Patents for C22C 12 - Alloys based on antimony or bismuth (648)
09/2006
09/27/2006CN1839486A Thermoelectric material, thermoelectric element and thermoelectric module, and method for manufacturing same
09/21/2006US20060210790 Thermoelectric module and solder therefor
08/2006
08/22/2006US7096479 Optical information recording medium
08/09/2006CN1269165C Alloy type hot melt fuse and fuse component
08/03/2006WO2006080103A1 High-performance material and process for producing the same
07/2006
07/19/2006CN1805109A Leadless amalgam
07/19/2006CN1804078A Bi-Te base thermoelectric material and process for preparing the same
06/2006
06/29/2006WO2006067937A1 Sb-Te ALLOY SINTERING PRODUCT TARGET AND PROCESS FOR PRODUCING THE SAME
06/21/2006EP1429884B1 Improved compositions, methods and devices for high temperature lead-free solder
06/14/2006DE102004025560B4 Gleitteil Slide
06/14/2006CN1786221A Preparation method of high capacity tin antimony nickel alloy complex lithium ion battery cathode material
06/14/2006CN1259683C Alloy type hot melt fuse and fuse component
06/08/2006WO2006059429A1 Sb-Te BASE ALLOY SINTERED SPATTERING TARGET
06/08/2006US20060118156 Filled skutterudite-based alloy, production method thereof and thermoelectric conversion device fabricated using the alloy
05/2006
05/25/2006US20060110659 excellent in initial charge and discharge efficiency, discharge capacity per volume, and charge and discharge cycle characteristic
05/24/2006CN1776882A Improved Bi Inllg amalgam
05/09/2006US7042327 Alloy type thermal fuse and wire member for a thermal fuse element
05/09/2006US7041430 Preventing dissolution and diffusion of atoms in a protective layer from lowering reflectivity and times of overwriting of an optical disk by a protective layer having a tin content of 23.3-32.3% in contact with the recording layer
05/02/2006US7037559 Immersion plating and plated structures
04/2006
04/13/2006WO2005104156A3 Process for producing a heusler alloy, a half heusler alloy, a filled skutterudite based alloy and thermoelectric conversion system using them
03/2006
03/30/2006US20060067852 Low melting-point solders, articles made thereby, and processes of making same
03/29/2006CN1752241A Process for preparing nano/micron composite grain structure Lax-FeCo3Sb12 thermoelectric material
03/15/2006CN1747201A Production of negative material of high-capacity lithium-ion battery with tin-antimony-silicon alloy
02/2006
02/15/2006CN1734607A Optical recording medium
02/14/2006US6997612 Sliding member
01/2006
01/04/2006CN1235212C Information recording medium, medium mfg. method, information recording method and reproducing method
12/2005
12/01/2005US20050266246 Inorganic nanocrystals with organic coating layer, their method of manufacture and materials constituted by said nanocrystals
11/2005
11/30/2005EP1015213A4 Solid imaging process using component homogenization
11/17/2005US20050255319 Skutterudite compound that can be used for a thermoelectric conversion material
11/17/2005US20050252582 Methods of improving thermoelectric properties of alloys by subjecting them to one or more high temperature annealing steps, performed at temperatures at which the alloys exhibit a mixed solid/liquid phase, followed by cooling steps
11/09/2005CN1693503A 固态镓合金汞齐 Solid State gallium alloy amalgam
11/08/2005US6963264 Alloy composition of 30-70% Sn, 0.3-20% Sb and a balance of Bi; nontoxic; lowered electrical resistance; improved thinning; a high operation accuracy; heat resistance stability to a heat cycle satisfactorily assured
11/03/2005WO2005104156A2 Process for producing a heusler alloy, a half heusler alloy, a filled skutterudite based alloy and thermoelectric conversion system using them
10/2005
10/27/2005WO2005101536A1 Improving thermoelectric properties by high temperature annealing
10/20/2005WO2005098979A1 THERMOELECTRIC MATERIAL USING ZrNiSn-BASED HALF HEUSLER STRUCTURES
10/19/2005EP1586128A2 Cathode for an organic electronics component
10/19/2005CN1685533A Filled skutterudite-based alloy, production method thereof and thermoelectric conversion device fabricated using the alloy
10/06/2005US20050220661 Method of using an alloy type thermal fuse, and alloy type thermal fuse
10/05/2005EP1583125A1 Method of using an alloy type thermal fuse, and alloy type thermal fuse
10/05/2005CN1677596A Method of using an alloy type thermal fuse, and alloy type thermal fuse
09/2005
09/13/2005US6942728 High performance p-type thermoelectric materials and methods of preparation
08/2005
08/09/2005US6927421 Graphite impregnated with molten metal
07/2005
07/07/2005US20050147521 Cathode for an organic electronics component
06/2005
06/29/2005EP1548431A1 Inorganic nanocrystals with an organic coating and preparation process thereof
06/28/2005US6911892 Alloy type thermal fuse and fuse element thereof
06/01/2005CN1622354A Thermoelectric module and its flux
05/2005
05/11/2005EP1429889B1 Lead-free soft solder, especially electronics solder
05/11/2005CN1614054A Cobalt antimonide based thermoelectric composite material and its preparation
05/04/2005EP1399600A4 Compositions, methods and devices for high temperature lead-free solder
04/2005
04/21/2005US20050082337 Lead-free soft solder, especially electronics solder
04/13/2005EP1523048A2 Thermoelectric material and thermoelectric module using the thermoelectric material
03/2005
03/16/2005CN1594624A Amorphous crystallization preparation method for nano crystal thermoelectric semiconductor material
03/16/2005CN1594623A Preparation method for nano skutterudite compound pyro electric material
03/09/2005CN1592538A 电路装置 Circuit means
03/08/2005US6863441 Sliding member
03/03/2005WO2005020339A1 Thermoelectric material, thermoelectric element and thermoelectric module, and method for manufacturing same
03/03/2005US20050046032 Lead free solder containing bismuth and silver; cracking and short circuiting prevention
02/2005
02/10/2005US20050031483 Chromium alloy with tin, zinc, bismuth, and/or indium, and another metal component for regulating the bonding capability so that the solder can be used to bond various metallic materials and non-metallic materials
01/2005
01/27/2005WO2004066332A3 Cathode for an organic electronics component
01/26/2005CN1571210A Nonaqueous electrolyte secondary battery
01/26/2005CN1571044A Optical information recording medium
01/13/2005US20050007233 Alloy type thermal fuse and fuse element thereof
01/13/2005DE102004025560A1 Gleitteil Slide
01/05/2005DE102004024114A1 Sputter-Target aus einer Legierung auf Ag-Bi-Basis und Verfahren zur Herstellung desselben Of the same sputtering target made of an alloy Ag-Bi-based and methods for preparing
12/2004
12/29/2004CN1558960A Improved compositions, methods and devices for high temperature lead-free solder
12/29/2004CN1181948C Non-Pb flux composition and welding product
12/23/2004US20040258993 a positive electrode; a negative electrode containing an alloy having a CeNiSi2 type crystal structure; a nonaqueous electrolyte; excellent in both the charge-discharge cycle life
12/15/2004CN1554786A Method for synthesizing tin white cobalt series thermoelectric material
12/02/2004US20040241489 Sliding member
12/01/2004CN1550573A Ag-Bi-base alloy sputtering target, and method for producing the same
11/2004
11/18/2004US20040226818 Ag-Bi-base alloy sputtering target, and method for producing the same
11/16/2004US6819215 Alloy type thermal fuse and fuse element thereof
10/2004
10/20/2004EP1469538A2 Nonaqueous electrolyte secondary battery
10/20/2004EP1429884A4 Improved compositions, methods and devices for high temperature lead-free solder
09/2004
09/30/2004US20040194122 Optical information recording medium
09/29/2004EP1463046A2 Optical information recording medium
09/29/2004CN1168841C Padding for fixing system with state memory and applied technical procedure
09/23/2004US20040184947 alloy type thermal fuse of an operating temperature of 75 to 120 degrees C. in which a fuse element of a Bi In Sn alloy is used, which exhibits excellent heat cycle and aging resistances for a long term
09/08/2004CN1165400C Method for plugging hole and cooling element manufactured by said method
09/02/2004US20040170524 Unleaded solder
08/2004
08/18/2004CN1162561C Method for preparing Co-Sb series skutterudite compound thermoelectric material
08/10/2004US6774761 Alloy type thermal fuse and fuse element thereof
08/05/2004WO2004066332A2 Cathode for an organic electronics component
07/2004
07/21/2004CN1158396C Prepn process of Co-Sb alloy as thermoelectric material
06/2004
06/30/2004EP1433564A1 System and method for hermetic seal formation
06/24/2004US20040119247 System and method for hermetic seal formation
06/23/2004EP1429889A1 Lead-free soft solder, especially electronics solder
06/23/2004EP1429884A2 Improved compositions, methods and devices for high temperature lead-free solder
06/23/2004CN1507499A Compositions, methods and devices for high temperature lead-free solder
06/23/2004CN1506990A Alloy type temperature fuse and material for temperature fuse use
06/16/2004EP1429359A2 Alloy type thermal fuse and material for a thermal fuse element
06/10/2004US20040108597 Member having separation structure and method for manufacture thereof
06/01/2004US6743973 For use in peltier module; efficiency
05/2004
05/27/2004WO2004044260A1 Sputtering target and powder for production thereof
05/27/2004WO2002097145B1 Compositions, methods and devices for high temperature lead-free solder
05/20/2004US20040096632 Pb-free solder composition and soldered article
05/12/2004EP1218137B1 Method for plugging a hole and a cooling element manufactured by said method
05/12/2004EP1073539B1 Use of lead-free solder alloy powder paste in pcb production
05/06/2004US20040085178 Alloy type thermal fuse and wire member for a thermal fuse element
05/06/2004EP1416508A1 Alloy type thermal fuse and wire member for a thermal fuse element
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