Patents for B24B 41 - Component parts of grinding machines or devices, such as frames, beds, carriages or headstocks (11,542)
04/2002
04/23/2002CA2083053C Method and machining apparatus for use especially in the sanding of items of wood in a sanding machine
04/18/2002WO2001064391A3 Planarization system with a wafer transfer corridor and multiple polishing modules
04/18/2002US20020045408 Abrasive machine for machining a surface of a cylindrical work piece
04/17/2002EP1197293A1 Polishing device and method
04/17/2002EP1197292A2 Substrate holding apparatus
04/17/2002CN1344597A Grinding device for use in tyre evener
04/17/2002CN1344596A Edge-grinding device of machine for processing edge of plate, especially glass plate
04/17/2002CN1082868C Grinding and polishing machine tool and method and apparatus for grinding and polishing disk using the same
04/16/2002US6371833 Backing film for chemical mechanical planarization (CMP) of a semiconductor wafer
04/11/2002WO2002011198A3 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures
04/11/2002US20020042246 Substrate holding apparatus
04/11/2002DE10049139A1 System for flood and spray water protection force transmission for transmitting of eccentric grinding movements on wet grinding medium which is moved in a cleaning scouring solution on surface to be processed
04/09/2002US6368189 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
04/09/2002US6368052 Spindle device having turbine rotor
04/09/2002US6368026 Spherical body transport apparatus
04/09/2002US6367529 Method of adhering wafers and wafer adhering device
04/04/2002WO2002026444A1 Wafer carrier for cmp system
04/04/2002WO2002026443A1 Arrangement for polishing disk-like objects
04/04/2002WO2002026441A1 Tool for applying resilient tape to chuck used for grinding or polishing wafers
04/04/2002WO2000066903A9 Method and apparatus for grinding rotors for hydraulic motors and apparatus therefor
04/04/2002US20020039879 Carrier head with flexible membranes to provide controllable pressure and loading area
04/04/2002DE10124739A1 Halbleiterwaferanordnung und Bearbeitungsvorrichtung mit Ansaugtischen zum Halten derselben Semiconductor wafer assembly and machining apparatus for holding the same Ansaugtischen
04/03/2002EP1193031A1 Arrangement for polishing disk-like objects
04/03/2002EP1100651B1 Grinding machine for edges of spectacles lenses
04/03/2002EP0939685B1 Bench for machining elongate objects such as strips of marble and the like
04/03/2002EP0918596B1 Method for the deburring of items, particularly items of metal, and use of the method
04/03/2002CN2484149Y Oscillating grinding head of polishing machine
04/02/2002US6364745 Mapping system for semiconductor wafer cassettes
03/2002
03/28/2002WO2002024410A1 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
03/28/2002WO2002024409A1 Polishing apparatus with electromagnetical attitude controller for the polishing pad carrier
03/28/2002US20020037693 Workpiece carrier retaining element
03/27/2002EP1190816A1 Apparatus for working the edges of glass plates
03/27/2002CN1081512C 具有单旋转主轴的机床 Single-spindle machine tool having a rotating
03/27/2002CN1081510C 改进的磨削和抛光机床 Improved grinding and polishing machine
03/27/2002CN1081509C Electric motor driven type on-line roll grinder, its control method and grinding method
03/26/2002US6361648 Wafer transfer station for a chemical mechanical polisher
03/26/2002US6361421 Belt grinder with pivotable grinding unit and opposite supporting tables at different working heights
03/26/2002US6361420 Method of chemical mechanical polishing with edge control
03/26/2002US6361419 Carrier head with controllable edge pressure
03/21/2002US20020034927 Edge grinding unit for edge working machines
03/21/2002US20020034921 Eyeglass lens processing system
03/21/2002US20020033230 Cold forming of thin walls into bowed out sections by reverse extrusion to form deep grooves; increase the "pull- out" resistance by increasing the "footprint" of the deformed sections; for attaching screws through walls or sheets
03/19/2002US6358132 Apparatus for grinding spherical objects
03/19/2002US6358129 Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members
03/19/2002US6358121 Carrier head with a flexible membrane and an edge load ring
03/19/2002US6358114 Method and apparatus for optical polishing
03/14/2002US20020031993 Receiving chuck for optical components for the purpose of precision-grinding and/or polishing
03/13/2002EP1032487B1 Diamond roller for ceramics, having abrasive with sloped side
03/13/2002EP0865342B1 Improvements in and relating to grinding machines
03/13/2002CN1080618C Crankshaft grinding process and device
03/12/2002US6354928 Polishing apparatus with carrier ring and carrier head employing like polarities
03/12/2002US6354927 Micro-adjustable wafer retaining apparatus
03/12/2002US6354926 Parallel alignment method and apparatus for chemical mechanical polishing
03/12/2002US6354907 Polishing apparatus including attitude controller for turntable and/or wafer carrier
03/12/2002CA2356495A1 Presser roll for surface planer
03/07/2002WO2001089763A3 Multilayer retaining ring for chemical mechanical polishing
03/07/2002DE10040952A1 Vorrichting zum reitstockseitigen Zentrieren und Spannen eines Werkstücks mit einemn kreiszylindrischen Ende Vorrichting the tailstock side centering and clamping a workpiece with einemn circular cylindrical end
03/06/2002CN1080164C Method and apparatus for optical polishing
03/06/2002CN1080163C Ophthalmic lens generating apparatus having vibration dampening structure
02/2002
02/28/2002WO2002016080A2 Substrate supporting carrier pad
02/28/2002WO2002016078A2 Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate
02/28/2002WO2002016076A1 Sheet peripheral edge grinder
02/28/2002US20020025769 Substrate supporting carrier pad
02/28/2002US20020025768 Device for the tailstock end centring and clamping of a workpiece with a circular-cylindrical end
02/28/2002US20020025766 Abrasive machine for machining a flange on a work piece
02/27/2002EP1182007A1 Carrier head with an elastic ring member
02/27/2002EP1181132A1 Rough-grinding and finish-grinding a crankshaft in a clamping
02/27/2002EP0868257B1 Improvements in or relating to drill bit sharpening
02/27/2002CN1079718C Grinding machine
02/26/2002US6350188 Drive system for a carrier head support structure
02/26/2002US6350187 Abrasive machine
02/26/2002US6350177 Combined CMP and wafer cleaning apparatus and associated methods
02/21/2002US20020020540 Electric power tool
02/21/2002US20020020495 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
02/21/2002DE10055965C1 Workpiece transport device for double-sided grinding machine involves two pivot arms for moving flat workpieces in machine work area with rotatingly driven workpiece accommodation located on arms
02/19/2002US6347975 Apparatus and method for processing thin-film magnetic head material
02/14/2002US20020019203 Polishing machine for wheel rims and the like
02/13/2002EP1069971B1 Installation for forming the edges of spectacle glasses
02/13/2002CN1335799A A polishing machine and method
02/12/2002US6346037 Wafer polishing machine
02/12/2002US6346036 Multi-pad apparatus for chemical mechanical planarization
02/12/2002US6346033 Method for polishing disk shaped workpieces and device for carrying out the method
02/07/2002WO2002011198A2 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures
02/07/2002WO2002009906A1 Apparatus and method for chemical mechanical polishing of substrates
02/07/2002WO2001074536A3 Carrier head providing uniform upward and downward force on a wafer
02/07/2002WO2001074534A3 A workpiece carrier with adjustable pressure zones and barriers
02/07/2002US20020016135 Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers
02/07/2002US20020016133 Flat surface grinding machine with a second wheelhead for machining broaches
02/07/2002US20020013989 Milling, drilling and grinding machine
02/07/2002DE10035977A1 Verfahren und Vorrichtung zur Bearbeitung von Werkstück-Oberflächen Method and apparatus for machining workpiece surfaces
02/07/2002DE10035718A1 Werkzeugmaschine Machine tool
02/06/2002EP1177856A2 Flat surface grinding machine with a second wheelhead for machining broaches
02/06/2002EP0981419B1 Grinding or like machine tool
02/06/2002EP0879114A4 Motorized spindle with indexing fixture
02/06/2002CN1334175A Flat edge trimmer adapted for machine of working flat plate, especially glass sheet
02/06/2002CN1078836C Polishing apparatus
02/05/2002US6344414 Chemical-mechanical polishing system having a bi-material wafer backing film assembly
02/05/2002US6343980 Flattening machine
02/05/2002US6343979 Modular machine for polishing and planing substrates
02/05/2002US6343975 Chemical-mechanical polishing apparatus with circular motion pads
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