Patents for C09J 171 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers (1,938)
11/2006
11/22/2006CN1865377A Laminated belt for package material
11/15/2006CN1863885A 压敏粘合剂组合物 The pressure-sensitive adhesive composition
11/14/2006US7135122 bonding with a cured mixture of tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride terpolymer, polyethylene-oxide-modified silicone polymer coupling agent, and oxygen-radical-containing copolymer (epoxy, phenoxy polymer, or hydroxylated diamine-diepoxide)
11/09/2006WO2006118323A1 Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer
11/01/2006CN1854231A Die attach adhesives with improved stress performance
10/2006
10/25/2006EP1715016A1 Pressure sensitive adhesive composition
10/25/2006EP1715015A1 Pressure sensitive adhesive composition
10/25/2006EP1715002A1 Curable composition
10/25/2006CN1281680C Sulfonated copolyester based water -dispersible hot melt adhesive
10/24/2006US7125461 Activatable material for sealing, baffling or reinforcing and method of forming same
10/19/2006WO2005033075A3 Polyfluorinated compounds useful as surfactants, foam control agents and/or rheology modifiers
10/11/2006CN1844191A Polytetrahydrofuran and poly-p-dioxanone triblock copolymer and its preparation method and use
10/11/2006CN1279089C Chain extended dendritic polyether
10/10/2006US7119144 Curing an acetoacetate terminated polyester or polyesteramide with an alpha, beta -unsaturated multi-carboxylic acid ester; one step process to produce adhesive; nontoxic, nonabsorbed through the skin, nonvolatile low molecular weight materials
10/04/2006EP0979854B1 Circuit connecting material, and structure and method of connecting circuit terminal
09/2006
09/21/2006US20060211799 Resin composition and process for producing the same
09/21/2006US20060207722 Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting films
09/20/2006EP1151051B1 Adhesive with magnetic nanoparticles
09/20/2006CN1836021A Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same
09/13/2006EP1076679B1 Cure on demand adhesives and window module with cure on demand adhesive thereon
09/12/2006US7105601 Blend of 2 resins having different glass transition temperature; inorganic filler; tan delta value is greater than about 0.2 over a temperature range of -15 - 50 degrees C. at 1 Hz.; suspension assembly for disk drives
08/2006
08/30/2006CN1272397C Water dispersive pressure sensitive adhesive composition and pressure sensitive adhesive product
08/24/2006WO2006088112A1 Reactive resin composition
08/16/2006EP1417255B1 High cohesive strength pressure sensitive adhesive foam
08/16/2006CN1269928C Reactive hot melt composition with improved primary strength
08/15/2006US7091308 Chain extended dendritic polyether
08/15/2006US7090920 laminate comprising thermoplastic substrate, conductive metal foil at least partially disposed on substrate, adhesive disposed between substrate and the metal foil, poly(arylene ether) resin, thermosetting resin, poly(vinyl butyral-co-vinyl acetate) resin toughening agent; circuit board applications
08/10/2006US20060177652 High cohesive strength pressure sensitive adhesive foam
08/09/2006EP1279709B1 Method of bonding adherend
08/09/2006CN1268708C 压敏粘合剂组合物 The pressure-sensitive adhesive composition
08/08/2006US7087127 which is especially useful when the substrate is unprimed metal, plastic, fiberglass or a composite, optionally coated with a coating
08/02/2006EP1684913A1 Poly (alkylene oxide) polymer-based pressure sensitive adhesive and tapes formed therefrom
08/02/2006CN1267471C Terminal aromatic amino base polyether compound, its preparation method and use in adhesive agent
07/2006
07/27/2006US20060166048 Polyarylene ether compound containing sulfonic acid group, composition containing same, and method for manufacturing those
07/13/2006US20060155045 (Meth)acrylic adhesive with low odor and high impact resistance
07/05/2006CN1798820A Activatable material for sealing,Baffling or reinforcing and method of forming same
07/05/2006CN1262619C Automotive adhesive
06/2006
06/28/2006EP1674545A1 Pressure sensitive adhesive composition
06/21/2006CN1791653A Foamable underfill encapsulant
06/15/2006WO2005118679A3 Novel adhesive composition
06/07/2006EP1666555A2 Aqueous pressure-sensitive adhesive composition, production method therefor and pressure-sensitive adhesive tape using the composition
06/07/2006EP1664229A1 Water soluble hot-melt-type adhesive
06/07/2006EP1232198B1 Uv-curable compositions
06/07/2006CN1784450A Adhesive compositions containing hybrid oxetane compounds
05/2006
05/24/2006CN1777651A Resin composition and process for producing the same
05/18/2006CA2582418A1 Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
05/17/2006CN1256397C Thermal fusible adhesive composition, its preparing method and use for binding substrates
05/11/2006WO2006050242A1 Method of primerless bonding
05/11/2006US20060100323 Comprises at least one semicrystalline polymer having no ionic groups and an ionic liquid plasticizer; use in injection molding processes as a semiconductive or antistatic binder or adhesive
05/11/2006US20060099413 Blend of substantially water insoluble polyols with acrylic resins to improve the adhesion to low surface energy substrates as well as to improve other properties; good adhesion not only to high surface energy substrates but also to low surface energy substrates
05/11/2006CA2581874A1 Method of primerless bonding
05/04/2006WO2006046602A1 Two-component acrylic adhesive for forming mold model and bonding method using such adhesive
05/04/2006WO2006046472A1 Curable composition
05/03/2006EP1651700A1 Command-cure adhesives
05/02/2006CA2342117C Ethoxylated amine-based polyether-polyamide block copolymers
04/2006
04/11/2006US7025853 Acrylated polyurethane
04/05/2006CN1756655A Poly(phenylene ether)-polyvinyl thermosetting adhesives films, and substrates made therefrom
03/2006
03/29/2006EP1640427A1 Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting films
03/29/2006CN1247675C High cohesive strength pressure sensitive adhesive foam
03/22/2006EP1637572A1 Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting films
03/22/2006CN1246410C Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
03/15/2006CN1748013A Terpene resin- and hydrocarbon resin-based surfactants and acqueous disperson of tacifier resins
03/08/2006CN1244608C Composition and its preparing method, method for using adhesive composition
02/2006
02/28/2006US7005031 Mixture containing microbiocide
02/21/2006US7001977 Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds
02/16/2006US20060036008 Novel adhesive composition
02/09/2006US20060030635 Photoreactive hot-melt adhesive composition
02/08/2006EP1483350B1 Silane functional adhesive composition and method of bonding a window to a substrate without a primer
02/01/2006EP1621582A1 Resin composition and process for producing the same
02/01/2006EP1620521A2 Activatable material for sealing, baffling or reinforcing and method of forming same
02/01/2006CN1239654C A thermosetting adhesive film, and an adhesive structure based on the use thereof
02/01/2006CN1239584C Lightweight ready-mixing joint compound
01/2006
01/18/2006EP1244755B1 Pressure sensitive adhesive and biomedical electrodes using same
01/12/2006DE19649893B4 Elektrisch leitender Klebstoff und dessen Verwendung Electrically conductive adhesive and its use
01/11/2006CN1236000C Electronic donor compound capable of solidifying
01/04/2006CN1715356A Novel adhesive composition
12/2005
12/28/2005EP1609831A1 (Meth)acrylic adhesive with low odor and high impact resistance
12/28/2005CN1233739C Resin compsn. adhesives prepared therewith for bonding circuit members, and circuit boards
12/22/2005WO2005121255A1 Curable composition
12/15/2005WO2005118679A2 Novel adhesive composition
12/15/2005US20050276934 heat decaying polymer containing a polyoxyalkylene resin as the principal ingredient formed by crosslinking a crosslinkable group containing hydrolyzing silyl group, an epoxy group, an acid anhydride group, a carboxyl group, a hydroxyl group; a decomposition promoter (SnO2 )
12/14/2005EP1605008A2 Silyl-end capped polymer adhesive compositon
12/14/2005CN1708555A Thermally vanishing material, transfer sheet using the same, and method for forming pattern
12/14/2005CN1231555C Room temp. solidified high-temp. adhesive
12/14/2005CN1231554C Water soluble cellulose ether composition and adhesive materials
11/2005
11/29/2005US6969919 Semiconductor package production method and semiconductor package
11/24/2005WO2005111150A1 Curable composition
11/23/2005EP1597333A2 Terpene resin- and hydrocarbon resin-based surfactants and aqueous dispersion of tackifier
11/23/2005CN1228387C 热塑性弹性体组合物 The thermoplastic elastomer composition
11/17/2005WO2005108500A1 Curable composition improved in adhesiveness
11/17/2005WO2005108499A1 Curable composition with improved curability and adhesiveness
11/17/2005WO2005108498A1 Curable composition
11/17/2005WO2005108494A1 Curable composition
11/17/2005WO2005108493A1 Curable composition
11/17/2005WO2005108492A1 Curable composition
11/17/2005WO2005108491A1 Curable composition
11/17/2005US20050256251 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting film
11/16/2005EP1595929A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting film
11/16/2005CN1696230A Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting film
11/16/2005CN1227316C Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same
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