Patents for C09J 4 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond (7,617) |
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05/11/2011 | EP2319439A1 Materials and apparatus for treating bone |
05/11/2011 | CN102057001A Adhesive composition for slightly adhesive base, adhesive using the same and optical disk device |
05/11/2011 | CN102051131A Optical adhesive composition, optical adhesive and optical film |
05/05/2011 | WO2011053406A1 Pressure-sensitive hot melt adhesive compositions |
05/05/2011 | WO2011052119A1 Ultraviolet curable resin composition, cured product and optical disc |
05/05/2011 | WO2011002876A3 Ultrafast heat/room temperature adhesive composition for bonding applications |
05/05/2011 | DE102005007920B4 Flexible Klebstoffzusammensetzung und deren Verwendung Flexible adhesive composition and the use thereof |
05/04/2011 | CN102040929A Adhesive composition, adhesive and optical film |
05/04/2011 | CN102040916A Silver conductive adhesive as well as preparation method and application thereof |
05/04/2011 | CN102040915A Color transparent adhesive |
05/04/2011 | CN101163766B Adhesive composition |
05/04/2011 | CN101155889B Acrylate/methacrylate adhesives initiated by chlorosulfonated polymer |
05/03/2011 | US7935213 Non-leaching adhesive system and its use in a liquid immersion objective |
04/28/2011 | WO2011049138A1 (meth)acrylic resin composition |
04/28/2011 | WO2011049011A1 Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor devices using same |
04/27/2011 | CN102037035A Curable composition containing a reactive (meth)acrylate polymer and a cured product thereof |
04/27/2011 | CN102031072A Pressure-sensitive adhesive sheet for retaining elements and method of producing elements |
04/27/2011 | CN102031069A Method for pelleting accelerating agent DM and binding agent adopted therein |
04/27/2011 | CN102031068A Binder for granulating accelerator TBBS (N-tert-butylbenzothiazole-2-sulphenamide) and method for granulating accelerator TBBS |
04/27/2011 | CN102031067A Granulation binder for accelerator NOBS (N-(Oxidiethylene)-2-Benzothiazolyl Sulfenamide) and NOBS granulation method |
04/27/2011 | CN102031066A Accelerant TBSI granulation binder and TBSI granulation method |
04/27/2011 | CN101205451B Ultraviolet-anaerobic dual curing adhesive |
04/21/2011 | WO2011047131A2 Primer compositions to toughen adhesive bonds |
04/21/2011 | WO2011046120A1 Resin composition and adhesive agent |
04/21/2011 | WO2011005443A3 Method of bonding a fluoropolymer using a silane containing bonding promoter |
04/21/2011 | WO2010147888A3 Polymer foams |
04/20/2011 | EP2311921A1 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
04/20/2011 | CN102027086A Pressure-sensitive adhesive sheet, method of processing adherend with the pressure-sensitive adhesive sheet, and apparatus for stripping pressure-sensitive adhesive sheet |
04/20/2011 | CN102026795A Bendable polycarbonate resin laminate, optically transparent electromagnetic wave shield laminate, and manufacturing method thereof |
04/20/2011 | CN102020939A Hot melting non-weaving cloth glue |
04/20/2011 | CN102020938A Loose non-woven fabric rubber |
04/20/2011 | CN102020937A Carboxyl latex adhesive for nonwoven fabric |
04/20/2011 | CN102020936A Industrial filter cloth binder |
04/20/2011 | CN102020935A Adhesive for nonwoven fabric |
04/20/2011 | CN102020934A Nonwoven fabric adhesive |
04/20/2011 | CN102020933A Polyester wadding adhesive |
04/20/2011 | CN101138075B Adhesive tape for wafer dicing and chip manufacturing method using same |
04/14/2011 | WO2011042554A1 Increase in the toughness of a material achieved by means of a curable composition including at least one vinyl ester monomer |
04/14/2011 | US20110086957 Additive and vehicle for inks, paints, coatings and adhesives |
04/13/2011 | EP2307515A2 Controlled exotherm of cyanoacrylate formulations |
04/13/2011 | CN102017816A Circuit connecting material, film-like adhesive, adhesive reel, and circuit connecting structural body |
04/13/2011 | CN102012535A Polarizing plate and photocurable adhesive for forming polarizing plate |
04/13/2011 | CN102010676A Adhesive sheet for plating |
04/13/2011 | CN102010673A High-performance modified acrylate adhesive used in FPC (Flexible Printed Circuit) filed |
04/13/2011 | CN102010672A UV (Ultraviolet)-cured pressure-sensitive adhesive for LCD (Liquid Crystal Display) polarizer and preparation method thereof |
04/12/2011 | CA2484737C Method for the fabrication of cyanoacrylate adhesives wherein excess stabilizer is removed |
04/07/2011 | WO2011040490A1 Polymerizable composition, adhesive, molecule-blocking film, and protective sheet for solar cell module |
04/07/2011 | WO2011040438A1 Adhesive composition |
04/07/2011 | WO2011040407A1 Curable resin composition |
04/06/2011 | EP2305451A1 Bendable polycarbonate resin laminate, optically transparent electromagnetic wave shield laminate, and manufacturing method thereof |
04/06/2011 | EP2303976A1 Stabilization of (meth)acrylate-based compositions by way of specific tertiary amines |
04/06/2011 | EP2303343A2 Method of preparing adhesive compositions for medical use: single additive as both the thickening agent and the accelerator |
04/06/2011 | EP2303342A2 Stable and sterile tissue adhesive composition with a controlled high viscosity |
04/06/2011 | EP2074152B1 Accelerated organoborane initiated polymerizable compositions |
04/06/2011 | EP1632509B1 Method for producing polychloroprene latex and composition |
04/06/2011 | CN1931904B Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components |
04/06/2011 | CN101589514B Anisotropic electroconductive film |
03/31/2011 | WO2011037035A1 Method for manufacturing display device, and display device |
03/30/2011 | EP1262530B1 Adhesive composition for hard tissues |
03/30/2011 | CN101995772A Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method |
03/30/2011 | CN101993678A Ultraviolet curing glue and preparation method thereof |
03/30/2011 | CN101993668A Adhesive sheet for supporting and protecting semiconductor wafer, back grinding method for semiconductor wafer |
03/30/2011 | CN101213225B Solidifying composition and method for temporary fixing of part by using the same |
03/29/2011 | US7915321 Aqueous dispersion and the use thereof in the production of coating agents, adhesives and sealing agents that can be cured by heat or by actinic radiation |
03/24/2011 | WO2011033002A1 Composition for a structural adhesive |
03/24/2011 | WO2011032998A1 Phosphonate bonding compositions |
03/24/2011 | WO2010144774A3 Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds |
03/24/2011 | WO2010118123A3 Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts |
03/24/2011 | CA2774025A1 Composition for a structural adhesive |
03/23/2011 | CN101502188B Circuit connection material, circuit member connecting structure and method of connecting circuit member |
03/22/2011 | US7909194 Thermoplastic vulcanizates and sealing devices made therewith |
03/22/2011 | CA2563057C Water-resistant vegetable protein adhesive dispersion compositions |
03/22/2011 | CA2446919C Hot-melt adhesive provided in the form of granulated material |
03/16/2011 | EP2295481A1 Curable composition containing a reactive (meth)acrylate polymer and a cured product thereof |
03/16/2011 | EP2295476A2 Varnishes with oxygen indicator function for coating or gluing and products produced with same |
03/16/2011 | EP1704197B1 Method of preparing a pressure-sensitive adhesive |
03/10/2011 | WO2011027707A1 Radiation-curable pressure-sensitive adhesive composition for optical members, and pressure-sensitive adhesion type optical members |
03/10/2011 | WO2010014641A8 Controlled exotherm of cyanoacrylate formulations |
03/09/2011 | EP2291347A2 Manufacture and use of alkyl p-toluates |
03/08/2011 | CA2471877C Composition containing a polymerizable reducing agent, kit and method |
03/02/2011 | EP2289957A1 Elastic methacrylate compositions |
02/23/2011 | EP2285760A2 Cure accelerators for anaerobic curable compositions |
02/23/2011 | EP1951831B1 Adhesives, sealants and coatings containing glass particles as a filler |
02/22/2011 | CA2337187C Bioabsorbable blends and surgical articles therefrom |
02/17/2011 | WO2011018513A1 Infrared absorbing dye-containing cyanoacrylate compositions and laser welding method using such compositions |
02/17/2011 | WO2010080795A8 Hydrogen peroxide complexes and their use in the cure system of anaerobic adhesives |
02/16/2011 | CN101977955A Polymer to metal bonding and compounds and compositions useful therefor |
02/15/2011 | US7887668 Adhering two mating surface with the adhesive composition; adhesive for plastic substrates |
02/09/2011 | CN101970590A Actinically curable adhesive composition |
02/09/2011 | CN101967354A Low whitening alpha-cyanoacrylate adhesive |
02/03/2011 | WO2011013663A1 Actinic-energy-ray-curable adhesive composition for plastic film or sheet |
02/02/2011 | CN1910205B Radiation curable laminating adhesives based on cycloalphatic carboxylic acid functional monomers |
02/02/2011 | CN101962515A Ultraviolet curing adhesive for bonding silicon rubber with plastics |
01/27/2011 | US20110021655 Thermally and actinically curable adhesive composition |
01/26/2011 | CN101959912A Curable composition |
01/26/2011 | CN101955736A Adhesive composition and connecting structure |
01/26/2011 | CN101955735A Adhesive composition and connection structure for circuit component using adhesive composition |
01/26/2011 | CN101955734A Grouting interlayer safety glass glue |
01/25/2011 | US7875149 applying to aircraft transparency an adhesive composition having a Part A and a Part B where Part A includes a plasticizer, a cross-linking agent, and an adhesion promoter, Part B includes moisture resister and abrasion resister, with adhesive composition being substantially sulfide free |
01/19/2011 | EP2275507A1 Adhesives for metal bonding applications |