Patents
Patents for B24B 7 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor (8,400)
11/2002
11/28/2002US20020175557 End-rounding devices and methods for end-rounding
11/27/2002CN1381873A Chemicomechanical grinder with temp control
11/26/2002US6485359 Platen arrangement for a chemical-mechanical planarization apparatus
11/26/2002US6485357 Dual-feed single column double-disk grinding machine
11/21/2002US20020173872 Computer memory product for substrate surface treatment applications
11/21/2002US20020173244 Polishing tool and polishing method and apparatus using same
11/21/2002US20020173229 Wafer planarization apparatus
11/21/2002US20020173140 Conductor chemical-mechanical polishing in integrated circuit interconnects
11/21/2002DE10219450A1 Vorrichtung und Verfahren zum Polieren des Umfangs eines Wafers Apparatus and method for polishing the periphery portion of a wafer
11/20/2002EP1258315A2 Apparatus for finishing plate-like, coated workpieces
11/20/2002CN1380162A Vertical grinder with double-plate surface
11/14/2002WO2002091433A2 Method for grinding the back sides of wafers
11/14/2002DE10121556A1 Verfahren zum Rückseitenschleifen von Wafern Process for back-surface grinding of wafers
11/13/2002CN1379446A Chemicomechanical grinding method combined with rotary coating
11/12/2002US6478659 Chemical mechanical polishing method for slurry free fixed abrasive pads
11/07/2002WO2002089238A2 Abraded fluid diffusion layer for an electrochemical fuel cell
11/07/2002WO2002089237A2 Method of making fluid diffusion layers and electrodes having reduced surface roughness
11/07/2002WO2002072311A3 Method for thinning and polishing the die of integrated circuits
11/07/2002WO2001089766A1 Method for grinding metallic workpieces containing, in particular, nickel
11/07/2002US20020164930 Apparatus for polishing periphery of device wafer and polishing method
11/07/2002CA2446001A1 Abraded fluid diffusion layer for an electrochemical fuel cell
11/07/2002CA2445996A1 Method of making fluid diffusion layers and electrodes having reduced surface roughness
11/07/2002CA2408434A1 Method for grinding metallic workpieces containing, in particular, nickel
11/06/2002EP1177070B1 Automatic smoothing and polishing system for plates and blocks made of marble, granite and stone in general
11/05/2002US6475068 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
11/05/2002US6475067 Dry method of concrete floor restoration
10/2002
10/31/2002US20020160702 Abrasive machine
10/31/2002US20020160698 Electro-chemical machining apparatus
10/31/2002US20020160691 Planarization apparatus and method
10/31/2002US20020160609 Reducing dishing and erosion during polishing and riding thin films on a substrate planarizing for isolation of trenches by using a first and second liquid containing an oxidizing agent, an organic acid, corrosion inhibitor and water
10/30/2002EP1252996A1 Supporting and positioning device for the working of hard materials
10/30/2002EP1252974A2 Abrasive plate holder
10/29/2002US6471570 End surface polishing machine
10/24/2002DE10211342A1 Polishing tool used for polishing semiconductor wafers comprises a support and/or support part and a polishing material made from a felt containing abrasive grains and/or grinding grains
10/22/2002US6468141 Drywall sander
10/17/2002DE10215960A1 Production of semiconductor wafers comprises separating a semiconductor single crystal into wafers, lapping the front and rear sides of the wafers, etching, finely grinding at least the front sides of the wafers, and polishing the wafers
10/16/2002EP1089851B1 Wafer edge polishing method and apparatus
10/16/2002CN2517109Y Locating ring for chip polishing
10/15/2002US6465328 Semiconductor wafer manufacturing method
10/10/2002WO2002080639A1 Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board, and metal sheet for producing wiring board
10/10/2002WO2001085392A3 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication
10/10/2002US20020146969 CD refacing system
10/10/2002US20020146968 Thrustwall polishing assembly
10/09/2002EP1247617A1 Disk for grinding concrete
10/09/2002EP1247615A2 Machining device to process the edges of cutting tools
10/09/2002EP1064120B1 Method for machining plane surfaces of a disk brake for motor vehicles
10/09/2002EP0898504B1 Abrasive body
10/03/2002US20020142601 Method for planarizing a surface of a semiconductor wafer with a fixed abrasive material
10/01/2002US6458444 Ceramic substrate and polishing method thereof
10/01/2002US6458019 Method of manufacturing magnetic head
10/01/2002US6458018 Abrasive article suitable for abrading glass and glass ceramic workpieces
10/01/2002US6457932 Automated barrel panel transfer and processing system
09/2002
09/26/2002WO2000038882A3 Wide-wheel grinding machine
09/26/2002EP1144156A3 Wide-wheel grinding machine
09/25/2002CN2512549Y Up-ward swinging spring end grinder
09/24/2002US6454866 Wafer support system
09/24/2002US6454632 Using a silicon based compound so that the sheen appearance remains for a longer time
09/19/2002WO2002072311A2 Method for thinning and polishing the die of integrated circuits
09/19/2002US20020132571 Method of manufacturing magnetic head
09/19/2002US20020132564 Method and apparatus for removing coatings applied to surfaces of a substrate
09/17/2002US6450868 Carrier head with multi-part flexible membrane
09/12/2002WO2002070199A1 Device for polishing optical disk
09/12/2002WO2002070196A1 Method and apparatus for machining joint face of work
09/12/2002WO2002070194A1 Reel-to-reel substrate tape polishing system
09/12/2002US20020127861 Novel sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
09/11/2002EP1238756A1 Chemical mechanical polishing with multiple polishing pads
09/11/2002CN2510232Y Plane-surface air-gap grinding machine
09/10/2002US6447386 Presser roll for surface planner
09/10/2002US6447382 Apparatus for removing semiconductor wafers from within the runner disks of a double-sided polishing machine
09/05/2002US20020121427 Belt conveyor for feeding sheets of glass on a grinding machine, and grinding machine comprising such a conveyor
09/03/2002US6443818 Grinding machine
09/03/2002US6443817 Method of finishing a silicon part
08/2002
08/29/2002WO2000011455A9 Digital radiographic weld inspection system
08/29/2002US20020118488 Magnetic recording medium and method of smoothing surface of magnetic recording medium
08/27/2002US6440855 Method of processing surface of workpiece and method of forming semiconductor thin layer
08/22/2002US20020115397 System and method for CMP head having multi-pressure annular zone subcarrier material removal control
08/22/2002US20020115396 Tool for the removal of paint-like materials from work surfaces
08/22/2002US20020115383 Method of removing coating film
08/20/2002US6435953 Coin cleaning apparatus
08/20/2002US6435945 Chemical mechanical polishing with multiple polishing pads
08/20/2002US6434784 Portable dust collection system for collection of wood floor sanding dust
08/15/2002WO2002062716A1 Edge treatments for coated substrates
08/15/2002WO2002062715A1 Method and apparatus for removing coatings applied to surfaces of a substrate
08/15/2002WO2002062524A1 Arrangement in a mobile machine for screeding floor surfaces
08/15/2002CA2404482A1 Method and apparatus for removing coatings applied to surfaces of a substrate
08/14/2002EP1231023A2 Head for smoothing and polishing stones, with oscillating shoe-holders fixed to the respective drive shafts
08/14/2002EP1231022A2 Apparatus for polishing and conveying products
08/13/2002US6431964 Planarization apparatus and method
08/13/2002US6431960 Fixed abrasive polishing pad
08/13/2002US6431952 Apparatus and methods for substantial planarization of solder bumps
08/13/2002US6431949 Planarization apparatus
08/07/2002EP1109482A4 A mobile surfacing machine
08/06/2002US6428402 Glass machining apparatus
08/06/2002US6428397 Wafer edge polishing method and apparatus
08/06/2002US6428393 Method of providing semiconductor wafers each having a plurality of bumps exposed from its resin coating
08/06/2002US6428390 Method and apparatus for edge finishing glass sheets
08/06/2002US6428385 Grinding machine for grinding bar member for magnetic head and method of grinding the same
08/01/2002US20020102931 Work holding member for mechanical abrasion, abrading method, and abrading machine
08/01/2002US20020102921 Fixed abrasive polishing pad
08/01/2002US20020102920 Eccentric abrasive wheel for wafer processing
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