Patents for C09J 171 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers (1,938) |
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10/11/1994 | US5354790 Forming water soluble liquid polymer film, exposing film to radiant energy |
09/29/1994 | WO1994021453A1 Flame-retardant, waterproof and breathable laminate |
09/21/1994 | EP0615530A1 Elastomeric pressure-sensitive adhesive compositions exhibiting good cutting performance |
09/07/1994 | EP0613916A1 Moulding composition based on anhydride-group terminated polyarylene ethers |
09/07/1994 | CN1091765A Polyurethane binder/sealant and method of prodn. |
08/23/1994 | US5340946 Polyesters, polyurethanes, phenoxies, epoxies and blends thereof |
08/23/1994 | US5340863 Hot metal adhesive compositions comprising low molecular weight ethylene copolymers |
07/27/1994 | CN1089980A Mending agent for chemical enamel equipment and production method thereof |
07/07/1994 | WO1994014820A1 Cyclic silylureas and process of preparation |
06/09/1994 | WO1994012585A1 Hydrophilic polyoxyethylene pressure sensitive adhesives |
05/25/1994 | CN1087105A A method of improving the performance of pressure-sensitive adhesive at temperatures below 0F |
04/20/1994 | EP0593231A1 Method of improving pressure-sensitive adhesives |
04/16/1994 | CA2107702A1 Method of improving the performance of pressure-sensitive adhesive at temperatures below 0°f |
04/14/1994 | WO1993025490A3 Glass fiber binding compositions, process of binding glass fibers, and glass fiber compositions |
04/13/1994 | EP0591174A1 Reworkable adhesive for electronic applications. |
12/23/1993 | WO1993025490A2 Glass fiber binding compositions, process of binding glass fibers, and glass fiber compositions |
12/23/1993 | CA2136095A1 Glass fiber binding compositions, process of binding glass fibers, and glass fiber compositions |
12/01/1993 | CN1078985A Single surface glue for glazed tile |
10/26/1993 | US5256492 Thermal transfer recording sheet |
10/19/1993 | US5254354 Food package comprised of polymer with thermally responsive permeability |
10/13/1993 | EP0564448A1 Non-stringy adhesive hydrophilic gels |
09/22/1993 | EP0560901A1 Food package comprised of polymer with thermally responsive permeability. |
09/21/1993 | US5247051 Used to produce composites of metallic, ceramic and-or polymer substrates |
09/16/1993 | WO1993018108A1 Hot melt adhesive compositions comprising low molecular weight ethylene copolymers |
09/16/1993 | CA2129516A1 Hot melt adhesive compositions comprising low molecular weight ethylene copolymers |
06/10/1993 | WO1993011187A1 Elastomeric pressure-sensitive adhesive compositions exhibiting good cutting performance |
05/13/1993 | DE4237768A1 New polyarylene ether derivs. with reduced viscosity - used to prepare moulded bodies, foils, fibres and membranes, as matrix resins, adhesives or coating agents or as polymer additives |
04/15/1993 | WO1993007194A1 Thermoplastic elastomers |
01/21/1993 | DE4223135A1 Polyarylene ether] for moulded film and fibre - contg. 4,5-bis:hydroxyphenyl oxazole or 2-imidazolidone, for epoxide] thermoplastic and thermosetting matrix resin modifier, adhesive and coating agent |
01/13/1993 | EP0522736A2 Photopolymerisable liquid compositions |
12/09/1992 | EP0517167A2 Flexible polyetheramines useful in epoxy compositions |
09/01/1992 | US5143785 Curable adhesive |
09/01/1992 | US5143071 Non-stringy adhesive hydrophilic gels |
08/26/1992 | EP0500493A1 Novel poly(arylene etherketones) |
08/21/1992 | CA2061381A1 Novel polyarylene ether ketones |
07/07/1992 | CA1304865C Heat activatable adhesive for wire scribed circuits |
06/08/1992 | WO1992010414A1 Food package comprised of polymer with thermally responsive permeability |
06/08/1992 | CA2097908A1 Food package comprised of polymer with thermally responsive permeability |
04/15/1992 | EP0480200A2 Hot melt adhesive based on polyarylenetherketones and its application |
04/14/1992 | US5104959 Polyurethane-based reactive adhesives in which the isocyanate is stabilized by a polyether amine |
03/24/1992 | US5098766 Glass epoxy prepreg, photocured adhesive, epoxy resins, phenolic resins, acrylated epoxy resins |
03/24/1992 | CA1298008C Epoxy adhesive film for electronic applications |
03/11/1992 | EP0473712A1 Adhesive compositions containing low molecular weight polyphenylene oxides |
03/05/1992 | WO1992003516A1 Cyanate ester adhesives for electronic applications |
01/28/1992 | US5084348 Water-soluble, pressure-sensitive adhesive masses splice tapes |
01/22/1992 | EP0467847A1 Polyarylene ether with tetraphenylethylene units |
01/21/1992 | CA2047381A1 Polyarylene ethers containing tetraphenylethylene units |
12/25/1991 | CN1057281A Regenerated bonding agent and method for mild polyurethane waste foam |
12/09/1991 | WO1991018957A1 Reworkable adhesive for electronic applications |
12/09/1991 | CA2083514A1 Reworkable adhesive for electronic applications |
10/30/1991 | EP0454005A2 Die attach adhesive composition |
10/27/1991 | CA2041295A1 Die attach adhesive composition |
08/28/1991 | EP0442941A1 Closure assembly. |
08/20/1991 | US5041470 Flame retardant photocurable adhesive for wires and circuit boards |
03/12/1991 | CA1281248C2 Adhesive composition |
02/13/1991 | EP0412517A2 Thermal transfer recording sheet |
02/05/1991 | US4989607 Highly conductive non-stringy adhesive hydrophilic gels and medical electrode assemblies manufactured therefrom |
01/30/1991 | EP0410929A2 Linear polymers |
01/25/1991 | CA2021689A1 Linear polymers |
12/19/1990 | EP0402726A1 Reactive adhesives based on polyurethane |
12/16/1990 | CA2018802A1 Polyurethane-based reactive adhesives |
11/29/1990 | WO1990014397A1 Adhesive compositions containing low molecular weight polyphenylene oxides |
11/24/1990 | WO1990014396A1 Adhesive compositions containing low molecular weight polyphenylene oxides |
11/24/1990 | CA2056374A1 Adhesive compositions containing low molecular weight polyphenylene oxides |
11/20/1990 | US4971649 Substrates with adhesives thickened with ethylene oxide polymers modified with polyols |
10/18/1990 | WO1990011719A1 Non-stringy adhesive hydrophilic gels |
09/05/1990 | EP0385149A2 Photocurable adhesive composition and use thereof |
08/01/1990 | EP0379932A2 Water-soluble adhesive compounds and their use in preparing permanently temperature-resistant splittable films adhering to damp substrates |
06/19/1990 | US4935270 Heat recoverable article with heat curable adhesive coating |
05/17/1990 | WO1990005401A1 Closure assembly |
05/16/1990 | EP0368499A2 Water-reducible coating composition |
05/09/1990 | CA2002628A1 Closure assembly |
04/24/1990 | US4920199 Blend of polyether, amino resin, and solvent |
04/04/1990 | EP0361346A2 Fluoroalkyl ether, surface modifying composition and method for modifying surface |
02/06/1990 | CA1265395A1 Adhesive composition |
01/30/1990 | CA1265296A1 Fluorinated polymers and resins prepared therefrom |
09/13/1989 | EP0332016A1 Laying of tiles by means of a tile adhesive |
09/13/1989 | EP0332015A1 Adhesive |
07/04/1989 | US4844959 Dispersion of powdered curing compounds; particle size distribution |
03/28/1989 | US4816107 Acetal polymer bonded articles and method of making same |
03/22/1989 | EP0308187A2 Acetal polymer bonded articles |
03/07/1989 | CA1250988A1 Pressure sensitive adhesive composition |
10/11/1988 | CA1243146A1 Photocopolymerizable compositions based on hydroxyl- containing organic materials and substituted cycloaliphatic monoepoxide reactive diluents |
09/21/1988 | EP0283134A2 Epoxy adhesive film for electronic applications |
09/06/1988 | US4769399 Epoxy adhesive film for electronic applications |
05/24/1988 | CA1237220A1 Curing composition of polyether having reactive silicon-containing groups and a (meth)acrylate polymer |
04/05/1988 | US4735829 Process for forming a pressure sensitive adhesive on a substrate |
03/01/1988 | CA1233593A1 Membrane-forming polymer systems |
02/03/1988 | EP0255241A2 Medical electrode |
11/17/1987 | US4707526 Tackifier composition |
11/17/1987 | US4706680 Conductive adhesive medical electrode assemblies |
10/28/1987 | EP0242903A2 Tackifier composition |
10/13/1987 | US4699969 Fluorinated polymers and resins prepared therefrom |
07/01/1987 | EP0227002A1 Heat activatable adhesives for wire scribed circuit boards |
05/27/1987 | EP0223045A2 Heat-recoverable Article |
05/27/1987 | EP0223044A2 Adhesive composition |
05/12/1987 | US4665127 Pressure sensitive adhesive composition |
04/14/1987 | US4657954 Block polyethers of glycidol with substituted or unsubstituted resorcinol and dihydric dinuclear phenol; zinc dust paints |
03/10/1987 | CA1218954A1 Hydrophilic, elastomeric, pressure-sensitive adhesive |
03/04/1987 | EP0212319A2 Resins prepared from fluorinated polymers |