Patents for B24B 41 - Component parts of grinding machines or devices, such as frames, beds, carriages or headstocks (11,542)
02/2001
02/28/2001EP1077789A1 Substrate retainer
02/28/2001EP0885088B1 Process and machine tool for machining workpieces with two work spindles
02/27/2001US6193591 Loading system and collect assembly for grinding a workpiece
02/27/2001US6193586 Method and apparatus for grinding wafers using a grind chuck having high elastic modulus
02/22/2001WO2001012385A1 Workpiece carrier with segmented and floating retaining elements
02/20/2001US6190242 Universal grinding machine
02/20/2001US6189225 Angle gauge for grinding sharp-edged tools
02/15/2001WO2001010597A1 Grinding machines
02/15/2001WO1999048645A8 Backing pad for workpiece carrier
02/14/2001EP1075896A2 Apparatus and method of grinding a semiconductor wafer surface
02/14/2001EP1075351A1 Apparatus and method for chemical-mechanical polishing (cmp) using a head having direct pneumatic wafer polishing pressure system
02/13/2001US6186880 Recyclable retaining ring assembly for a chemical mechanical polishing apparatus
02/13/2001US6186877 Multi-wafer polishing tool
02/13/2001US6186867 Method for manufacturing precisely shaped parts
02/01/2001WO2000069595A3 Method and apparatus for automatically adjusting the contour of a wafer carrier surface
02/01/2001DE19935902A1 Holding-down device for workpieces on fine-finishing machines has self-clamping body on clamping device releasable by extension drive which moves holding down member up and down
01/2001
01/31/2001CN2416998Y Complete set of spindle and basic frame of angle adjustable grinding machine
01/30/2001US6179698 Self-aligning tool for hands-free cross-sectioning of an integrated circuit
01/30/2001US6179695 Chemical mechanical polishing apparatus and method
01/30/2001US6179690 Substrate polishing apparatus
01/25/2001WO2000054933A3 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
01/25/2001DE10023034A1 Conveyor for spherical body e.g. ball-shaped semiconductor, includes carrier to transport spherical body into spherical body storage, and sending unit to discharge spherical body from storage
01/24/2001EP1070566A2 Tool for engraving, particularly on glass plates and the like
01/24/2001EP1069971A1 Installation for forming the edges of spectacle glasses
01/23/2001US6176767 Double face abrading machine
01/23/2001US6176764 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks
01/17/2001EP1068047A1 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
01/17/2001CN2414879Y Grinding head rotating device for electric abrasive finishing machine
01/17/2001CN1280530A Improved grinding machine
01/17/2001CN1060710C Composite discharging-mechanical grinding method for external circle of sheet workpiece
01/16/2001US6174221 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
01/10/2001EP1066924A2 Carrier head with a flexible membrane and an edge load ring
01/10/2001EP1066923A2 Carrier head with a modified flexible membrane
01/10/2001EP1066922A2 Carrier head with pressurizable bladder
01/10/2001CN2413851Y Grinding head for burnshing
01/10/2001CN2413850Y Grinding hand for edging
01/10/2001CN1279142A Method and apparatus for sizing edges of sheet materials
01/03/2001EP1065030A2 Determining when to replace a retaining ring used in substrate polishing operations
01/03/2001EP1064120A1 Method for machining plane surfaces of a disk brake for motor vehicles
01/03/2001CN1278471A Double-side-edge processing machine for processing edges of glass or stone plate materials
01/02/2001US6168506 Apparatus for polishing using improved plate supports
01/02/2001US6168504 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
12/2000
12/27/2000EP1063054A2 Bilateral edge-type machine for edge-machining glass or stone-like plate materials and the like
12/26/2000US6165058 Carrier head for chemical mechanical polishing
12/26/2000US6165054 Double side grinding apparatus and double side polishing apparatus
12/21/2000WO2000076723A1 Table of wafer polisher, method of polishing wafer, and method of manufacturing semiconductor wafer
12/20/2000EP1061558A2 Edge contact loadcup
12/20/2000EP1060836A2 Wafer tranfer station for a chemical mechanical polisher
12/20/2000CN1277572A Manufacturing a memory disk or semiconductor device using an abrasive polishing system, and polishing pad
12/13/2000EP1059142A2 Carrier head to apply pressure to and retain a substrate
12/13/2000CN2410077Y Universal grinding head for grinder
12/12/2000US6159084 Electrical hand-power tool, in particular hand grinder
12/12/2000US6159083 Polishing head for a chemical mechanical polishing apparatus
12/12/2000US6159080 Chemical mechanical polishing with a small polishing pad
12/12/2000US6159079 Carrier head for chemical mechanical polishing a substrate
12/12/2000US6159072 Lens transport apparatus, a cup for securing an eyeglass lens during transport, and a method of transporting lenses
12/06/2000EP1057587A2 Machine for working sheets of glass and similar
12/06/2000EP1056567A1 Rotary mower blade grinding
12/06/2000CN2409010Y Non-guideway end face grinder
12/05/2000US6156124 Wafer transfer station for a chemical mechanical polisher
11/2000
11/30/2000DE19924220A1 Holder for substrate plates accommodates loosening tools and covers delivery cage to form closed inner chamber, and substrate plates are covered by loosening tools fitted with contact pads
11/29/2000CN1274949A System for transfering polishing liquid when semiconductor wafer is chemimechanical polished
11/28/2000US6153536 Method for mounting wafer frame at back side grinding (BSG) tool
11/28/2000US6152807 Lapping and polishing fixture having flexible sides
11/23/2000WO2000069597A1 Method and device for polishing double sides
11/23/2000WO2000069595A2 Method and apparatus for automatically adjusting the contour of a wafer carrier surface
11/23/2000WO2000030807A3 A carrier head with edge control for chemical mechanical polishing
11/23/2000DE19914588C1 Deburring machine with axial adjustment of grinding disc via setting device for compensating grinding disc wear
11/22/2000EP1053830A2 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
11/22/2000EP1053827A2 Belt sander with orbitally translated abrasive belt
11/21/2000US6149503 Method and apparatus for supporting a crankshaft in a grinding machine for grinding the crankpins of the crankshaft
11/21/2000US6149431 Dental curet and sharpening machine system
11/16/2000WO2000067958A1 Grinding workbench that can be subjected to suction
11/16/2000DE19922495A1 Endface edge machining device for circular cylindrical workpieces, with transporting device in form of drum with longitudinal grooves for workpieces
11/16/2000DE19920467A1 Grinding machine with grinding machine bed, presenting carriage and grinding table has rotary tool holder to enable hard turning removably mounted on pivotable spindle rod
11/15/2000EP1052056A2 Grinding machine tool
11/14/2000US6146254 Sander having two or more sander wheels
11/14/2000US6146250 Process for forming a semiconductor device
11/14/2000US6145849 Disk processing chuck
11/09/2000WO2000066903A2 Method and apparatus for grinding rotors for hydraulic motors and apparatus therefor
11/09/2000WO2000066323A1 Rough-grinding and finish-grinding a crankshaft in a clamping
11/09/2000DE19921239A1 Absaugbare Schleifwerkbank Vacuumable grinding Bank
11/09/2000DE19919893A1 Vor- und Fertigschleifen einer Kurbelwelle in einer Aufspannung Pre- and finish grinding a crankshaft in one set-up
11/09/2000DE19919318A1 Wide grinding machine has modular machine frame structure assembled from individual non-metal castings for direct vibration damping within machine frame mass
11/08/2000EP1050370A2 Grinding machine with a short stiffness loop between tool and workpiece
11/07/2000US6143127 Carrier head with a retaining ring for a chemical mechanical polishing system
11/07/2000US6142856 Sharpening device for dental instruments
11/07/2000US6142853 Method and apparatus for holding laser wafers during a fabrication process to minimize breakage
11/02/2000WO2000064632A1 Method and apparatus for controlling a workrest
11/02/2000EP1048408A2 Carrier head with a compressible film
11/02/2000EP1048404A2 Method and apparatus for optical polishing
11/02/2000EP1048403A2 Improvements in and relating to grinding machines
11/02/2000EP1048395A2 Machining tool device
11/02/2000EP0808231B1 Chemical-mechanical polishing using curved carriers
11/02/2000DE10020347A1 Grinding apparatus for shaping spherical objects e.g. of semiconductor material conveys objects in holes on endless belt past grinding belt
11/02/2000DE10013729A1 Grinding machine has detector for ultrasonic vibration of grinding fluid supplied in spindle route
11/01/2000CN1271639A Machine tool apparatus
10/2000
10/31/2000US6139412 Fixture for manufacturing precisely shaped parts
10/31/2000US6139408 Surface grinding machine and carrier used therefor
10/31/2000US6139405 Method of making a motor-vehicle brake-disk assembly