Patents for C09J 4 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond (7,617)
01/2011
01/19/2011EP1565536B1 B-stageable die attach adhesives
01/19/2011CN101952334A Adhesive resin composition
01/18/2011US7871489 Applying an adhesive promoter to the inner surface of the exterior metal sheet of a sandwich of metal/foam/metal for insulating or decorative construction material; moving the outer layer on a rotating plate having an edge angled-off or rounded-off upward; environmentally friendly; aerosol-free
01/13/2011WO2011005443A2 Method of bonding a fluoropolymer using a silane containing bonding promoter
01/13/2011WO2011004818A1 Energy ray-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet for inspecting stampers
01/12/2011EP2272922A1 (Meth)acrylate-based compounds with improved adhesion to galvanised surfaces
01/12/2011CN101942277A Ultraviolet curing transfer adhesive
01/11/2011US7868056 coating with silane anchoring compounds; for textiles covered with silicone elastomers; electrical insulators, plastic films, thermal transfer ribbons, protective packaging films; siloxane with two polymerizable/crosslinkable epoxy or oxetane groups; cationic initiator
01/11/2011CA2539937C Adhesive compositions
01/11/2011CA2401395C Barrier coatings using polyacids
01/06/2011WO2011002876A2 Ultrafast heat/room temperature adhesive composition for bonding applications
01/06/2011WO2011001942A1 Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same
01/06/2011WO2011001836A1 Luminance improving film having adhesive layer, polarizing plate, and liquid crystal display device comprising the luminance improving film and the polarizing plate
01/05/2011EP2268693A1 Polymer to metal bonding and compounds and compositions useful therefor
01/05/2011CN101939391A Thermally and actinically curable adhesive composition
01/04/2011US7863374 Adhesive compostion of an anionic polymer from isocyanate-reactive groups, a polyisocyanate compound, and an alkoxysilane compound; a basic compound, water and a gelling agent
12/2010
12/30/2010US20100330364 Adhesive, method of connecting wiring terminals and wiring structure
12/30/2010US20100326596 Adhesive, method of connecting wiring terminals and wiring structure
12/29/2010CN1926210B Silane compositions and methods for bonding rubber to metals
12/29/2010CN101928548A Sealant, display device having the same and method of manufacturing the same
12/29/2010CN101928541A UV curable adhesive
12/29/2010CN101928525A High oil tolerant anaerobic adhesive and preparation method thereof
12/29/2010CN101465408B Substrate for flexible organic optoelectronic device and preparation method thereof
12/23/2010WO2010147888A2 Polymer foams
12/22/2010CN101925663A Adhesive composition, adhesive for circuit connection, connected structure, and semiconductor device
12/22/2010CN101450992B Polymer and preparation method thereof and conducting resin containing the same
12/21/2010CA2369443C Pressure sensitive cohesive
12/16/2010WO2010144774A2 Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds
12/16/2010DE102007006634B4 Verfahren zur PTFE-Oberflächenmodifizierung, Verfahren zum Verkleben einer Oberfläche aus PTFE sowie Bauteil mit einer Oberfläche aus PTFE A process for the PTFE surface modification method of bonding a surface component made of PTFE and having a surface made of PTFE
12/15/2010CN101914349A Liquid crystal sealing agent, method for manufacturing liquid crystal display panel using the liquid crystal sealing agent, and liquid crystal display panel
12/15/2010CN101914348A Sealing adhesive and preparation method thereof
12/14/2010CA2450647C Automobile assembly
12/09/2010WO2010090826A3 Fast curing, two part anaerobic adhesive composition
12/08/2010CN101910350A Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device
12/08/2010CN101910338A Textile semifinished product with at least one surface provided with an adhesive
12/08/2010CN101906274A Adhesive, method of connecting wiring terminals and wiring structure
12/08/2010CN101906273A Acryloid-type pressure-sensitive adhesive for transparent polyester film door sticker of high-temperature-resistant microwave oven
12/08/2010CN101906235A Radiation curing composition for light guide fiber
12/08/2010CN101501769B Ultraviolet hardening composition for optical disk interlayer, optical disk and process for producing optical disk
12/07/2010CA2604607C Adhesive composition
12/02/2010WO2009155589A3 Stable and sterile tissue adhesive composition with a controlled high viscosity
12/01/2010CN1685025B Hybrid plastisol/hot melt compositions
12/01/2010CN1569569B Blade protection device
12/01/2010CN101898981A Antistatic ionic compound, oligomer thereof, copolymer thereof and pressure-sensing agglutinant component thereof
11/2010
11/25/2010WO2010134521A1 Ultraviolet-curable adhesive agent composite, adhesive agent layer, adhesive sheet, and manufacturing method therefor
11/24/2010CN101896569A Adhesive composition
11/24/2010CN101896454A Activated methylene reagents and curable compositions prepared therefrom
11/24/2010CN101892016A Ultraviolet curing type color correction adhesive composition, color correction adhesive and color correction adhesive film
11/18/2010WO2010131575A1 Adhesive composition, adhesive sheet for connecting circuit member, and method for manufacturing semiconductor device
11/18/2010US20100291382 Silane compositions and methods for bonding rubber to metals
11/17/2010CN101885949A Fluorine-contained acrylic ester structural adhesive
11/17/2010CN101436644B Substrate for flexible organic optoelectronic device and preparation method thereof
11/17/2010CN101405360B UV B-stageable, moisture curable composition useful for rapid electronic device assembly
11/10/2010EP2248835A1 Curable composition
11/10/2010CN101884104A Photosensitive adhesive
11/10/2010CN101883741A Radiation curable cladding layer for polymer-clad optical fiber
11/04/2010WO2010126123A1 Curable resin composition, adhesive composition, and cured object or composite
11/04/2010WO2010125195A1 Cyanoacrylate compositions
11/04/2010US20100279121 Primer composition containing aldimine
11/03/2010EP2246400A1 Circuit connecting material
11/03/2010CN1965044B Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
11/03/2010CN1720766B Method for manufacturing flexible wiring circuit board
11/03/2010CN101875821A Photocurable adhesive
11/03/2010CN101875537A Sandwich safety glass capable of absorbing ultraviolet rays, near infrared rays and dazzling light and preparation method thereof
11/02/2010US7824754 and Isopropyltris(dioctylpyrophosphate)titanate coupler; acrylated bisphenol-glycerol epoxy resin; nonunsaturated is a bisphenol-epichlorohydrin resin; insulating adhesive; anisotropically electroconductive adhesive film; curable at low temperature; circuit boards
10/2010
10/28/2010WO2010123082A1 Adhesive composition curable by high energy beam for use with hydrophilic plastic
10/28/2010WO2010122943A1 Heat-expansive and repeelable acrylic pressure-sensitive adhesive tape or sheet
10/28/2010WO2010122942A1 Heat-expansive and repeelable acrylic pressure-sensitive adhesive tape or sheet
10/28/2010WO2010122768A1 Thiol group-containing adhesive resin composition
10/27/2010EP1976831B1 Compositions based on alkylimidazolidone (meth)acrylates
10/27/2010CN101870650A Preparation and application of binder monomer capable of realizing photopolymerization
10/21/2010US20100265685 Wiring-connecting material and wiring-connected board production process using the same
10/20/2010CN101864248A Ultraviolet curing adhesive composition
10/19/2010US7816453 solutions of thermoplastic or partially thermoplastic polymers or elastomers in acrylate or methacrylate monomers that polymerize when mixed with a catalyst; better control of exothermic curing and dimensional changes; can be used to bond and fill large areas and gaps; reduced tendency to gas or boil
10/14/2010WO2010118123A2 Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts
10/14/2010WO2010080795A3 Hydrogen peroxide complexes and their use in the cure system of anaerobic adhesives
10/13/2010EP1249221B1 Dental adhesive composition
10/13/2010CN101861369A Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for an electronic part
10/13/2010CN101857776A UV-curable adhesive composition for compact discs
10/07/2010WO2010113759A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same
10/07/2010WO2009155594A3 Method of preparing adhesive compositions for medical use: single additive as both the thickening agent and the accelerator
10/07/2010US20100255300 Pressure-sensitive adhesive tape and method for production thereof
10/07/2010CA2757973A1 Controlled exotherm of cyanoacrylate formulations
10/06/2010CN1934179B High performance water-based primer
10/06/2010CN1835992B Method for joining substrates and objects
10/06/2010CN101855310A Composition for forming contact-bonding coating film of actinic-energy-ray curable type and strippable adhesive-coated paper employing the same
09/2010
09/30/2010US20100249698 Controlled exotherm of cyanoacrylate formulations
09/30/2010US20100242798 Laminating Adhesive
09/29/2010EP2233544A1 Polymerizable composition
09/29/2010CN1898082B Accelerated organoborane amine complex initiated polymerizable compositions
09/29/2010CN101844993A Photo-curing monomer with ortho-phenolic hydroxyl structure, preparation method and bond thereof
09/29/2010CN101052693B Two pack type acrylic adhesive for casting model preparation and adhesive technique using the same adhesive
09/28/2010USRE41784 Adhesive material
09/23/2010WO2010008822A3 Cyanoacrylate tissue adhesives with desirable permeability and tensile strength
09/23/2010DE102009012272A1 Dual cure adhesive, useful e.g. for bonding components in opto-electronic industry, comprises a monomeric, UV-curable adhesive component, a photoinitiator, a free isocyanate- or free silane-group containing component, and an amine
09/22/2010EP2230280A1 Polymerizable composition
09/22/2010EP2229421A1 Textile semifinished product with at least one surface provided with an adhesive
09/22/2010CN101838505A Colored light-curing adhesive for adhering and sealing filled-words of metal keys and preparation method thereof
09/22/2010CN101838377A Radiation curable multifunctional (methyl) acrylate composition
09/22/2010CN101838376A Derived and branched multifunctional (methyl) acrylic ester composition containing citric acid
1 ... 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 ... 77