Patents for C09J 4 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond (7,617)
09/2011
09/01/2011CA2791167A1 Reclosable package using low tack adhesive
09/01/2011CA2787956A1 Methacrylate-based adhesive compositions
08/2011
08/31/2011EP2361958A1 A low-tack, uv-cured pressure sensitive adhesive suitable for reclosable packages
08/31/2011CN102171306A Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive
08/31/2011CN102171300A Light diffusive pressure sensitive adhesive
08/25/2011WO2011101176A1 Functional materials with reversible crosslinking
08/25/2011WO2011101175A1 Functional materials having controllable viscosity
08/25/2011CA2789841A1 Functional materials with reversible crosslinking
08/25/2011CA2789839A1 Functional materials having controllable viscosity
08/25/2011CA2732473A1 A method of forming an anchor on an insulated cable
08/24/2011EP2358833A1 A pressure sensitive adhesive and a pressure sensitive adhesive tape
08/24/2011CN102161867A Bonding resin for aluminum and plastic composite plates and preparation method thereof
08/24/2011CN102161866A Adhesive composition, circuit connecting material and connecting structure of circuit member
08/24/2011CN102161732A Curable resin composition, surface protection method, temporary fixation method, and separation method
08/24/2011CN101831248B Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
08/24/2011CN101314699B Water-based adhesion agent and preparation thereof
08/23/2011US8003207 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
08/18/2011US20110201717 Actinically curable adhesive composition
08/18/2011US20110198030 Polyurethane composition that contains alpha-silane and that has anisotropic material properties
08/17/2011EP2357215A1 Use of an adhesive composition, a circuit connecting material, a process for the production of a circuit member connection structure and a semiconductor device
08/17/2011EP1913062B1 Photocurable elastomer compositions
08/17/2011EP1603984B1 Contact adhesive
08/17/2011CN102160163A Semiconductor device and method for manufacturing same
08/17/2011CN102153953A Photocurable adhesive composition
08/11/2011US20110196092 Activators for two part cyanoacrylate adhesives
08/11/2011US20110195249 Adhesive composition and optical member
08/10/2011EP2355253A1 Anisotropic conductive film
08/10/2011CN101379124B (Meth)acrylate composition with increased storage stability
08/10/2011CN101203490B Reactive monomer and resin composition containing same
08/09/2011US7993484 Two-component structural adhesive having high initial adhesion
08/09/2011CA2477140C Matt polymerization adhesive
08/04/2011WO2011093207A1 Anisotropic conductive film, bonded body and bonding method
08/03/2011CN102144009A Photocurable resin composition for laminating optically functional material
08/03/2011CN102140110A High-adhesive force radiation curable activated monomer and preparation method and use thereof
08/03/2011CN102140109A Radiation curing activated monomer with high adhesive force and application thereof
08/02/2011US7988809 Aircraft floor and interior panels using edge coated honeycomb
07/2011
07/28/2011DE10017246B4 2-Cyanacrylatzusammensetzung und deren Verwendungen 2-cyanoacrylate composition and uses thereof
07/27/2011EP2348081A1 Adhesive composition and optical member
07/27/2011EP2346956A1 Activators for two part cyanoacrylate adhesives
07/27/2011CN102134449A Ultraviolet (UV) adhesive for liquid crystal displays ( LCD)
07/27/2011CN101160330B 2-cyanoacrylate composition
07/21/2011WO2011087146A1 Re-adherable silicone-based adhesive composition, sheet-shaped base material having re-adherable adhesive layer obtained by curing said composition, and use of said base material as protective film or affixing sheet
07/21/2011WO2011008374A3 A cyanoacrylate initiator system
07/21/2011US20110176288 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
07/20/2011EP2229421B1 Textile semifinished product with at least one surface provided with an adhesive
07/20/2011CN102131883A Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition
07/20/2011CN102131882A Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component
07/20/2011CN102131878A Adhesive tape or sheet
07/20/2011CN101606229B Dicing tape and semiconductor device manufacturing method
07/19/2011US7981944 Mixture of acrylated esters; photoinitiators
07/14/2011WO2011083828A1 Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
07/14/2011WO2011083824A1 Circuit connecting adhesion film and circuit connecting structure
07/14/2011WO2011083652A1 Actinic-radiation curable composition and uses thereof
07/13/2011EP2343339A1 Adhesive composition and adhesion method
07/13/2011CN102122695A Light-emitting diode and preparation method thereof
07/13/2011CN102120919A Environmental-friendly casein insulating paste
07/13/2011CN102120918A Adhesive composition
07/12/2011US7976670 Surface insensitive anaerobic adhesive and sealant compositions
07/06/2011CN102115641A High-toughness acrylate structural adhesive and preparation method thereof
07/06/2011CN102115640A Single component pre-coated type anaerobic adhesive and preparation method thereof
07/06/2011CN101498078B Non-powder water swelling nonwoven fabric and production method thereof
06/2011
06/30/2011WO2011077906A1 Method for purification of ethyl-2-cyanoacrylate adhesive composition, and ethyl-2-cyanoacrylate adhesive composition
06/30/2011WO2011077835A1 Adhesive sheet and production method for electronic component
06/30/2011US20110159307 Method for Gluing Two Plastic Surfaces Together
06/30/2011DE102009060105A1 Polyoxaziridine und deren Verwendung als Vernetzer, insbesondere in Beschichtungsmaterialien und Klebstoffen Polyoxaziridine and their use as crosslinking agents, in particular in coating materials and adhesives
06/29/2011EP2337825A2 Cyanoacrylate compositions in non-flowable forms
06/29/2011CN102112569A Controlled exotherm of cyanoacrylate formulations
06/29/2011CN102112568A Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
06/29/2011CN102108263A Insulating adhesive material with high thermal conductivity
06/29/2011CN102108133A (Methyl) acrylyl-aziridine crosslinking agent and adhesive polymer
06/28/2011US7968668 Diisocyanate terminated macromer and formulation thereof for use as an internal adhesive or sealant
06/22/2011EP2334743A1 Light diffusive pressure sensitive adhesive
06/22/2011CN102105546A Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor
06/21/2011US7964320 Metathesis-active adhesion agents and methods for enhancing polymer adhesion to surfaces
06/21/2011US7964249 Method for producing crosslinked acrylate hot-melt adhesive compounds
06/21/2011CA2426554C Reactive adhesive with a low monomer content and with multistage hardening
06/16/2011WO2011071477A2 A pressure sensitive adhesive and a pressure sensitive adhesive tape
06/16/2011WO2011071107A1 Photosensitive adhesive composition having adhesiveness even after photocuring reaction and after pattern formation
06/15/2011EP2331647A1 Optical adhesive with diffusive properties
06/09/2011WO2011067261A1 Ir-shielding radiation curable compositions
06/09/2011DE102009012272B4 Dual härtende UV-Klebstoffe und deren Verwendungen Dual-curing UV adhesives and their uses
06/08/2011EP2330151A1 IR_shielding radiation curable compositions
06/08/2011EP2328987A1 Transferable curable non-liquid film on a release substrate
06/08/2011CN101675715B Film-like circuit connecting material and connection structure for circuit member
06/01/2011CN102083784A Electron deficient olefins and curable compositions prepared therefrom
05/2011
05/31/2011US7951884 Cure accelerators for anaerobic adhesive compositions
05/31/2011US7951295 Insertion-point seal for spiral wound module
05/25/2011CN102076806A Active-energy-ray-curing adhesive composition
05/25/2011CN102076733A Epoxy resin composition
05/25/2011CN102076642A Cure accelerators for anaerobic curable compositions
05/25/2011CN102070990A Adhesive composition, adhesive and adhesive sheet
05/19/2011WO2011059084A1 Circuit connecting material and connection structure for circuit member using same
05/19/2011WO2011058997A1 Adhesive composition for semiconductor, semiconductor device, and method for manufacturing semiconductor device
05/19/2011WO2011058996A1 Adhesive composition, semiconductor device making use thereof, and production method thereof
05/19/2011WO2011058995A1 Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layer
05/17/2011USRE42377 Composition for creating vascular occlusions
05/11/2011EP2319893A1 Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition
05/11/2011EP2319892A1 Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component
05/11/2011EP2319441A1 Materials and apparatus for treating bone
05/11/2011EP2319440A1 Materials and apparatus for treating bone
1 ... 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 ... 77