Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 171 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
Patents for C09J 171 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers (1,938)
11/2003
11/26/2003EP1364663A1 Ocular devices with functionalized surface with adhesive properties
11/18/2003US6649016 Silane functional adhesive composition and method of bonding a window to a substrate without a primer
11/13/2003WO2003000775A8 Reactive diluent in moisture curable system
11/12/2003EP0895530B1 Binder and its use in radiation-curable coating agents
11/11/2003US6646046 Composition comprising water soluble polymer, water insoluble component, water incompatible solvent that dissolves water insoluble component, water soluble plasticizer and water, and which has specified water solubility in dry state
10/2003
10/29/2003CN1452650A Process for preparation of hydrophilic pressure sensitive adhesives having optimized adhesive properties
10/23/2003WO2003054103A3 Resin with high damping properties
10/23/2003WO2002091433A3 Method for grinding the back sides of wafers
10/23/2003US20030199638 Film adhesives containing maleimide compounds and methods for use thereof
10/22/2003EP1080126B1 Method of bonding a window to a substrate using a silane functional adhesive composition
10/21/2003US6635695 Releasability from heating platens used in hot-press forming
10/16/2003WO2003085061A1 Pressure sensitive adhesive composition
10/14/2003US6632873 Two-part polyurethane adhesives for structural finger joints and method therefor
10/09/2003WO2003082940A1 Film adhesives containing maleimide and related compounds and methods for use thereof
10/09/2003US20030190468 Pressure sensitive adhesive composition
10/02/2003US20030187156 Reactive hot-melt adhesive composition
10/01/2003EP1347788A2 Antimicrobial hot melt adhesive
10/01/2003EP1153996B1 Binder resin for polyolefin resin, process for producing the same, and uses thereof
09/2003
09/18/2003WO2003076546A1 Silane functional adhesive composition and method of bonding a window to a substrate without a primer
09/18/2003US20030176529 Photoreactive hot-melt adhesive composition
09/18/2003US20030175503 Pressure sensitive adhesives having quaternary ammonium functionality, articles, and methods
09/18/2003US20030173026 Silane functional adhesive composition and method of bonding a window to a substrate without a primer
09/17/2003CN1443229A Adhesive compositions containing stable amino-containing polymer latex blends
09/11/2003US20030171527 Grafting olefinic functional groups to the backbone of poly(arylene ether) polymers, using, e.g., allyl bromide or citral, to provide cross-linkable polymers having high glass transition temperatures and low moisture uptake.
09/11/2003US20030171454 Wet-stick adhesives, articles, and methods
09/10/2003CN1441021A Water dispersive pressure sensitive adhesive composition and pressure sensitive adhesive product
09/03/2003EP1340797A2 Aqueous dispersion type pressure-sensitive adhesive composition and pressure-sensitive adhesive product
09/02/2003US6613816 Cure on demand adhesives and window module with cure on demand adhesive thereon
08/2003
08/21/2003WO2003068886A1 Moisture curable adhesive composition
08/21/2003CA2468810A1 Moisture curable adhesive composition
08/19/2003US6608148 Hot melt adhesive of cationic polymerizable compound, photoinitiator and phthalate diester
08/14/2003US20030153671 Moisture curable adhesive
08/14/2003US20030153121 Semiconductor package production method and semiconductor package
08/05/2003US6602964 Reactive diluent in moisture curable system
07/2003
07/31/2003WO2003062343A1 Pressure sensitive adhesives having quaternary ammonium functionality, articles, and methods
07/31/2003WO2003062306A1 Chain extended dendritic polyether
07/31/2003US20030143797 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
07/31/2003CA2471926A1 Pressure sensitive adhesives having quaternary ammonium functionality, articles, and methods
07/30/2003CN1433387A Concrete product having a retrcreflective surface and its production process
07/23/2003EP1328567A1 High functional polymers
07/17/2003US20030134961 Blend of 2 resins having different glass transition temperature; inorganic filler; tan delta value is greater than about 0.2 over a temperature range of -15 - 50 degrees C. at 1 Hz.; suspension assembly for disk drives
07/16/2003EP1327652A1 Poly(arylene ether) polymer with low temperature crosslinking grafts and adhesive comprising the same
07/09/2003CN1428391A Room temp. solidified high-temp. adhesive
07/03/2003WO2003054103A2 Resin with high damping properties
07/03/2003US20030125449 Two-part polyurethane adhesives for structural finger joints and method therefor
07/01/2003US6586512 Composition comprising superabsorbent polymer comprising at least one polymerized monomer selected from carboxylic acid, acrylamide, or derivatives thereof, and binding amount of hydroxy-functionalized polyether
06/2003
06/17/2003US6579941 Adhesive compositions and constructions with outstanding cutting performance
06/12/2003US20030108736 Aqueous pressure-sensitive adhesive composition, production method therefor and pressure-sensitive adhesive tape using the composition
06/12/2003US20030106640 Crosslinking polyether, polyester with diisocyanate
06/11/2003EP1318182A1 Hot-melt adhesive
06/11/2003EP1318180A1 Aqueous pressure-sensitive adhesive composition, production method therefor and pressure-sensitive adhesive tape using the composition
06/11/2003CN1422926A Thermalfusible adhesive
06/10/2003US6576712 Polymer and plasticizing agent are capable of hydrogen or electrostatic bonding to each other and are present in a specific ratio
06/04/2003EP1315780A2 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
05/2003
05/30/2003WO2003044094A1 Two-part polyurethane adhesives for structural finger joints and method therefor
05/29/2003US20030100654 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
05/28/2003EP1314197A1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
05/22/2003WO2003000775A3 Reactive diluent in moisture curable system
05/20/2003CA2226864C Nonwoven materials comprising biodegradable copolymers
05/07/2003CN1416456A Sulfonated copolyester based water -dispersible hot melt adhesive
05/01/2003US20030083436 Composition, method of making, and method of using adhesive composition
05/01/2003US20030082362 High cohesive strength pressure sensitive adhesive foam
04/2003
04/29/2003US6555641 Acrylic polymer compositions with crystalline side chains and processes for their preparation
04/22/2003US6552147 Acrylic polymer compositions with crystalline side chains and processes for their preparation
04/15/2003US6548608 Polyetherimide and/or polysulphone, aromatic polyamine-modified epoxy resin and thermoplastic
04/09/2003EP1299494A2 Preparation of hydrophilic pressure sensitive adhesives having optimized adhesive properties
04/08/2003US6545066 Fillers comprises hollow resin microspheres having a mean particle size of less than 75 microns; enhances adhesion of said joint compound to a substrate
04/08/2003CA2202642C One-coat adhesive for bonding castable urethanes to metal
03/2003
03/27/2003WO2003025082A1 Adhesive composition for floor coverings
03/20/2003US20030055190 For use as adhesive
03/20/2003US20030055189 A polymer containing an acrylic backbone with less than 50 by weight of synthetic wax monomer (SWM), which contains crystalline polyethylene side chain; and from 50 to 99 percent by weight of at least one second monomer
03/13/2003US20030049883 Semiconductor package production method and semiconductor package
03/12/2003EP1290101A2 Adhesive compositions containing stable amino-containing polymer latex blends
03/12/2003EP1290099A2 Adhesive compositions and constructions with improved cutting performance
03/12/2003CN1402768A Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same
03/06/2003US20030044599 Wet pressure-sensitive adhesive composition, adhesive sheet using the same and using method thereof
03/04/2003US6528615 Hot melt adhesives obtained from the condensation of polyamide blocks containing carboxylic acid ends with polyetherdiols, such as ethoxylated primary amines
02/2003
02/20/2003WO2002045763A3 Antimicrobial hot melt adhesive
02/19/2003CN1398279A Resin compsn. adhesives prepared therewith for bonding circuit members, and circuit boards
02/13/2003WO2003011954A1 High cohesive strength pressure sensitive adhesive foam
02/13/2003WO2002092709A3 Self-adhesive protective film for glass surfaces comprising a porous sio2 anti-reflection layer and use of the same
02/12/2003EP1283235A2 Composition, method of making, and method of using adhesive composition
02/11/2003US6518343 Useful for adhesion to wet surfaces, such as skin or like delicate surfaces; acrylic ester resin with nonreactive polyether
02/06/2003US20030027942 Epoxy copolymeric resin from a alkylidenediphenol such as 1,1-(4,4'-dihydroxy-diphenyl)undecane and a biphenol blended with a three dimensionally cross-linkable resin.
02/06/2003US20030026979 Sheet-form, curable pressure-sensitive adhesive
02/05/2003CN1395594A Lightweight ready-mixing joint compound
02/05/2003CN1394930A Anti-electrostatic cutting band
02/05/2003CN1394894A Composition and its preparing method, method for using adhensive composition
01/2003
01/29/2003EP1279709A1 Method of bonding adherend
01/23/2003US20030017327 High adhesion triple layered anisotropic conductive adhesive film
01/09/2003WO2003002682A1 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constituents
01/08/2003EP1273644A1 Photoreactive hot-melt adhesive composition
01/03/2003WO2003000775A2 Reactive diluent in moisture curable system
01/03/2003CA2432491A1 Reactive diluent in moisture curable system
01/02/2003EP1268701A2 Sulfonated copolyester based water-dispersible hot melt adhesive
12/2002
12/26/2002US20020198308 Moisture curable sealants
12/11/2002EP1263853A1 Lightweight ready-mx joint compound
12/10/2002US6492017 Self-adhesive highly transparent protective article for automobile windows and other sensitive surfaces
12/05/2002US20020182955 Structural bonding tapes and articles containing the same
12/04/2002EP0860023B1 A flip-chip assembly
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