| Patents for C09J 171 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers (1,938) |
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| 11/09/2005 | EP1314197B1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 10/27/2005 | US20050238692 Biomedical adhesive |
| 10/26/2005 | EP1383844B1 A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 10/25/2005 | US6958256 Process for the back-surface grinding of wafers |
| 10/19/2005 | EP1347788B1 Antimicrobial hot melt adhesive |
| 10/19/2005 | CN1223645C Wood adhesive and manufacturing method therefor |
| 10/13/2005 | WO2005095485A1 Hardenable composition |
| 10/13/2005 | US20050228120 Polymer having charged units |
| 10/13/2005 | CA2561385A1 Hardenable composition |
| 10/12/2005 | EP1584645A1 Polytetrafluoroethylene composites |
| 10/12/2005 | CN1681878A Polymeric compositions containing polymers and ionic liquids |
| 10/06/2005 | US20050221038 bonding with a cured mixture of tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride terpolymer, polyethylene-oxide-modified silicone polymer coupling agent, and oxygen-radical-containing copolymer (epoxy, phenoxy polymer, or hydroxylated diamine-diepoxide) |
| 09/30/2005 | CA2502128A1 Polytetrafluoroethylene composites |
| 09/28/2005 | CN1675329A Acrylic pressure sensitive adhesives |
| 09/22/2005 | WO2005087865A1 Moisture-curable composition and method of bonding |
| 09/21/2005 | EP1576031A1 Polymer comprising 3-(n-silylalkyl)-amino-propenoate groups and use thereof |
| 09/15/2005 | US20050202260 Fluoropolyether adhesive composition |
| 09/07/2005 | EP1571192A1 Fluoropolyether adhesive composition |
| 09/01/2005 | DE102004006531A1 Teilkristallines Polyether-Copolymer auf Basis von Propylenoxid und daraus herstellbare Duromere A partially crystalline polyether copolymer based on propylene oxide and produced therefrom thermosets |
| 09/01/2005 | DE102004006522A1 Elastic two-component flock adhesives, useful for the production of substrates flocked with flock fibers, comprises silyl phased polyether, solvent-free epoxy resin, optionally thixotroping agent, bases and accelerators |
| 08/25/2005 | WO2005078036A1 Adhesive composition based on semi-crystalline polypropylene oxide copolymers and duromers that can be produced from said copolymers |
| 08/25/2005 | US20050187311 coating resins comprising aromatic cyanates and addition polymers on circuit substrates, then curing with light and heat to form insulation layer with improved surface smoothness and excellent dielectric properties |
| 08/24/2005 | EP1566410A1 Thermally vanishing material, transfer sheet using the same, and method for forming pattern |
| 08/18/2005 | WO2005075562A1 Curable composition |
| 08/18/2005 | CA2555779A1 Curable composition |
| 08/17/2005 | EP1263853A4 Lightweight ready-mx joint compound |
| 08/17/2005 | CN1656133A Polymer having charged units |
| 08/16/2005 | US6930399 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 08/11/2005 | WO2005073334A1 Pressure sensitive adhesive composition |
| 08/11/2005 | WO2005073333A1 Pressure sensitive adhesive composition |
| 08/11/2005 | CA2554745A1 Pressure sensitive adhesive composition |
| 08/11/2005 | CA2554743A1 Pressure sensitive adhesive composition |
| 08/10/2005 | EP1561768A1 Polyarylene ether compound containing sulfonic acid group, composition containing same, and method for manufacturing those |
| 08/10/2005 | EP0833864B2 Gluing, sealing and coating compound |
| 08/10/2005 | CN1653150A Biomedical adhesive |
| 08/04/2005 | US20050171228 UV-curable compositions |
| 08/03/2005 | CN1649920A Film adhesives containing maleimide and related compounds and methods for use thereof |
| 07/28/2005 | US20050165169 Adhesive |
| 07/27/2005 | CN1646655A 压敏粘合剂组合物 The pressure-sensitive adhesive composition |
| 07/21/2005 | US20050158552 Poly(arylene ether) adhesive compositions |
| 07/13/2005 | CN1639290A Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| 07/13/2005 | CN1637442A Polarizing disk and producing method thereof |
| 07/13/2005 | CN1637107A 改进的粘合剂 Improved adhesive |
| 07/13/2005 | CN1210365C Antistatic pressure-sensitive adhesive composition |
| 07/06/2005 | EP1550704A1 Improved adhesive |
| 06/29/2005 | CN1633489A Moisture curable adhesive composition |
| 06/21/2005 | US6908957 Curable electron donor compounds |
| 06/16/2005 | US20050131205 Chain extended dendritic polyether |
| 06/15/2005 | CN1628153A Two-part polyurethane adhesives for structural finger joints and method therefor |
| 06/14/2005 | US6906120 Poly(arylene ether) adhesive compositions |
| 06/07/2005 | US6903151 Wet-stick adhesives, articles, and methods |
| 06/01/2005 | CN1622968A Chain extended dendritic polyether |
| 05/31/2005 | US6900274 Mixture of latex, tackifier resin and surfactant |
| 05/31/2005 | US6900269 Halogen-free resin composition |
| 05/25/2005 | CN1619898A Laser module |
| 05/24/2005 | US6896903 Bioadhesive compositions |
| 05/19/2005 | WO2005044470A1 Poly (alkylene oxide) polymer-based pressure sensitive adhesive and tapes formed therefrom |
| 05/19/2005 | US20050107542 Film adhesives containing maleimide compounds and methods for use thereof |
| 05/11/2005 | CN1615350A Pressure sensitive adhesives having quaternary ammonium functionality, articles, and methods |
| 05/05/2005 | US20050096436 Preparing a surfactant by reacting an alpha, beta-unsaturated carboxylic acid or anhydride, or an ester thereof, with a resin comprising hydrocarbon monomeric residues to provide an adduct; and reacting adduct with alkylene oxide or a carboxyl-reactive poly(alkylene oxide); pressure sensitive adhesives |
| 05/05/2005 | US20050092428 Command-cure adhesives |
| 05/04/2005 | EP1528092A1 Adhesive composition |
| 05/04/2005 | EP1527146A1 Acrylic pressure sensitive adhesives |
| 05/04/2005 | EP1385896B1 Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds |
| 04/28/2005 | US20050090602 Low-contaminating adhesive composition |
| 04/26/2005 | US6884833 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 04/20/2005 | EP1399519B8 Devices, compositions and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 04/14/2005 | WO2005033243A1 Water soluble hot-melt-type adhesive |
| 04/14/2005 | WO2005033239A1 Adhesive composition |
| 04/14/2005 | CA2541571A1 Pressure-sensitive composition |
| 04/13/2005 | EP0947189B1 Wet tacky compositions, plaster patches comprising the same, and methods for using the same |
| 04/12/2005 | US6878435 Adapted for enhancing the adhesion strength of a typical single layer anisotropic conductive film in flip chip bonding; comprising epoxy resin-based film containing conductive particles |
| 04/07/2005 | US20050074039 Laser module |
| 04/06/2005 | EP1519988A1 Polymeric compositions containing polymers and ionic liquids |
| 04/05/2005 | CA2157296C Crosslinked absorbent pressure sensitive adhesive and wound dressing |
| 03/30/2005 | EP1517970A1 Biomedical adhesive |
| 03/22/2005 | CA2125185C Elastomeric pressure-sensitive adhesive compositions exhibiting good cutting performance |
| 03/02/2005 | EP1399519B1 Devices, compositions and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents |
| 02/24/2005 | WO2005016989A1 Command-cure adhesives |
| 02/23/2005 | EP1507811A1 Polymer having charged units |
| 02/23/2005 | CN1190419C Compound with electron providing and receiving functional groups |
| 02/16/2005 | CN1579560A Coblended contact glue of poly N-ethenyl pyrrolidone and polyvinyl alcohol and its use |
| 02/16/2005 | CN1189531C Cure on demand adhesives and window module with cure on demand adhesive thereon |
| 02/15/2005 | US6855748 Quick-setting mixtures comprising heterocyclic ethers, acyclic alcohols-2+ and curing agents, used in stereolithography, coatings, adhesives or primers |
| 02/09/2005 | EP1190010B1 Wet-stick adhesives, articles, and methods |
| 02/02/2005 | EP1456303A4 Two-part polyurethane adhesives for structural finger joints and method therefor |
| 01/27/2005 | DE10297578T5 Adhäsives Harz mit hohen Dämpfungseigenschaften und Verfahren zu dessen Herstellung Adhesive resin having high damping properties and method for its production |
| 01/20/2005 | WO2004101349A3 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 01/12/2005 | CN1184647C Electric conducting binder using for through-hole filling |
| 01/11/2005 | US6841628 Polyhydroxy polyether resin comprising glycerol, bisphenol, and 4,4*-dihydroxybiphenyl comonomers; and three-dimensionally curable resin; |
| 01/11/2005 | US6841257 Adhesion to a variety of substrates and the ability to be converted at high speed |
| 01/06/2005 | US20050003577 Semiconductor package production method and semiconductor package |
| 01/05/2005 | CN1561377A Adhesive compositions and constructions with improved cutting performance |
| 12/30/2004 | US20040266925 Adhesive composition |
| 12/29/2004 | EP1490449A1 Pressure sensitive adhesive composition |
| 12/29/2004 | EP1290099B1 Adhesive compositions and constructions with improved cutting performance |
| 12/29/2004 | CN1182219C Process for preparation of hydrophilic pressure sensitive adhesives having optimized adhesive properties |
| 12/21/2004 | US6833044 Solvent-free two-component curable adhesive composition |
| 12/15/2004 | EP1486534A1 Adhesive compositions, their preparation and use |
| 12/14/2004 | US6831132 Useful as adhesives in microelectronics industry; film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength |