Patents
Patents for B24B 7 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor (8,400)
07/2002
07/31/2002CN1088420C Double-side grinding apparatus for thin-plate round-disk shape workpiece
07/30/2002US6425815 Fixed abrasive polishing pad
07/30/2002US6425813 Rotary floor sander
07/23/2002US6422923 Apparatus and methods for substantial planarization of solder bumps
07/23/2002US6422919 Apparatus and methods for substantial planarization of solder bumps
07/18/2002WO2002032625A3 Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate
07/18/2002US20020094767 Carrier head with multi-part flexible membrane
07/18/2002US20020093086 Semiconductor wafer backside grinding apparatus and method
07/17/2002EP0963459B1 Wafer support apparatus
07/17/2002CN1359322A Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
07/16/2002US6419568 Fixed abrasive polishing pad
07/16/2002US6419565 Rotary floor finisher for use with a power rider trailer
07/16/2002US6419564 Grinding device and method
07/16/2002US6419550 Apparatus and methods for substantial planarization of solder bumps
07/11/2002WO2002054471A1 Apparatus and method for abrading semiconductor wafer
07/11/2002WO2002053490A2 Method of making optical fluoride laser crystal components
07/10/2002CN2499171Y Pole type snagging machine
07/10/2002CN2499170Y Suction disc guide rail type grinder for wall, floor and smooth stone
07/10/2002CN1087493C Process for polishing semiconductor substrate
07/09/2002US6416399 Apparatus and methods for substantial planarization of solder bumps
07/09/2002US6416398 Apparatus and methods for substantial planarization of solder bumps
07/09/2002US6416397 Apparatus and methods for substantial planarization of solder bumps
07/09/2002US6416395 Apparatus and methods for substantial planarization of solder bumps
07/09/2002US6416388 Apparatus and methods for substantial planarization of solder bumps
07/09/2002US6416387 Apparatus and methods for substantial planarization of solder bumps
07/09/2002US6416386 Apparatus and methods for substantial planarization of solder bumps
07/09/2002US6416382 Bilateral automatic machine for edge-machining plates of glass, stone-like materials and the like
07/04/2002US20020086625 Vacuum mount wafer polishing methods and apparatus
07/04/2002DE10162945A1 Schleifmaschine Grinding machine
07/03/2002EP1218143A1 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
06/2002
06/27/2002US20020081954 Grinding machine
06/26/2002EP1216792A2 Belt conveyor for feeding sheets of glass on a grinding machine, and grinding machine comprising such a conveyor
06/25/2002US6409586 Fixed abrasive polishing pad
06/20/2002US20020075788 Method for reducing vibration of motor having carrier interface
06/20/2002US20020073503 Portable dust collection system for collection of wood floor sanding dust
06/18/2002US6406357 Grinding method, semiconductor device and method of manufacturing semiconductor device
06/13/2002WO2001082356A3 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
06/13/2002US20020072307 Apparatus and method for chemical mechanical planarization using a fixed-abrasive polishing pad
06/13/2002US20020072238 Chemical mechanical polishing method for slurry free fixed abrasive pads
06/12/2002EP0948680B1 Grinding machine for removing markings from paved surfaces
06/11/2002US6402588 Polishing apparatus
06/06/2002US20020068515 Method and apparatus for machining workpiece surfaces
06/05/2002EP0879108B1 Ground cutting insert
06/05/2002CN2494248Y Chained automatic feed dual-end-face grinder
06/04/2002US6398892 Method of using pressure sensitive adhesive double coated sheet
06/04/2002US6398625 Apparatus and method of polishing with slurry delivery through a polishing pad
05/2002
05/30/2002US20020065026 IC handler and contact cleaning method
05/30/2002US20020065023 Multilayered CMP stop for flat planarization
05/29/2002EP1209251A2 Temperature control system for wafer
05/23/2002WO2002041392A2 Conductor chemical-mechanical polishing in integrated circuit interconnects
05/21/2002US6392329 Piezoelectric vibrating apparatus
05/16/2002US20020058464 Fixed abrasive polishing pad
05/16/2002US20020058463 Amorphous material processing method and glass substrate
05/16/2002DE10054304A1 Grinder and method of machining workpieces involve holders for workpieces, conveyor and grinding discs
05/14/2002US6387809 A small amount of single-side lapping is repeated alternately on the two surfaces of a semiconductor silicon single crystal wafer to get to a predetermined total lapping stock removal
05/14/2002US6386957 Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus
05/14/2002US6386946 Repair machine for compact disk
05/14/2002US6386334 Disc brake assembly
05/10/2002WO2001072472A3 Carrier head with a flexible membrane having parts made with different elastomers
05/08/2002EP1203638A1 Abrasive belt sleeve for sanding machines
05/08/2002EP1203635A1 Wooden article having particularly smooth surface and method for preparing thereof
05/08/2002CN1348404A Abrasive article suitable for abrading glass and glass ceramic workpieces
05/07/2002US6383290 Bowling lane dressing application mechanism
05/02/2002US20020052178 Adapter for grinding machine
05/02/2002US20020052169 Systems and methods to significantly reduce the grinding marks in surface grinding of semiconductor wafers
05/02/2002US20020052116 Free Floating double side polishing of substrates
05/02/2002EP1201358A2 A sanding machine
05/02/2002DE10062926A1 Machine for one sided surface machining by grinding, polishing or lapping at least one workpiece which has frame housing relevant machine tool using at least one workpiece holder
04/2002
04/30/2002US6380092 Gas phase planarization process for semiconductor wafers
04/25/2002WO2002032625A2 Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate
04/25/2002US20020049027 Fixed abrasive polishing pad
04/25/2002US20020049026 Method and apparatus for planarizing semiconductor device
04/25/2002DE10139086A1 Verfahren zum Trennen eines plattenartigen Werkstückes, welches durch Adsorption an einem elastischen Adsorptionskissen gehalten wird A method of separating a plate-like workpiece which is held by adsorption on a sorbent elastic
04/25/2002DE10051253A1 Machine to grind to size esp. bricks and brick molds has working stations with associated optical measuring devices on either side of brick conveyor to determine distance to bricks
04/24/2002EP1198529A2 Metal bond abrasive article comprising porous ceramic abrasive composites and method of using the same to abrade a workpiece
04/23/2002US6376381 Planarizing solutions, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
04/23/2002CA2083053C Method and machining apparatus for use especially in the sanding of items of wood in a sanding machine
04/18/2002US20020045404 Method of taking up wear of a grinding wheel on a machine for grinding sheets of glass, and grinding machine implementing such a method
04/18/2002US20020045348 Semiconductor wafer treating method and device for removing deposit on a semiconductor wafer
04/17/2002EP1197295A2 Method of taking up wear of a grinding wheel on a machine for grinding sheets of glass, and grinding machine implementing such a method
04/10/2002EP0713575B1 Equipement for the grinding of material samples
04/10/2002CN2485091Y Apparatus for grinding surfaces of square steel bars
04/04/2002DE10124739A1 Halbleiterwaferanordnung und Bearbeitungsvorrichtung mit Ansaugtischen zum Halten derselben Semiconductor wafer assembly and machining apparatus for holding the same Ansaugtischen
04/04/2002DE10053410C1 Polishing device for coated circuit board plate has polishing tool controlled depending on measured coating thickness at each position for providing uniform coating thickness
04/04/2002DE10046360A1 Machining process for light metal alloys involves mechanically fine machining surface and setting back softer light metal matrix through thermal rays
04/03/2002EP1193029A1 Method and device for grinding double sides of thin disk work
04/02/2002US6364755 Belt sander conversion system and method
04/02/2002US6364426 Vehicle wheel hub and bearing unit assembly and method for producing same
03/2002
03/28/2002WO2001083163A3 Method of polishing and cleaning glass
03/28/2002US20020037683 Abrasive article suitable for abrading glass and glass ceramic workpieces
03/28/2002US20020037682 Polishing or grinding method, processing method of optical element, processing method of fluorite, polishing or grinding apparatus, polishing and/or grinding apparatus for optical element, apparatus for processing surface of optical element, and lens
03/21/2002WO2002022308A1 Polishing sheet and method
03/20/2002EP1188515A2 Suction device for floor machining apparatus
03/20/2002CN1340404A Method for processing laminated article pressing plate
03/20/2002CN1081109C Method for maintenance of carrying film of chemical mechanical grinder and device for implementing the same
03/19/2002US6358851 Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
03/19/2002US6358117 Processing method for a wafer
03/19/2002US6357095 Hard disk burnishing head
03/14/2002US20020029448 Method for burnishing hard disks
03/13/2002EP1032487B1 Diamond roller for ceramics, having abrasive with sloped side
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