Patents for C22C 12 - Alloys based on antimony or bismuth (648) |
---|
09/27/2006 | CN1839486A Thermoelectric material, thermoelectric element and thermoelectric module, and method for manufacturing same |
09/21/2006 | US20060210790 Thermoelectric module and solder therefor |
08/22/2006 | US7096479 Optical information recording medium |
08/09/2006 | CN1269165C Alloy type hot melt fuse and fuse component |
08/03/2006 | WO2006080103A1 High-performance material and process for producing the same |
07/19/2006 | CN1805109A Leadless amalgam |
07/19/2006 | CN1804078A Bi-Te base thermoelectric material and process for preparing the same |
06/29/2006 | WO2006067937A1 Sb-Te ALLOY SINTERING PRODUCT TARGET AND PROCESS FOR PRODUCING THE SAME |
06/21/2006 | EP1429884B1 Improved compositions, methods and devices for high temperature lead-free solder |
06/14/2006 | DE102004025560B4 Gleitteil Slide |
06/14/2006 | CN1786221A Preparation method of high capacity tin antimony nickel alloy complex lithium ion battery cathode material |
06/14/2006 | CN1259683C Alloy type hot melt fuse and fuse component |
06/08/2006 | WO2006059429A1 Sb-Te BASE ALLOY SINTERED SPATTERING TARGET |
06/08/2006 | US20060118156 Filled skutterudite-based alloy, production method thereof and thermoelectric conversion device fabricated using the alloy |
05/25/2006 | US20060110659 excellent in initial charge and discharge efficiency, discharge capacity per volume, and charge and discharge cycle characteristic |
05/24/2006 | CN1776882A Improved Bi Inllg amalgam |
05/09/2006 | US7042327 Alloy type thermal fuse and wire member for a thermal fuse element |
05/09/2006 | US7041430 Preventing dissolution and diffusion of atoms in a protective layer from lowering reflectivity and times of overwriting of an optical disk by a protective layer having a tin content of 23.3-32.3% in contact with the recording layer |
05/02/2006 | US7037559 Immersion plating and plated structures |
04/13/2006 | WO2005104156A3 Process for producing a heusler alloy, a half heusler alloy, a filled skutterudite based alloy and thermoelectric conversion system using them |
03/30/2006 | US20060067852 Low melting-point solders, articles made thereby, and processes of making same |
03/29/2006 | CN1752241A Process for preparing nano/micron composite grain structure Lax-FeCo3Sb12 thermoelectric material |
03/15/2006 | CN1747201A Production of negative material of high-capacity lithium-ion battery with tin-antimony-silicon alloy |
02/15/2006 | CN1734607A Optical recording medium |
02/14/2006 | US6997612 Sliding member |
01/04/2006 | CN1235212C Information recording medium, medium mfg. method, information recording method and reproducing method |
12/01/2005 | US20050266246 Inorganic nanocrystals with organic coating layer, their method of manufacture and materials constituted by said nanocrystals |
11/30/2005 | EP1015213A4 Solid imaging process using component homogenization |
11/17/2005 | US20050255319 Skutterudite compound that can be used for a thermoelectric conversion material |
11/17/2005 | US20050252582 Methods of improving thermoelectric properties of alloys by subjecting them to one or more high temperature annealing steps, performed at temperatures at which the alloys exhibit a mixed solid/liquid phase, followed by cooling steps |
11/09/2005 | CN1693503A 固态镓合金汞齐 Solid State gallium alloy amalgam |
11/08/2005 | US6963264 Alloy composition of 30-70% Sn, 0.3-20% Sb and a balance of Bi; nontoxic; lowered electrical resistance; improved thinning; a high operation accuracy; heat resistance stability to a heat cycle satisfactorily assured |
11/03/2005 | WO2005104156A2 Process for producing a heusler alloy, a half heusler alloy, a filled skutterudite based alloy and thermoelectric conversion system using them |
10/27/2005 | WO2005101536A1 Improving thermoelectric properties by high temperature annealing |
10/20/2005 | WO2005098979A1 THERMOELECTRIC MATERIAL USING ZrNiSn-BASED HALF HEUSLER STRUCTURES |
10/19/2005 | EP1586128A2 Cathode for an organic electronics component |
10/19/2005 | CN1685533A Filled skutterudite-based alloy, production method thereof and thermoelectric conversion device fabricated using the alloy |
10/06/2005 | US20050220661 Method of using an alloy type thermal fuse, and alloy type thermal fuse |
10/05/2005 | EP1583125A1 Method of using an alloy type thermal fuse, and alloy type thermal fuse |
10/05/2005 | CN1677596A Method of using an alloy type thermal fuse, and alloy type thermal fuse |
09/13/2005 | US6942728 High performance p-type thermoelectric materials and methods of preparation |
08/09/2005 | US6927421 Graphite impregnated with molten metal |
07/07/2005 | US20050147521 Cathode for an organic electronics component |
06/29/2005 | EP1548431A1 Inorganic nanocrystals with an organic coating and preparation process thereof |
06/28/2005 | US6911892 Alloy type thermal fuse and fuse element thereof |
06/01/2005 | CN1622354A Thermoelectric module and its flux |
05/11/2005 | EP1429889B1 Lead-free soft solder, especially electronics solder |
05/11/2005 | CN1614054A Cobalt antimonide based thermoelectric composite material and its preparation |
05/04/2005 | EP1399600A4 Compositions, methods and devices for high temperature lead-free solder |
04/21/2005 | US20050082337 Lead-free soft solder, especially electronics solder |
04/13/2005 | EP1523048A2 Thermoelectric material and thermoelectric module using the thermoelectric material |
03/16/2005 | CN1594624A Amorphous crystallization preparation method for nano crystal thermoelectric semiconductor material |
03/16/2005 | CN1594623A Preparation method for nano skutterudite compound pyro electric material |
03/09/2005 | CN1592538A 电路装置 Circuit means |
03/08/2005 | US6863441 Sliding member |
03/03/2005 | WO2005020339A1 Thermoelectric material, thermoelectric element and thermoelectric module, and method for manufacturing same |
03/03/2005 | US20050046032 Lead free solder containing bismuth and silver; cracking and short circuiting prevention |
02/10/2005 | US20050031483 Chromium alloy with tin, zinc, bismuth, and/or indium, and another metal component for regulating the bonding capability so that the solder can be used to bond various metallic materials and non-metallic materials |
01/27/2005 | WO2004066332A3 Cathode for an organic electronics component |
01/26/2005 | CN1571210A Nonaqueous electrolyte secondary battery |
01/26/2005 | CN1571044A Optical information recording medium |
01/13/2005 | US20050007233 Alloy type thermal fuse and fuse element thereof |
01/13/2005 | DE102004025560A1 Gleitteil Slide |
01/05/2005 | DE102004024114A1 Sputter-Target aus einer Legierung auf Ag-Bi-Basis und Verfahren zur Herstellung desselben Of the same sputtering target made of an alloy Ag-Bi-based and methods for preparing |
12/29/2004 | CN1558960A Improved compositions, methods and devices for high temperature lead-free solder |
12/29/2004 | CN1181948C Non-Pb flux composition and welding product |
12/23/2004 | US20040258993 a positive electrode; a negative electrode containing an alloy having a CeNiSi2 type crystal structure; a nonaqueous electrolyte; excellent in both the charge-discharge cycle life |
12/15/2004 | CN1554786A Method for synthesizing tin white cobalt series thermoelectric material |
12/02/2004 | US20040241489 Sliding member |
12/01/2004 | CN1550573A Ag-Bi-base alloy sputtering target, and method for producing the same |
11/18/2004 | US20040226818 Ag-Bi-base alloy sputtering target, and method for producing the same |
11/16/2004 | US6819215 Alloy type thermal fuse and fuse element thereof |
10/20/2004 | EP1469538A2 Nonaqueous electrolyte secondary battery |
10/20/2004 | EP1429884A4 Improved compositions, methods and devices for high temperature lead-free solder |
09/30/2004 | US20040194122 Optical information recording medium |
09/29/2004 | EP1463046A2 Optical information recording medium |
09/29/2004 | CN1168841C Padding for fixing system with state memory and applied technical procedure |
09/23/2004 | US20040184947 alloy type thermal fuse of an operating temperature of 75 to 120 degrees C. in which a fuse element of a Bi In Sn alloy is used, which exhibits excellent heat cycle and aging resistances for a long term |
09/08/2004 | CN1165400C Method for plugging hole and cooling element manufactured by said method |
09/02/2004 | US20040170524 Unleaded solder |
08/18/2004 | CN1162561C Method for preparing Co-Sb series skutterudite compound thermoelectric material |
08/10/2004 | US6774761 Alloy type thermal fuse and fuse element thereof |
08/05/2004 | WO2004066332A2 Cathode for an organic electronics component |
07/21/2004 | CN1158396C Prepn process of Co-Sb alloy as thermoelectric material |
06/30/2004 | EP1433564A1 System and method for hermetic seal formation |
06/24/2004 | US20040119247 System and method for hermetic seal formation |
06/23/2004 | EP1429889A1 Lead-free soft solder, especially electronics solder |
06/23/2004 | EP1429884A2 Improved compositions, methods and devices for high temperature lead-free solder |
06/23/2004 | CN1507499A Compositions, methods and devices for high temperature lead-free solder |
06/23/2004 | CN1506990A Alloy type temperature fuse and material for temperature fuse use |
06/16/2004 | EP1429359A2 Alloy type thermal fuse and material for a thermal fuse element |
06/10/2004 | US20040108597 Member having separation structure and method for manufacture thereof |
06/01/2004 | US6743973 For use in peltier module; efficiency |
05/27/2004 | WO2004044260A1 Sputtering target and powder for production thereof |
05/27/2004 | WO2002097145B1 Compositions, methods and devices for high temperature lead-free solder |
05/20/2004 | US20040096632 Pb-free solder composition and soldered article |
05/12/2004 | EP1218137B1 Method for plugging a hole and a cooling element manufactured by said method |
05/12/2004 | EP1073539B1 Use of lead-free solder alloy powder paste in pcb production |
05/06/2004 | US20040085178 Alloy type thermal fuse and wire member for a thermal fuse element |
05/06/2004 | EP1416508A1 Alloy type thermal fuse and wire member for a thermal fuse element |