Patents
Patents for B24B 7 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor (8,400)
01/2006
01/04/2006EP1530509B1 Grinding machine and method for grinding a workpiece
01/03/2006US6981908 Ferrule polishing control machine, ferrule polishing method, and ferrule polishing computer program
12/2005
12/29/2005US20050287937 Pole sander
12/29/2005US20050287935 Reciprocating and deflecting swing device for the roller of a cylindrical emery-polishing machine
12/28/2005EP1107838B1 Computer vision-based rotor machining system apparatus and method
12/28/2005CN1713966A Platen assembly having a topographically altered platen surface
12/28/2005CA2488069A1 Pole sander
12/27/2005US6979641 Methods of forming a conductive contact through a dielectric
12/22/2005WO2005120776A1 Material removal monitor
12/22/2005US20050282322 Retaining ring with conductive portion
12/22/2005US20050279219 Coffee grinder assembly for a coffee machine
12/22/2005DE10361767B4 Verfahren und Vorrichtung zur mechanischen Bearbeitung von parallelen Stirnflächen an kleinteiligen Werkstücken Method and apparatus for mechanical processing of parallel faces of small-scale workpieces
12/15/2005WO2005118111A1 Method and device for emptying and cleaning a filter arrangement for collection of particles
12/15/2005WO2005117665A1 Modular granite countertop
12/15/2005US20050277374 Dust containment device for surfacing machines
12/15/2005DE102005024199A1 Wafer grinding method for manufacture of integrated circuit, involves interposing shock absorbing material between wheel mounting and wheel base of grinding stone
12/15/2005DE102004013470B3 Pre-cast concrete block post-processing method, involves subjecting tool support having tool, on stone surface of concrete blocks, with even surface pressure corresponding to output of electro-motor, by electro-pneumatic control system
12/14/2005EP1429647B1 Method for sanitation of covered floors and cleaning pad
12/13/2005US6974369 Grinding water tank unit for eyeglass lens processing and eyeglass lens processing apparatus having the same
12/13/2005US6974366 Garment image abrasion system and method
12/07/2005CN2744462Y Three-end multi-purpose ground surface milling machine
12/06/2005US6971949 Sharpening guide for dental tools
12/06/2005US6971948 Method and apparatus for removing coatings applied to surfaces of a substrate
12/06/2005US6971137 Floor maintenance machine with air-cooled motor
12/01/2005WO2005113198A2 Abrasive cleaning device
12/01/2005WO2004085114A8 Rotary work tool with orbiting planetary gears containing eccentric axes for the attachment of polishing or sanding platens
12/01/2005US20050266784 Floor sanding vacuum
12/01/2005US20050262788 Modular granite countertop
12/01/2005DE102004054567A1 Process for simultaneous two sided removal of material from semiconductor wafers has wafer between rotary working discs and direction reversal at reduced force
11/2005
11/30/2005EP1599313A1 Method of machining a brake disc
11/29/2005US6969302 Semiconductor wafer grinding method
11/29/2005US6969300 Automated processing unit for a working station
11/24/2005WO2005110677A1 Machine for finishing an object such as a profiled element, a panel, or suchlike
11/24/2005US20050260941 Bristle brush for concrete sanding
11/24/2005US20050260940 Abrasive cleaning device
11/24/2005US20050258139 Polishing method to reduce dishing of tungsten on a dielectric
11/22/2005US6966826 Grinding wheel
11/22/2005US6966825 Wall/roof polisher
11/22/2005US6966817 Wafer grinder
11/17/2005US20050255803 Precision abrasive finishing apparatus
11/17/2005US20050255799 Grinding machine and method for grinding a workpiece
11/16/2005EP1595643A2 Apparatus for grinding a disc-shaped element
11/15/2005USRE38878 Polishing apparatus
11/15/2005US6964099 Gardening shears having two pruning effects
11/10/2005US20050250422 Method and apparatus for grinding of concrete floors
11/10/2005DE202005011659U1 Grinding unit comprises a changeable glide ring which is mounted on the edge of the grinding disk hood, and is adjustable so that its front edge and the front face of the grinding disk are level with one another
11/10/2005DE102005013862A1 Scheibe für ein stufenlos variables Toroidgetriebe und ein Verfahren zu deren Bearbeitung Pulley for a continuously variable toroidal transmission and a method for their processing
11/09/2005CN2738942Y Plate of stone-surface renewing machine
11/09/2005CN2738941Y Plate of stone-surface renewing machine
11/03/2005US20050245177 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
11/03/2005US20050241262 Method and device for the production of a precise concrete prefabricated part
11/03/2005DE102004017452A1 Laminar and abrasive machining device for e.g. crystalline silicon wafer, has supporting device with surface bearing and bearing supports supporting rear side of work disk which is pressed against carrier`s front with work piece
11/02/2005EP1286807B1 Apparatus for grinding/polishing a curved or flat wall element
10/2005
10/27/2005US20050239383 Hand tool support
10/27/2005DE102005014539A1 Waferverarbeitungsverfahren Wafer processing method
10/26/2005EP1588799A1 Grinding machine for spiral springs
10/26/2005EP1031166B1 Method and apparatus for chemical mechanical polishing
10/26/2005CN2736103Y Plane grinding machine
10/26/2005CN1688411A Methods and apparatus for electromechanically and/or electrochemically removing conductive material from a microelectronic substrate
10/26/2005CN1688410A Grinding machine and method for grinding a workpiece
10/26/2005CN1225019C Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishing
10/25/2005US6958298 Method for thinning wafer by grinding
10/25/2005US6958256 Process for the back-surface grinding of wafers
10/25/2005US6957997 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
10/20/2005US20050233683 Machining apparatus and machining method of work end face, roller and roller bearing
10/20/2005US20050232727 Work-piece processing system
10/20/2005US20050229369 Systems including differential pressure application apparatus
10/19/2005CN1684798A Polishing pad with window for planarization
10/19/2005CN1684795A Glass pane machining device
10/19/2005CN1683136A Process for processing stone surface and its equipment
10/13/2005WO2005095054A1 Wafer clamping device for a double side grinder
10/13/2005WO2005018873A3 Versatile manual scissor sharpener
10/13/2005US20050227597 Mobile pavement marking removal apparatus
10/13/2005US20050227591 Processing tool, method of producing processing tool, processing method and processing apparatus
10/13/2005US20050223972 Apparatus and method for painting objects such as profiles, panels or suchlike
10/12/2005CN1680076A Processing method and apparatus for media surface of hard disk in dynamic electronic measurement
10/11/2005US6953393 Apparatus for removing burrs from a compact disc
10/11/2005US6953387 Method and apparatus for measuring flow rate through and polishing a workpiece orifice
10/06/2005US20050221722 Wafer grinding using an adhesive gel material
10/06/2005US20050221584 Wafer processing method
10/06/2005DE202005011429U1 Machine tool in particular for grinding and polishing natural stone, comprising tool working with computer adjusted pressure
10/05/2005CN1677623A Wafer processing method
10/04/2005US6951800 Method of making semiconductor device that has improved structural strength
10/04/2005US6951507 Substrate polishing apparatus
10/04/2005US6951506 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
10/04/2005US6951500 Workpiece-surface processing head
09/2005
09/29/2005US20050215184 Disk for toroidal continuously variable transmission and method of machining the same
09/29/2005US20050211673 Amorphous material processing method
09/29/2005DE102004011996A1 Vorrichtung zum simultanen beidseitigen Schleifen von scheibenförmigen Werkstücken Apparatus for simultaneous double-side grinding of disk-shaped workpieces
09/29/2005DE102004011994A1 Semiconductor wafer manufacturing method for fabricating electronic components, involves polishing front and rear sides of wafer in two phases, where wafer material is removed up to five micrometer during one phase in short time
09/28/2005EP1580801A1 Method and apparatus for grinding of concrete floors
09/28/2005CN2729413Y Bearing device of coarse-grinding head
09/28/2005CN1675745A Method for fabricating semiconductor wafer
09/28/2005CN1673306A Polishing composition
09/28/2005CN1673137A Integrated glasses lens cutting and polishing machine
09/22/2005WO2005087470A1 Facing machine for large plates of natural stone, like granite and hard stones
09/22/2005WO2005050895A3 A method of backgrinding wafers while leaving backgrinding tape on a chuck
09/22/2005US20050208883 Polishing composition
09/22/2005US20050208745 Methods of forming a conductive contact through a dielectric
09/22/2005DE202005010997U1 Through-passage grinding machine for grinding flat workpiece surface has at least one plate grinder offset from center of its spindle
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