same
01/2009
01/21/2009CN101348875A Tin, bismuth and copper type low temperature lead-free solder alloy
01/15/2009WO2009008127A1 Thermoelectric conversion module and heat exchanger employing the same, thermoelectric temperature control device and thermoelectric generator
12/2008
12/31/2008CN100448045C Thermoelectric material, thermoelectric element and thermoelectric module, and method for manufacturing same
12/24/2008CN101327518A Method for preparing CoSb3 thermoelectric compound nano powder
12/18/2008WO2008067815A3 Use of thermoelectric materials for low temperature thermoelectric purposes
12/17/2008CN101323020A Low-melting point core/case type tin-bismuth-copper alloy powder body and preparation thereof
12/17/2008CN100444418C Thermoelectric module and its flux
12/11/2008WO2008149910A1 Method for production of thermoelectric conversion element
12/11/2008WO2008149871A1 Thermoelectric conversion element, and method for production thereof
12/10/2008EP1999291A1 Alkali metal or earth alkali metal vaporising source
12/09/2008US7462217 Method of preparation for the high performance thermoelectric material indium-cobalt-antimony
12/03/2008CN100440559C Quality factor omproved thermoelectric material, its making method and assembly using same
10/2008
10/22/2008CN100428398C Improved Bi Inllg amalgam
10/15/2008CN100426563C Production of negative material of high-capacity lithium-ion battery with tin-antimony-silicon alloy
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