| Patents for B24B 7 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor (8,400) |
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| 03/12/2002 | US6354929 Abrasive article and method of grinding glass |
| 03/12/2002 | CA2356495A1 Presser roll for surface planer |
| 03/11/2002 | CA2357153A1 Glass machining apparatus |
| 03/07/2002 | US20020028628 Machining center and method of changing tools thereof |
| 03/07/2002 | US20020027398 Method for manufacturing thin plate, piezoelectric plate, and piezoelectric vibrator |
| 03/07/2002 | DE10132433A1 Semiconductor wafer treatment method, involves removing deposits from periphery and rear-face of semiconductor wafer during each optional step in treatment processes |
| 03/06/2002 | EP1184480A2 Polishing of press plates coated with titanium diboride |
| 03/06/2002 | EP1184134A2 Machining center with dressing tool |
| 03/06/2002 | CN1338728A Manufacture of glass substrate as magnetic recording media |
| 03/01/2002 | CA2354790A1 Polishing of press plates coated with titanium diboride |
| 02/28/2002 | US20020025763 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate |
| 02/28/2002 | US20020025760 Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate |
| 02/28/2002 | US20020025759 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material |
| 02/28/2002 | US20020025409 Method of polishing a ceramic substrate |
| 02/28/2002 | US20020023340 Method of separating a plate-like workpiece adsorption-held on an elastic adsorption pad |
| 02/26/2002 | US6350187 Abrasive machine |
| 02/21/2002 | DE10055965C1 Workpiece transport device for double-sided grinding machine involves two pivot arms for moving flat workpieces in machine work area with rotatingly driven workpiece accommodation located on arms |
| 02/14/2002 | US20020019199 Abrasive article suitable for abrading glass and glass ceramic workpieces |
| 02/13/2002 | EP1178871A1 Border planing machine for wood floors |
| 02/13/2002 | EP1107838A4 Computer vision-based rotor machining system apparatus and method |
| 02/13/2002 | CN1335799A A polishing machine and method |
| 02/07/2002 | DE10035977A1 Verfahren und Vorrichtung zur Bearbeitung von Werkstück-Oberflächen Method and apparatus for machining workpiece surfaces |
| 02/07/2002 | DE10035637A1 Verfahren und Vorrichtung zum Behandeln einer Oberfläche von Betonbauteilen Method and apparatus for treating a surface of concrete parts |
| 02/06/2002 | EP1177070A1 Automatic smoothing and polishing system for plates and blocks made of marble, granite and stone in general |
| 02/06/2002 | EP0981419B1 Grinding or like machine tool |
| 02/05/2002 | US6343980 Flattening machine |
| 01/31/2002 | US20020011079 Process for producing glass substrate for information recording media, the glass substrate, and information recording device |
| 01/30/2002 | EP1175961A2 Method and apparatus for machining workpiece surfaces |
| 01/30/2002 | EP1175279A1 Method for grinding glass |
| 01/30/2002 | CN1333557A Weft cleaner |
| 01/30/2002 | CN1078518C Method of producing semiconductor wafers |
| 01/30/2002 | CN1078517C Double face abrading machine |
| 01/29/2002 | US6343183 Wafer support system |
| 01/24/2002 | US20020009961 Floor accessory driver |
| 01/24/2002 | US20020009957 Coin cleaning apparatus |
| 01/24/2002 | US20020009886 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates |
| 01/24/2002 | DE10134169A1 Thickness measuring device for semiconductor wafer determines thickness of workpiece from distance between specified points at which laser beam reflected from top and bottom surface of workpiece fall on imaging unit |
| 01/23/2002 | EP1174400A1 Porous silicon carbide sintered compact and silicon carbide metal composite suitable for use in table for wafer polishing machine |
| 01/23/2002 | EP1174054A1 Method and apparatus for smoothing and reducing the hygroscopicity of the surface of a concrete construction element |
| 01/23/2002 | EP1173307A2 Abrasive article suitable for abrading glass and glass ceramic workpieces |
| 01/23/2002 | EP1173306A1 Method for grinding glass |
| 01/17/2002 | WO2002004170A1 Method and device for finishing surface of long material |
| 01/17/2002 | US20020005958 Non-contact thickness-measuring device |
| 01/17/2002 | US20020005161 Processing machine and protective member used therein |
| 01/16/2002 | EP1172172A2 Processing machine and protective member used therein |
| 01/16/2002 | EP1171262A1 Device for flat deburring by brushing |
| 01/16/2002 | EP1062073B1 A machine for grinding semi-finished products, particularly billets |
| 01/16/2002 | EP1034064B1 Improved grinding machine |
| 01/16/2002 | CN2471470Y Plane grinding machine |
| 01/15/2002 | US6338672 Dressing wheel system |
| 01/10/2002 | WO2002002272A1 Oscillating fixed abrasive cmp system and methods for implementing the same |
| 01/10/2002 | WO1999053528A3 Surface treatment process and system |
| 01/10/2002 | US20020004359 Semiconductor wafer grinding Method |
| 01/10/2002 | US20020004358 Cluster tool systems and methods to eliminate wafer waviness during grinding |
| 01/10/2002 | US20020004355 Method of and apparatus for removing a film layer on a glass plate and glass-plate working apparatus having the apparatus |
| 01/09/2002 | EP1170088A2 Semiconductor wafer grinding method and machine |
| 01/09/2002 | CN2470953Y Suction disc of silicon-chip polishing machine head |
| 01/09/2002 | CN1330797A Method of processing semiconductor wafers to build in back surfact demage |
| 01/08/2002 | US6336855 Grindstone for ELID grinding and apparatus for ELID surface grinding |
| 01/08/2002 | US6336852 Roll with surface coating |
| 01/03/2002 | DE10028791A1 Grinding machine for operating a grinding head sliding on a portal has a machine bed, a workpiece carrier and two props on each side of the workpiece carrier interconnecting via a lateral tie-bar to form a portal to overlap the carrier. |
| 01/02/2002 | EP1167312A1 Method of and appliance for removing a film layer on a glass plate and glass-plate working unit comprising a station equipped with this appliance |
| 01/02/2002 | EP1167187A1 Surface quality enhancement of aerospace skin sheet |
| 12/27/2001 | US20010055938 Method for the production of glass substrates for magnetic recording mediums |
| 12/27/2001 | US20010054390 Wafer support system |
| 12/27/2001 | US20010054210 Substrate cleaning apparatus |
| 12/25/2001 | US6332833 Method for fabricating silicon semiconductor discrete wafer |
| 12/20/2001 | US20010053661 Apparatus and method for ELID grinding a large-diameter workpiece to produce a mirror surface finish |
| 12/20/2001 | US20010053657 Apparatus and methods fo substantial planarization of solder bumps |
| 12/19/2001 | CN1076247C Method and apparatus for grinding brittle materials |
| 12/13/2001 | WO2001094072A1 Apparatus and method for grinding/polishing a curved or flat wall element |
| 12/13/2001 | US20010051494 Method of cleaning glass |
| 12/13/2001 | DE10027707A1 Device for forming images of plate-shaped semifinished articles has digital acquisition device and device for electronic propagation of digital images of semifinished product |
| 12/12/2001 | CN2464502Y 磨砖机 Brick mill |
| 12/06/2001 | US20010049256 Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same |
| 12/04/2001 | US6324824 Method and machine for stranding two conductors |
| 11/29/2001 | US20010046832 Apparatus and methods for substantial planarization of solder bumps |
| 11/29/2001 | DE10025173A1 Verfahren zum Schleifen von insbesondere Nickel enthaltenden metallischen Werkstücken Method for grinding of particular nickel-containing metal workpieces |
| 11/27/2001 | US6322428 Working device and working method for magnet member |
| 11/22/2001 | WO2001088970A1 Semiconductor wafer thinning method, and thin semiconductor wafer |
| 11/22/2001 | WO2001087540A1 Floor-treating machine |
| 11/22/2001 | US20010044271 Fixed abrasive polishing pad |
| 11/22/2001 | US20010044266 Polishing apparatus |
| 11/22/2001 | US20010044263 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
| 11/22/2001 | US20010044262 Apparatus and methods for substantial planarization of solder bumps |
| 11/22/2001 | CA2409739A1 Floor-treating machine |
| 11/21/2001 | EP1155784A1 Storage case for a rotary tool including a cutting blade and cutting apparatus using it |
| 11/21/2001 | EP1155778A2 Polishing apparatus |
| 11/21/2001 | EP1154877A2 A polishing machine and method |
| 11/21/2001 | CN2459907Y Processing machine for stick of ice-cream stick |
| 11/20/2001 | US6320269 Method for preparing a semiconductor wafer to receive a protective tape |
| 11/20/2001 | US6319108 Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece |
| 11/15/2001 | WO2001085392A2 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication |
| 11/15/2001 | US20010041518 Apparatus and methods for substantial planarization of solder bumps |
| 11/15/2001 | US20010041516 Apparatus and methods for substantial planarization of solder bumps |
| 11/15/2001 | US20010041515 Apparatus and methods for substantial planarization of solder bumps |
| 11/15/2001 | US20010041510 Grinding method, electronic component, and variable capacitor |
| 11/15/2001 | US20010041506 Apparatus and methods for substantial planarization of solder bumps |
| 11/15/2001 | US20010041505 Apparatus and methods for substantial planarization of solder bumps |
| 11/15/2001 | US20010041504 Apparatus and methods for substantial planarization of solder bumps |