Patents for C22C 12 - Alloys based on antimony or bismuth (648)
10/2008
10/01/2008CN101275192A Composite nanometer ZnSb-based thermoelectric material and preparation thereof
10/01/2008CN100422366C Low-melting point alloy for machining connecting conduct, its production and use
09/2008
09/24/2008CN101273474A Thermo-electric converting material and process for producing the same
09/24/2008CN101271955A Bi-S binary system pyroelectric material and production method
09/18/2008WO2008111615A1 Anisotropic electroconductive material
09/17/2008CN101267911A Lead-free low-temperature solder
09/03/2008CN101257090A Si-Te-Sb series phase-change thin film material for phase-change memory
09/03/2008CN101255523A Hydrogen storage alloy, hydrogen storage film and hydrogen storage tank
07/2008
07/30/2008CN101232967A Lead free solder paste and application thereof
07/30/2008CN101230428A Method for preparing grain-refining preferred tropism Bi2Te3 thermoelectric materials
07/03/2008WO2008078653A1 Lead-free solder material and method of producing the same
07/02/2008EP1938357A2 Bismuth-indium amalgam, fluorescent lamps, and methods of manufacture
06/2008
06/26/2008WO2008033828A8 Modified solder alloys for electrical interconnects, methods of production and uses thereof
06/18/2008EP1375689B1 Member having separation structure and method for manufacture thereof
06/11/2008EP1930117A1 Lead-free low-temperature solder
06/05/2008US20080131309 Alloy of tin, Bismuth, and a remainder of Indium.; protective device for refrigeration equipment
06/04/2008EP1928035A1 Thermo-electric converting material and process for producing the same
05/2008
05/28/2008EP1924394A2 Solder alloy
05/28/2008CN100390919C Alloy type temp fuse and wire for temp fuse element
05/22/2008US20080118761 Modified solder alloys for electrical interconnects, methods of production and uses thereof
05/15/2008WO2008056676A1 Lead-free solder paste, electronic circuit board using lead-free solder paste, and method for manufacturing electronic circuit board
05/15/2008US20080110609 Melting temperature adjustable metal thermal interface materials and application thereof
05/07/2008CN100386458C Amorphous crystallization preparation method for nano crystal thermoelectric semiconductor material
05/02/2008WO2008012729A3 Low-pressure mercury vapor discharge lamp
04/2008
04/23/2008EP1914035A1 Lead free solder paste and application thereof
04/09/2008CN101157994A Oxygen fused bath smelting method for lead-antimony ore
04/03/2008WO2008008638A3 Potassium and sodium filled skutterudites
03/2008
03/20/2008WO2008033828A1 Modified solder alloys for electrical interconnects, methods of production and uses thereof
03/19/2008CN100375792C Bi-Te base thermoelectric material and process for preparing the same
03/06/2008WO2008026588A1 Thermosetting resin composition, method for producing the same and circuit board
02/2008
02/27/2008CN101132049A SiSb based phase-change thin-film material used for phase-change memory device
02/13/2008EP1885896A2 Improved p-type thermoelectric materials, a process for their manufacture and uses thereof
01/2008
01/10/2008WO2008004428A1 Hydrogen generating method, hydrogen generating alloy and method for manufacturing hydrogen generating alloy
12/2007
12/27/2007US20070297938 Sb-Te Alloy Sintered Compact Sputtering Target
12/18/2007US7309525 Inorganic nanocrystals with organic coating layer, their method of manufacture and materials constituted by said nanocrystals
12/12/2007CN100355099C Thermoelectric material and its preparing method
12/06/2007DE102006026005A1 Kaltgepresste Sputtertargets Cold pressed sputtering targets
12/05/2007CN101084324A Sb-te alloy sintering product target and process for producing the same
11/2007
11/29/2007WO2007136009A1 Bonding material, electronic component, bonding structure and electronic device
11/21/2007CN101074463A Filled antimony-based square cobalt mineral compound and its production
11/21/2007CN101074462A Filled antimony-based square cobalt mineral compound and its production
11/14/2007CN100349243C Alloy type temperature fuse and material for temperature fuse use
11/14/2007CN100348755C Method for synthesizing tin white cobalt series thermoelectric material
11/08/2007DE102006048513A1 Wärmeleitschicht und Verfahren zu deren Herstellung Heat conduction layer and processes for their preparation
11/07/2007CN101068947A Sb-Te base alloy sintered spattering target
10/2007
10/04/2007WO2007109815A1 Alkali metal or earth alkali metal vaporising source
10/04/2007US20070228109 bonding an electronic device to a substrate; forming high-strength joints by soldering; low temperature melting
10/04/2007US20070227627 Solder composition having dispersoid particles for increased creep resistance
10/03/2007EP1840240A1 Sb-Te BASED ALLOY POWDER FOR SINTERING AND SINTERED SPUTTERING TARGET PREPARED BY SINTERING SAID POWDER, AND METHOD FOR PREPARING Sb-Te BASED ALLOY POWDER FOR SINTERING
10/03/2007CN101046228A Sliding element
09/2007
09/12/2007CN101035918A Novel materials for the production of environmentally-friendly ammunition and other applications
09/05/2007EP1829985A1 Sb-Te ALLOY SINTERING PRODUCT TARGET AND PROCESS FOR PRODUCING THE SAME
09/04/2007CA2288153C Solid imaging process using component homogenization
08/2007
08/29/2007EP1826291A1 Sb-Te BASE ALLOY SINTERED SPATTERING TARGET
08/28/2007US7261760 Member having separation structure and method for manufacture thereof
08/22/2007EP1821015A1 Alloy for fusible plug and fusible plug
08/14/2007US7255922 Inorganic nanoparticle and method for producing the same
08/08/2007CN101014442A Solder composition, connecting process using soldering, and connection structure using soldering
08/02/2007WO2007086188A1 Triple-layer semiconductor nanoparticle and triple-layer semiconductor nanorod
07/2007
07/25/2007CN101005917A Solder composition, connection method and structure utilizing welding
07/19/2007WO2006128467A3 Improved p-type thermoelectric materials, a process for their manufacture and uses thereof
07/12/2007WO2007023288A3 Solder alloy
07/05/2007WO2007075763A1 Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
05/2007
05/29/2007US7224066 Bonding material and circuit device using the same
05/23/2007EP1787741A1 Sliding material and process for producing the same
05/23/2007EP1786592A2 Solder composition, connecting process with soldering, and connection structure with soldering
05/23/2007EP1786591A2 Solder composition, connecting process with soldering, and connection structure with soldering
05/23/2007CN1969354A Process for producing a heusler alloy, a half heusler alloy, a filled skutterudite based alloy and thermoelectric conversion system using them
05/09/2007CN1958820A Adulterated titanium-cobalt-stibium based thermoelectric composite material, and preparation method
05/03/2007US20070095383 Thermoelectric material, thermoelectric element, thermoelectric module and methods for manufacturing the same
04/2007
04/05/2007WO2007038419A2 Bismuth-indium amalgam, fluorescent lamps, and methods of manufacture
04/04/2007CN1940105A Low-melting point alloy for machining connecting conduct, its production and use
03/2007
03/29/2007WO2007034632A1 Thermo-electric converting material and process for producing the same
03/29/2007US20070071635 Bismuth-indium amalgam, fluorescent lamps, and methods of manufacture
03/07/2007CN1925038A Alloy membrane component capable of reinforcing near field light
03/01/2007WO2007023288A2 Solder alloy
02/2007
02/22/2007WO2007021006A1 Lead-free low-temperature solder
02/21/2007CN1916211A Filling in thermoelectric material of cobalt stibide based skutterudite by alkali-metal atom, and preparation method
02/21/2007CN1301560C Method of preparing Sn-Sb alloy material for negative electrode of lithium ion cell
02/15/2007WO2007018288A1 Lead free solder paste and application thereof
02/15/2007US20070034245 Process for producing thermoelectric semiconductor alloy, thermoelectric conversion module, thermoelectric power generating device, rare earth alloy, producing process thereof, thermoelectric conversion material, and thermoelectric conversion system using filled skutterudite based alloy
02/15/2007DE102005042292B3 Connector for precise, releasable connection of two components comprises hollow plug with flexible walls which is filled with bismuth or bismuth alloy which expands when it changes from liquid to solid state
02/07/2007CN1299371C Nonaqueous electrolyte secondary battery
01/2007
01/30/2007US7168608 System and method for hermetic seal formation
01/25/2007WO2006022416A3 Solder composition, connecting process with soldering, and connection structure with soldering
01/25/2007WO2006022415A3 Solder composition, connecting process with soldering, and connection structure with soldering
01/17/2007EP1399600B1 Compositions, methods and devices for high temperature lead-free solder
01/03/2007EP1738381A2 Process for producing a heusler alloy, a half heusler alloy , a filled skutterudite based alloy and thermoelectric converion system using them
01/03/2007CN1888105A Filled skutterudite-base thermoelectrical composite material and its prepn
12/2006
12/07/2006WO2006128467A2 Improved p-type thermoelectric materials, a process for their manufacture and uses thereof
12/07/2006US20060275663 Negative electrode active material and nonaqueous electrolyte secondary battery
12/06/2006EP1728880A1 Improved p-type thermoelectric materials, a process for their manufacture and uses thereof
11/2006
11/29/2006CN1287371C Optical information recording medium
11/15/2006CN1861821A Multiple filling skutterudite thermoelectric material and preparation process thereof
11/08/2006CN1284197C Alloy temperature fuse and wire material therefor
11/07/2006US7131566 Packaging method using lead-free solder
10/2006
10/31/2006US7128981 Sliding member
10/18/2006CN1280446C Ag-Bi-base alloy sputtering target, and method for producing the same
09/2006
09/27/2006EP1705259A1 Sliding member
09/27/2006EP1705258A2 Composition, methods and devices for high temperature lead-free solder
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