Patents for C09J 4 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond (7,617)
12/2005
12/15/2005US20050277733 Copolymerizing a denatured vegetable protein, such as soy flour, that has been functionalized with methylol groups with comonomers such as phenol, phenol formaldehyde, urea, urea formaldehyde, melamine, melamine formaldehyde, melamine urea formaldehyde, adding acid
12/15/2005US20050276916 Hybrid adhesives, articles, and methods
12/15/2005DE102004024696A1 Binding agent composition, useful in the production of metal silicon elastomer groups, comprises a metallic compound, a hydroxylation catalyst and an organic solvent
12/14/2005EP1603984A1 Contact adhesive
12/08/2005DE10354394B4 Bindemittel zur Herstellung und Verklebung von Holzwerkstoffen und/oder Faserstoffen und Verwendung desselben The same binder for the production and bonding of wood materials and / or fibrous materials and use
12/01/2005WO2005000911A3 Internally coordinated organoboranes
11/2005
11/30/2005EP1599559A1 Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components
11/30/2005CN1229449C Malic acid diester surfactant
11/29/2005US6969738 Decrease surface tension to enhance substrate wetting in waterborne coatings, inks, adhesives, fountain solutions and agricultural formulations
11/29/2005US6969733 Photoinitiators
11/24/2005WO2005112091A1 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
11/24/2005WO2005111101A1 Pressure-sensitive adhesive tape and method for production thereof
11/24/2005CA2562560A1 Pressure-sensitive adhesive tape and method for production thereof
11/23/2005EP1598864A2 Hardenable pressure-senstitive adhesive sheet for semiconductors and process for producing a semiconductor device
11/16/2005CN1696234A Adhesive compsn.circuit connection material,joint stucture of circuit parts and semiconductor device
11/16/2005CN1227317C Active energy ray-curing adhesive composition and keypad for push-button switch
11/15/2005US6964999 Polymer and curable composition
11/10/2005WO2005105942A1 Curable adhesive composition and its use in the optical field
11/10/2005US20050250870 Curable adhesive composition and its use in the optical field
11/10/2005US20050246991 One-part adhesive composition for adhering polymeric roofing membranes to roof deck substrates
11/09/2005EP1311577B1 Aqueous dispersion and the use thereof in the production of coating agents, adhesives and sealing agents that can cured by heat or by actinic radiation
11/09/2005EP0903386B1 Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith
11/03/2005WO2005103178A1 Anaerobic pressure sensitive adhesive
11/03/2005US20050245635 Photocurable composition for liquid-crystal panel sealing and liquid-crystal panel
11/03/2005US20050244752 Radiation-curable resin composition for adhesives
11/02/2005EP1367960B1 Bone cement
11/02/2005EP1280866B1 Activator compositions for cyanoacrylate adhesives
11/02/2005CN1692151A Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates
11/02/2005CN1692149A Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices
10/2005
10/27/2005WO2005099477A2 Water-resistant vegetable protein adhesive dispersion compositions
10/26/2005CN1688623A Liquid curable resin composition
10/25/2005US6958368 sulfinimides and oxygen and sulfur derivatives thereof, sulfonimides and oxygen and sulfur derivatives thereof, sulfonamides and oxygen and sulfur derivatives thereof, and the oxygen and sulfur analogues of sulfimides; for adhesives or sealants.
10/19/2005EP1586593A1 Coating film for car bodies
10/19/2005CN1685010A Fluorinated polymers
10/19/2005CN1223612C Water soluble emulsion composite and adhesive composite
10/13/2005WO2005094399A2 High performance water-based primer
10/13/2005WO2005019365A3 Non-leaching adhesive system and its use in a liquid immersion objective
10/13/2005US20050227065 Thermal-reaction type flame-retardant pressure-sensitive adhesive tape and process for producing the same
10/13/2005DE102004015013A1 Method for manipulating magnets comprises using layers of adhesive to fix them to other magnets or holder, spacer particles being positioned between magnets to maintain correct gap
10/12/2005EP1206291B1 Sterilized cyanoacrylate solutions containing thickeners
10/12/2005EP1034230B1 Cyanacrylate adhesive with ester and polymer additives
10/11/2005US6953121 Vibrating screen
10/06/2005WO2005092350A1 Preparation of polymerizable compositions
10/06/2005US20050222330 Adding an aromatic bismaleimide resin powder that does not dissolve in liquid curable resins; cyanate ester resin, polyisobornyl or lauryl (meth)acrylate and/or (meth)acrylated polybutadiene; flexibility, heat resistance; semiconductor packages
10/06/2005US20050222293 Curable resin composition, method for manufacture of laminate using the composition, transfer material, method for manufacture thereof and transferred product
10/06/2005US20050218517 Semiconductor flip-chip package and method for the fabrication thereof
10/05/2005EP1582574A1 Method to improve high temperature cohesive strength with adhesive having multi-phase system
10/05/2005EP1334142B1 Method for producing acrylate adhesive materials
10/05/2005CN1678639A Transformable pressure sensitive adhesive tape and use thereof in display screens
10/05/2005CN1676564A Method to improve high temperature cohesive strength with adhesive having multi-phase system
09/2005
09/29/2005US20050215655 Anaerobic pressure sensitive adhesive
09/28/2005EP1580200A1 2-cyanoacrylate based composition, method and agent for evaluating curing thereof
09/28/2005EP1578881A1 Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates
09/28/2005EP1578823A1 Curable pressure sensitive adhesive compositions
09/28/2005EP1578820A1 Laminating adhesive
09/27/2005US6949603 for production of adhesives; improved heat resistance
09/27/2005US6949602 Room temperature vulcanization, quick setting glues, bonding two surfaces with a curable blends comprising acrylic-based monomer, epoxy based monomer or epoxy resin, and a chemically reactive bifunctional monomer
09/27/2005US6949297 Hybrid adhesives, articles, and methods
09/22/2005WO2005087886A1 Radiation-curable composition
09/22/2005WO2005087850A1 Thermally conductive two-part adhesive composition
09/22/2005WO2005087822A1 Liquid composition containing no solvent
09/22/2005US20050209369 High performance water-based primer
09/22/2005US20050209360 a free-radically radiation-curable, solvent-free and printable precursor of an adhesivecomprising (i) 15-60 wt. % of one or more mono(meth)acrylate functional oligomer compounds at least one of said oligomer compounds comprising at least one urethane bond, (ii) and methacrylate
09/22/2005US20050208296 Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device
09/21/2005CN1670103A Acrylate adhesive and preparation method thereof
09/15/2005WO2005085376A1 Polymerization initiator systems containing aluminum compounds as curing inhibitors and polymerizable compositions made therewith
09/15/2005US20050202238 Transparent double-sided pressure-sensitive adhesive tape or sheet and touch panel
09/15/2005US20050202196 Curable pressure sensitive adhesive composition, optical disk producing sheet, and optical disk
09/15/2005CA2557319A1 Polymerization initiator systems containing aluminum compounds as curing inhibitors and polymerizable compositions made therewith
09/14/2005EP1574557A1 Transparent double-sided pressure-sensitive adhesive tape or sheet and touch panel
09/14/2005EP1574556A2 Curable pressure sensitive adhesive composition, optical disk producing sheet, and optical disk
09/14/2005EP1572814A1 Uv-curable epoxy acrylates
09/14/2005CN1667069A Adhesive composition, optical disk producing sheet, and optical disk
09/14/2005CN1667068A Transparent double-sided pressure-sensitive adhesive tape or sheet and touch panel
09/09/2005WO2005082912A1 Aqueous-based adhesive for bonding low surface energy substrates
09/08/2005US20050196376 Simultaneously thickening and sterilizing medically useful cyanoacrylate oxygen free solution using precise ultraviolet radiation dose; simple, low cost, maintaining performance
09/08/2005DE10135529B4 Klebstoff, seine Verwendung und Verfahren zum Verkleben von zwei Gegenständen Glue, its use and process for bonding two articles
09/07/2005CN1666141A Photocurable composition for liquid-crystal panel sealing and liquid-crystal panel
09/06/2005US6939932 Initiator systems, polymerisable compositions, and uses thereof for bonding low surface energy substrates
09/06/2005US6939913 Radically polymerizable phosphoric ester of ethyl methacrylic compounds, silicone partides, a curing agent capable of generating a free radical upon heating; improve adhesive bonding strength to electronics, electrodes
09/06/2005US6939911 Pressure-sensitive adhesive composition and pressure-sensitive adhesive product
09/06/2005US6939901 Monomer containing phosphate, pyrophosphate, thiophosphate, or sulfonate groups, an acrylic or thioacrylic monomer, a hydrophilic monomer such as hydroxyalkyl acrylates and acrylated polyethylene glycol; dental, medical uses
09/01/2005WO2005080518A1 Radiation-curable adhesive compositions
09/01/2005WO2005080451A1 Improviong the lipophilic properties of 2-acrylamido-2-methylpropanesulfonic acid
09/01/2005US20050191507 An optical film coated with an acrylate copolymer; a mono-acrylate oligomer; a multi-acrylate oligomer; and a photoinitiator that when cured forms a semi-interpenetrating polymer network having an average molecular weight between crosslinks (Mc) greater than 3000; peel strength greater than 40 N/dm
08/2005
08/31/2005CN1662622A Radiation-curable, solvent-free and printable precursor of an adhesive
08/31/2005CN1662621A Radiation-curable, solvent-free and printable precursor of an adhesive
08/31/2005CN1216955C Low odor polymerizable composition useful for bonding low surface energy substrates
08/25/2005US20050187311 coating resins comprising aromatic cyanates and addition polymers on circuit substrates, then curing with light and heat to form insulation layer with improved surface smoothness and excellent dielectric properties
08/24/2005EP1566422A1 Uv-cure adhesive composition for optical disk, cured material and goods
08/23/2005CA2184382C Retroreflective license plate and method for making same
08/18/2005WO2005075585A1 Utilization of radiohardenable resins based on hydrogenated ketone and phenol aldehyde resins
08/18/2005US20050182150 Radiation-curable adhesive compositions
08/18/2005US20050178502 Adhesive, method of connecting wiring terminals and wiring structure
08/18/2005CA2555357A1 Use of radiation-curable resins based on hydrogenated ketone-aldehyde and phenolaldehyde resins
08/17/2005CN1655905A Alignment tool, assembly tool and method for a poly-plane workpiece
08/11/2005US20050176882 wires connected using a mixture of curing agents capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, having high bonding strength and connection reliability
08/11/2005US20050176842 For assembling a first substrate to a second substrate by using precursor or pressure-sensitive adhesive
08/11/2005US20050175395 Applicators, dispensers and methods for dispensing and applying adhesive material
08/11/2005DE102004005208A1 Verwendung strahlenhärtbarer Harze auf Basis hydrierter Keton- und Phenol-Aldehydharze Use of radiation resins based on hydrogenated ketone and phenol-aldehyde
1 ... 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 ... 77