Patents
Patents for B24B 7 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor (8,400)
02/2007
02/06/2007US7172497 Fabrication of semiconductor interconnect structures
02/01/2007US20070026770 Abrasive agglomerate polishing method
02/01/2007US20070026769 Chemical mechanical polishing apparatus and a method for planarizing/polishing a surface
02/01/2007US20070023395 Production method for semiconductor wafer
01/2007
01/31/2007CN1905990A Double-end surface grinding machine
01/31/2007CN1905140A Image sensor package, optical glass therefor and processing method
01/31/2007CN1903540A Method for treatment of surface of stone
01/31/2007CN1903508A Portable and dust-sucking type wall surface electric abrasive finishing machine
01/30/2007US7169026 End face polishing apparatus
01/30/2007US7169025 Grinding tool for a grinder with rotary oscillating drive
01/30/2007US7169023 Method and apparatus for manufacturing hourglass worm rolling die
01/25/2007WO2007011289A1 Device for a grinding machine
01/25/2007US20070021042 Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method
01/25/2007US20070021041 Dressing method in vertical duplex-head surface grinding machine
01/25/2007US20070021040 Polishing composition and polishing method
01/25/2007US20070021038 Cmp apparatus and process sequence method
01/25/2007US20070021036 Apparatus and a method of polishing an optical surface; an optical component; and a method of manufacturing a polishing tool
01/24/2007CN2860733Y Ground bridge type stone muller
01/24/2007CN2860732Y Grinding wheel fixing chuck for steel rail polishing
01/24/2007CN2860731Y Novel polishing machine
01/24/2007CN1900012A Aritifical stone polished brick and its producing method
01/23/2007US7166017 Slurry for CMP, polishing method and method of manufacturing semiconductor device
01/23/2007US7166016 Six headed carousel
01/23/2007US7166015 Apparatus and method for controlling fluid material composition on a polishing pad
01/23/2007US7166014 Chemical mechanical planarization process control utilizing in-situ conditioning process
01/18/2007WO2006071651A3 Spectral imaging of substrates
01/18/2007US20070015444 Smoothing pad for bare semiconductor wafers
01/18/2007US20070015443 Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor
01/18/2007US20070015442 Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film
01/18/2007US20070015441 Apparatus and Method for In-Situ Endpoint Detection for Chemical Mechanical Polishing Operations
01/18/2007DE19882111B4 Verwendung einer Vorrichtung zur Herstellung eines reproduzierbaren Oberflächenfinish einer Testoberfläche Use of a device for producing a reproducible surface finishing of a test surface
01/17/2007EP1743738A1 Adjustment of the working pressure for a machine tool
01/17/2007EP1743737A1 Flow path sanding machine for processing a plane workpiece surface
01/17/2007CN1295293C Grinding liquid compsns
01/16/2007US7163446 Vehicle headlight restoration
01/16/2007US7163444 Pad constructions for chemical mechanical planarization applications
01/16/2007US7163442 Method of making micro titer plates and micro titer plates made thereby
01/16/2007US7163441 Semiconductor wafer grinder
01/16/2007US7163438 Zone polishing using variable slurry solid content
01/16/2007US7163437 System with sealed polishing pad
01/16/2007US7162771 Floor cleaning machine with dust control apparatus and associate method of use
01/11/2007US20070010178 Continuous grinding machine for machining a level workpiece surface
01/11/2007US20070010176 Fixed abrasive pad having different real contact areas and fabrication method thereof
01/11/2007US20070010175 Polishing pad and method of producing same
01/11/2007US20070010169 Polishing pad with window for planarization
01/10/2007CN2855637Y Device for grinding snake-like spring forging stocks
01/10/2007CN1894073A Dressing method in vertical duplex-head surface grinding machine
01/10/2007CN1294629C Silicon semiconductor crystal wafers and manufacturing method for multiple semiconductor crystal wafers
01/09/2007US7160180 Substrate delivery mechanism
01/09/2007US7160176 Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
01/09/2007US7160175 Attitude control device and precision machining apparatus
01/09/2007US7160173 Abrasive articles and methods for the manufacture and use of same
01/04/2007US20070004322 Polishing composition and polishing method
01/04/2007US20070004316 Integrated system for processing semiconductor wafers
01/03/2007CN1890055A Chemical mechanical polishing method for reducing slurry reflux
01/02/2007US7156726 Polishing apparatus and method for forming an integrated circuit
01/02/2007US7156723 Method and apparatus for non-interrupted grinding of railroad crossing and main line track
01/02/2007CA2418180C Apparatus for refurbishing belts
12/2006
12/27/2006EP1735822A2 Work-piece processing system
12/27/2006EP1735127A1 Wafer clamping device for a double side grinder
12/26/2006US7153410 Alternating current, direct current power sources; switches
12/26/2006US7153195 Methods and apparatus for selectively removing conductive material from a microelectronic substrate
12/26/2006US7153191 Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
12/26/2006US7153187 Metal machining apparatus and laser-targeted coolant nozzle employed therewith
12/21/2006WO2006053138A3 Chamfering tool and method
12/21/2006US20060286908 Grinding wheel spindle
12/21/2006US20060286907 Grinder wheel for liquid crystal display device and method of fabricating liquid crystal display device using the same
12/21/2006US20060286906 Polishing pad comprising magnetically sensitive particles and method for the use thereof
12/21/2006US20060286902 Eyeglass component engraving device
12/21/2006DE102005062508A1 Grinder wheel for liquid crystal display, including double grinding surface to improve grinding quality, and grinding method using the same
12/20/2006EP1395144B1 Devices and methods for end-rounding bristles
12/20/2006CN2848466Y Grinding machine for stone material
12/20/2006CN1883044A Semiconductor surface protecting sheet and method
12/20/2006CN1291427C Method for producing sintered rare-earth magnetic alloy thin sheet and thin sheet surface polishing machine
12/19/2006US7150674 Both-side grinding method and both-side grinding machine for thin disc work
12/19/2006US7150672 Cup attaching apparatus
12/14/2006WO2006081286A3 Multi-layer polishing pad for low-pressure polishing
12/14/2006US20060281393 Chemical mechanical polishing tool, apparatus and method
12/14/2006US20060280930 Polishing pad and method of producing the same
12/14/2006US20060280929 Polishing pad and method of producing the same
12/13/2006EP1731551A1 Method of changing the surface wettability of polymer materials
12/13/2006CN2846022Y Split CBN grinding apparatus
12/13/2006CN2846020Y Dust and fog proof device and glass polisher with dust and fog proof device
12/13/2006CN2846007Y Grinder
12/13/2006CN1289274C Surface processing machine for hard-fired ceramic tiles
12/12/2006US7147548 Grinding and cutting head
12/12/2006US7147547 Method and device for grinding a rotationally symmetric machine part
12/12/2006US7147544 Glass-ceramics
12/12/2006US7147543 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
12/07/2006US20060276109 Customized polishing pads for CMP and methods of fabrication and use thereof
12/07/2006US20060276108 Methods and materials for making a monolithic porous pad cast onto a rotatable base
12/07/2006DE19626396B4 Verfahren und Vorrichtung zur Herstellung und zum Schleifen von Siliziumscheiben Method and apparatus for the production and grinding of silicon wafers
12/07/2006DE102005034119B3 Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection
12/06/2006EP1628802B1 Floor sanding machine
12/06/2006CN2843744Y Improved transmissioner of sand-band grinder
12/06/2006CN2843743Y Conical grinding machine with four-spindles and double-end faces
12/06/2006CN1873925A Chemical machanical grinding method, and equipment for preventing rudimental grinding pulp
12/05/2006US7144307 Point superabrasive machining of nickel alloys
12/05/2006US7144301 Method and system for planarizing integrated circuit material
11/2006
11/30/2006US20060270322 Smart conditioner rinse station
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