Patents for C09J 171 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers (1,938)
10/1994
10/11/1994US5354790 Forming water soluble liquid polymer film, exposing film to radiant energy
09/1994
09/29/1994WO1994021453A1 Flame-retardant, waterproof and breathable laminate
09/21/1994EP0615530A1 Elastomeric pressure-sensitive adhesive compositions exhibiting good cutting performance
09/07/1994EP0613916A1 Moulding composition based on anhydride-group terminated polyarylene ethers
09/07/1994CN1091765A Polyurethane binder/sealant and method of prodn.
08/1994
08/23/1994US5340946 Polyesters, polyurethanes, phenoxies, epoxies and blends thereof
08/23/1994US5340863 Hot metal adhesive compositions comprising low molecular weight ethylene copolymers
07/1994
07/27/1994CN1089980A Mending agent for chemical enamel equipment and production method thereof
07/07/1994WO1994014820A1 Cyclic silylureas and process of preparation
06/1994
06/09/1994WO1994012585A1 Hydrophilic polyoxyethylene pressure sensitive adhesives
05/1994
05/25/1994CN1087105A A method of improving the performance of pressure-sensitive adhesive at temperatures below 0F
04/1994
04/20/1994EP0593231A1 Method of improving pressure-sensitive adhesives
04/16/1994CA2107702A1 Method of improving the performance of pressure-sensitive adhesive at temperatures below 0°f
04/14/1994WO1993025490A3 Glass fiber binding compositions, process of binding glass fibers, and glass fiber compositions
04/13/1994EP0591174A1 Reworkable adhesive for electronic applications.
12/1993
12/23/1993WO1993025490A2 Glass fiber binding compositions, process of binding glass fibers, and glass fiber compositions
12/23/1993CA2136095A1 Glass fiber binding compositions, process of binding glass fibers, and glass fiber compositions
12/01/1993CN1078985A Single surface glue for glazed tile
10/1993
10/26/1993US5256492 Thermal transfer recording sheet
10/19/1993US5254354 Food package comprised of polymer with thermally responsive permeability
10/13/1993EP0564448A1 Non-stringy adhesive hydrophilic gels
09/1993
09/22/1993EP0560901A1 Food package comprised of polymer with thermally responsive permeability.
09/21/1993US5247051 Used to produce composites of metallic, ceramic and-or polymer substrates
09/16/1993WO1993018108A1 Hot melt adhesive compositions comprising low molecular weight ethylene copolymers
09/16/1993CA2129516A1 Hot melt adhesive compositions comprising low molecular weight ethylene copolymers
06/1993
06/10/1993WO1993011187A1 Elastomeric pressure-sensitive adhesive compositions exhibiting good cutting performance
05/1993
05/13/1993DE4237768A1 New polyarylene ether derivs. with reduced viscosity - used to prepare moulded bodies, foils, fibres and membranes, as matrix resins, adhesives or coating agents or as polymer additives
04/1993
04/15/1993WO1993007194A1 Thermoplastic elastomers
01/1993
01/21/1993DE4223135A1 Polyarylene ether] for moulded film and fibre - contg. 4,5-bis:hydroxyphenyl oxazole or 2-imidazolidone, for epoxide] thermoplastic and thermosetting matrix resin modifier, adhesive and coating agent
01/13/1993EP0522736A2 Photopolymerisable liquid compositions
12/1992
12/09/1992EP0517167A2 Flexible polyetheramines useful in epoxy compositions
09/1992
09/01/1992US5143785 Curable adhesive
09/01/1992US5143071 Non-stringy adhesive hydrophilic gels
08/1992
08/26/1992EP0500493A1 Novel poly(arylene etherketones)
08/21/1992CA2061381A1 Novel polyarylene ether ketones
07/1992
07/07/1992CA1304865C Heat activatable adhesive for wire scribed circuits
06/1992
06/08/1992WO1992010414A1 Food package comprised of polymer with thermally responsive permeability
06/08/1992CA2097908A1 Food package comprised of polymer with thermally responsive permeability
04/1992
04/15/1992EP0480200A2 Hot melt adhesive based on polyarylenetherketones and its application
04/14/1992US5104959 Polyurethane-based reactive adhesives in which the isocyanate is stabilized by a polyether amine
03/1992
03/24/1992US5098766 Glass epoxy prepreg, photocured adhesive, epoxy resins, phenolic resins, acrylated epoxy resins
03/24/1992CA1298008C Epoxy adhesive film for electronic applications
03/11/1992EP0473712A1 Adhesive compositions containing low molecular weight polyphenylene oxides
03/05/1992WO1992003516A1 Cyanate ester adhesives for electronic applications
01/1992
01/28/1992US5084348 Water-soluble, pressure-sensitive adhesive masses splice tapes
01/22/1992EP0467847A1 Polyarylene ether with tetraphenylethylene units
01/21/1992CA2047381A1 Polyarylene ethers containing tetraphenylethylene units
12/1991
12/25/1991CN1057281A Regenerated bonding agent and method for mild polyurethane waste foam
12/09/1991WO1991018957A1 Reworkable adhesive for electronic applications
12/09/1991CA2083514A1 Reworkable adhesive for electronic applications
10/1991
10/30/1991EP0454005A2 Die attach adhesive composition
10/27/1991CA2041295A1 Die attach adhesive composition
08/1991
08/28/1991EP0442941A1 Closure assembly.
08/20/1991US5041470 Flame retardant photocurable adhesive for wires and circuit boards
03/1991
03/12/1991CA1281248C2 Adhesive composition
02/1991
02/13/1991EP0412517A2 Thermal transfer recording sheet
02/05/1991US4989607 Highly conductive non-stringy adhesive hydrophilic gels and medical electrode assemblies manufactured therefrom
01/1991
01/30/1991EP0410929A2 Linear polymers
01/25/1991CA2021689A1 Linear polymers
12/1990
12/19/1990EP0402726A1 Reactive adhesives based on polyurethane
12/16/1990CA2018802A1 Polyurethane-based reactive adhesives
11/1990
11/29/1990WO1990014397A1 Adhesive compositions containing low molecular weight polyphenylene oxides
11/24/1990WO1990014396A1 Adhesive compositions containing low molecular weight polyphenylene oxides
11/24/1990CA2056374A1 Adhesive compositions containing low molecular weight polyphenylene oxides
11/20/1990US4971649 Substrates with adhesives thickened with ethylene oxide polymers modified with polyols
10/1990
10/18/1990WO1990011719A1 Non-stringy adhesive hydrophilic gels
09/1990
09/05/1990EP0385149A2 Photocurable adhesive composition and use thereof
08/1990
08/01/1990EP0379932A2 Water-soluble adhesive compounds and their use in preparing permanently temperature-resistant splittable films adhering to damp substrates
06/1990
06/19/1990US4935270 Heat recoverable article with heat curable adhesive coating
05/1990
05/17/1990WO1990005401A1 Closure assembly
05/16/1990EP0368499A2 Water-reducible coating composition
05/09/1990CA2002628A1 Closure assembly
04/1990
04/24/1990US4920199 Blend of polyether, amino resin, and solvent
04/04/1990EP0361346A2 Fluoroalkyl ether, surface modifying composition and method for modifying surface
02/1990
02/06/1990CA1265395A1 Adhesive composition
01/1990
01/30/1990CA1265296A1 Fluorinated polymers and resins prepared therefrom
09/1989
09/13/1989EP0332016A1 Laying of tiles by means of a tile adhesive
09/13/1989EP0332015A1 Adhesive
07/1989
07/04/1989US4844959 Dispersion of powdered curing compounds; particle size distribution
03/1989
03/28/1989US4816107 Acetal polymer bonded articles and method of making same
03/22/1989EP0308187A2 Acetal polymer bonded articles
03/07/1989CA1250988A1 Pressure sensitive adhesive composition
10/1988
10/11/1988CA1243146A1 Photocopolymerizable compositions based on hydroxyl- containing organic materials and substituted cycloaliphatic monoepoxide reactive diluents
09/1988
09/21/1988EP0283134A2 Epoxy adhesive film for electronic applications
09/06/1988US4769399 Epoxy adhesive film for electronic applications
05/1988
05/24/1988CA1237220A1 Curing composition of polyether having reactive silicon-containing groups and a (meth)acrylate polymer
04/1988
04/05/1988US4735829 Process for forming a pressure sensitive adhesive on a substrate
03/1988
03/01/1988CA1233593A1 Membrane-forming polymer systems
02/1988
02/03/1988EP0255241A2 Medical electrode
11/1987
11/17/1987US4707526 Tackifier composition
11/17/1987US4706680 Conductive adhesive medical electrode assemblies
10/1987
10/28/1987EP0242903A2 Tackifier composition
10/13/1987US4699969 Fluorinated polymers and resins prepared therefrom
07/1987
07/01/1987EP0227002A1 Heat activatable adhesives for wire scribed circuit boards
05/1987
05/27/1987EP0223045A2 Heat-recoverable Article
05/27/1987EP0223044A2 Adhesive composition
05/12/1987US4665127 Pressure sensitive adhesive composition
04/1987
04/14/1987US4657954 Block polyethers of glycidol with substituted or unsubstituted resorcinol and dihydric dinuclear phenol; zinc dust paints
03/1987
03/10/1987CA1218954A1 Hydrophilic, elastomeric, pressure-sensitive adhesive
03/04/1987EP0212319A2 Resins prepared from fluorinated polymers
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