Patents for C09J 4 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond (7,617) |
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07/05/2007 | WO2007076108A1 Adhesive compositions for bonding metals |
07/05/2007 | WO2007075909A1 Elastic methacrylate compositions |
07/05/2007 | WO2007073826A1 Thermally hardenable adhesive |
07/05/2007 | DE102005062442A1 Production of a thermally hardenable adhesive involves thermal solution polymerization of a mixture of ethylhexyl acrylate, hydroxyethyl acrylate, isobornyl acrylate, glycidyl methacrylate and hexyl acrylate |
07/05/2007 | CA2633738A1 Adhesive compositions for bonding metals |
07/05/2007 | CA2633719A1 Elastic methacrylate compositions |
07/04/2007 | EP1725626B1 Radiation-curable adhesive compositions |
07/03/2007 | US7238732 Radiation-curable adhesive compositions |
06/28/2007 | WO2007072466A1 Cyanoacrylate composite forming system |
06/28/2007 | DE102005062441A1 Polymers made by radical polymerisation of a mixture containing glycidyl methacrylate and H-acid monomers, used in structural adhesives which are precrosslinked with UV light and hardened by heating |
06/21/2007 | US20070142556 Adhesive compositions for bonding and filling large assemblies |
06/21/2007 | US20070142543 Elastic (meth)acrylic adhesive compositions |
06/21/2007 | US20070141267 Aqueous-based adhesive for bonding low surface energy substrates |
06/20/2007 | EP1461365B1 INITIATOR SYSTEMS COMPRISING beta-KETONE COMPOUNDS AND BONDING COMPOSITIONS MADE THEREWITH |
06/20/2007 | CN1322580C 胶粘带 Adhesive tape |
06/20/2007 | CN1322080C Radiation-curable resin composition for adhesives |
06/19/2007 | US7232857 Pressure-sensitive adhesive composition of a copolymer of a natural rubber based rubber and an acrylic monomer and styrene uniformly dispersed in a radiation setting compound, a second acrylic monomer |
06/13/2007 | EP1795544A2 High temperature, controlled strength anaerobic adhesive compositions curable under ambient environmental conditions |
06/06/2007 | CN1977016A Curable adhesive composition and its use in the optical field |
06/06/2007 | CN1320074C Methacrylate structural adhesive |
06/06/2007 | CN1319997C Pulsed electron beam polymerization |
05/31/2007 | US20070123661 Utilization of radiohardenable resins based on hydrogenated ketone and phenol aldehyde resins |
05/31/2007 | US20070123653 Polymerizable compositions in non-flowable forms |
05/31/2007 | US20070123609 Coating and prevention of sticking of marine life and method for preparation thereof |
05/30/2007 | CN1973009A 丙烯酸压敏粘合剂 Acrylic pressure-sensitive adhesive |
05/30/2007 | CN1970673A Material for connecting circuit |
05/30/2007 | CN1318530C Adhesive agent, method for connecting wiring terminals and wiring structure |
05/24/2007 | WO2007058316A1 Active energy radiation crosslinkable adhesive and method of rubber bonding |
05/24/2007 | US20070117885 Alkyl acrylate monomer, copolymer of alkyl acrylate and methacrylic acid, free radical catalyst, filler, and organic transition metal salt promoter; inexpensive, easy to dispense, good bonding strength |
05/23/2007 | EP1788060A1 Adhesive composition |
05/23/2007 | EP1086185B1 Adhesive formulations |
05/23/2007 | CN1969232A Inorganic powder-containing resin composition, transfer film and method for producing member for plasma display panel |
05/23/2007 | CN1317351C Improved adhesives for bonding composites |
05/23/2007 | CN1317350C B-stageable die attach adhesives |
05/23/2007 | CN1317349C Radiation-cured, laminated flexible packaging material, and radiation-curable, adhesive composition |
05/22/2007 | US7220337 Photopolymerization; aqueous disprersion; mixture containing photoinitiator |
05/22/2007 | CA2197213C Method of making a packaged hot melt adhesive |
05/18/2007 | WO2007054113A1 Adhesives, sealants and coatings containing glass particles as a filler |
05/16/2007 | CN1965044A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
05/15/2007 | US7217756 High performance water-based primer |
05/10/2007 | WO2007052520A1 Photocurable composition for pressure-sensitive adhesive, photocurable pressure-sensitive adhesive sheet, laminate and adhesive sheet |
05/10/2007 | US20070104973 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same |
05/09/2007 | EP1781748A1 Acrylic pressure sensitive adhesive having antistatic property |
05/09/2007 | EP1658343B1 Non-leaching adhesive system and its use in a liquid immersion objective |
05/09/2007 | EP1603983B1 Reversibly crosslinked resin compositions and methods |
05/03/2007 | WO2007049258A1 Thickened cyanoacrylate compositions |
05/03/2007 | US20070100006 Fluorinated polymers |
05/02/2007 | EP1780251A1 Adhesive composition for optical disk, cured product and article |
05/02/2007 | EP1539825A4 Transformable pressure sensitive adhesive tape and use thereof in display screens |
05/02/2007 | CN1957050A Acrylic pressure sensitive adhesive having antistatic property |
04/26/2007 | WO2007046190A1 Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices |
04/26/2007 | WO2007046189A1 Adhesive composition, circuit connecting material, connection structure of circuit connenctor, and semiconductor devices |
04/26/2007 | WO2006060129A3 Laminating adhesives based on primary hydroxyl-containing curatives |
04/26/2007 | WO2006053051A3 Low misting laminating adhesives |
04/26/2007 | WO2005099477A3 Water-resistant vegetable protein adhesive dispersion compositions |
04/26/2007 | US20070093600 Easy to Manufacture Meth (Acrylic) Adhesive Compositions |
04/26/2007 | US20070093575 Anaerobic adhesive compositions and water-blocking treatment of electrical wires with the same compositions |
04/26/2007 | US20070093571 Ultraviolet-curing resin composition, paint, ink, adhesive, sealing agent and primer |
04/25/2007 | EP1776433A1 Acrylic pressure sensitive adhesive |
04/25/2007 | EP0963420B1 Radiation-curable, cyanoacrylate-containing compositions |
04/25/2007 | CN1954411A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
04/25/2007 | CN1954000A Pressure-sensitive adhesive tape and method for production thereof |
04/25/2007 | CN1312247C Heat-resistant and impact-resistant acrylic/epoxy adhesive |
04/25/2007 | CN1312187C Liquid curable resin composition |
04/24/2007 | CA2317773C Non-whitening emulsion pressure sensitive adhesives |
04/19/2007 | WO2007044735A2 Amido-organoborate initiator systems |
04/19/2007 | WO2007044730A1 Amido-organoborate initiator systems |
04/19/2007 | US20070088096 Hardenable composition that includes polymerizable urea or thiourea compounds that function as reductants in redox polymerization reactions |
04/19/2007 | US20070087123 Mixture of acrylated esters; photoinitiators |
04/19/2007 | CA2625023A1 Amido-organoborate initiator systems |
04/19/2007 | CA2624322A1 Amido-organoborate initiator systems |
04/12/2007 | WO2006119469A3 Adhesive for metal bonding applications |
04/12/2007 | US20070079931 Amido-organoborate initiator systems |
04/11/2007 | EP1200533B1 Method of producing a laminated structure |
04/11/2007 | CN1946784A Thermally conductive two-part adhesive composition |
04/11/2007 | CN1944560A Glue for environment friendly pressure sensitive glue composite material and its preparing method |
04/11/2007 | CN1944014A Composite materials and methods of making the same |
03/29/2007 | DE20221617U1 Antimikrobieller Klebstoff und Beschichtsungsstoff Antimicrobial adhesive and Beschichtsungsstoff |
03/21/2007 | CN1934179A High performance water-based primer |
03/21/2007 | CN1931947A Adhesive composition for circuit connection |
03/21/2007 | CN1931904A Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components |
03/15/2007 | US20070060683 Curable adhesives; semiconductors |
03/14/2007 | EP1762604A1 Light and heat curable sealing and fixation material for natural stone and protection of building |
03/14/2007 | CN1304517C Adhesive composition, circuit connection material, joint stucture of circuit parts and semiconductor device |
03/13/2007 | US7189463 Polymerisation initiators, polymerisable compositions, and uses thereof for bonding low surface energy substrates |
03/08/2007 | DE10115505B4 Thermisch und mit aktinischer Strahlung härtbare wäßrige Dispersionen, Verfahren zu ihrer Herstellung und ihre Verwendung Thermally and with actinic radiation curable aqueous dispersions, process for their preparation and their use |
03/07/2007 | CN1926212A Polymerization initiator systems containing aluminum compounds as curing inhibitors and polymerizable compositions made therewith |
03/07/2007 | CN1926210A Silane compositions and methods for bonding rubber to metals |
03/06/2007 | US7186312 Adhesive which hardens in several stages |
03/06/2007 | US7185946 Automobile assembly |
03/01/2007 | WO2004098797A3 Vibrating screen |
02/28/2007 | CN1922194A Aqueous-based adhesive for bonding low surface energy substrates |
02/28/2007 | CN1302081C Radiation-curable, cyanoacrylate-containing compositions |
02/22/2007 | US20070043165 Method for production polychloroprene latex and composition |
02/22/2007 | US20070042115 Manufacturing method for tire cord and adhesive material for tire cord |
02/21/2007 | EP1754762A1 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
02/21/2007 | EP1753835A1 Curable adhesive composition and its use in the optical field |
02/20/2007 | CA2099332C Aqueous silane coupling agent solution for use as a sealant primer |
02/15/2007 | WO2007018287A1 Resin composition |
02/15/2007 | US20070035159 Automobile assembly |